Robot for Semiconductor

GTCR5280 (For 300mm wafer)5-Axis Horizontal and Multi-Joint Type Clean Robot

Product Video

Usage Environment/Specifications

Product Profile

Model Name	GTCR5280
Environment	Clean room atmosphere
Arm	Single arm
Operating Range	553mm (3rd joint center)
Vertical Stroke	300mm
Payload Capacity	Below 4kg (calculated for the arm 3rd joint)

List of Product Model

Product Model		Vertical Stroke
Standard	GTCR5280-300-AM	300mm

The image above and the video are of GTCR5280-300-AM.

Characteristics

A twin end-effector mounted on its single-arm has the same function as a twin-arm robot.
Designed for handling 300mm wafers in a production line or inspection line of semiconductor.
Execution of origin search is not required by using the servo motors with absolute encoders.

3 FOUP access is available without a track.
Twin end-effector reduces the wafer swap time.
Base or flange mounting type is selectable.
Motion monitoring is available.
RS232C and parallel photo I/O are standard for control.
AC servo motors with absolute encoders installed in all axes.
High-speed, high-accuracy wafer handling by S-curved speed control and optimizing pass control.
Wafer holding: end-effector with vacuum suction, passive edge, edge grip, or Bernoulli type End-effector.
End-effector material: CFRP, Al, ceramic, or others.
Optimal end-effector is selectable according to the carrying object and line layout.

Standard Specifications

Example of standard specifications with JEL standard end-effector (vacuum type)
Specifications of Robot
Robot Model	GTCR5280-300-AM
Carrying Object	Up to 300mm silicon wafer
Wafer Holding Method	By vacuum suction
Robot Model Type	Horizontal and multi-joint type	Control Axis	5-axis
Motor Type	AC servo motor
Operating Range	From the robot center to the wafer center	Rotation Angle (Theta-axis)	Vertical Stroke (Z-axis)
Operating Range	953mm	335deg	300mm
Carrying Speed	Arm (R-axis)	Rotation Angle (Theta-axis)	Vertical Stroke (Z-axis)
Carrying Speed	833mm/sec	250deg/sec	300mm/sec
Repeatability	Within ±0.1mm
Cleanliness	ISO Class 2 (at wafer transfer level when exhausting driving part)
Utility	Power: AC200V Single phase ±10% 2kVA; Vacuum: -53kPa or more
Mass	Approx. 50kg
Specifications of Controller
Controller Model	C5000S series
Interface	RS232C and parallel photo I/O

Outline Drawing (Standard)

Option

End-Effector

Model Name	Size of Carrying Object	End-effector Type (Thickness)	Wafer Holding Method
SC-IW-200	3 inch, 100mm to 200mm	I-shape (2mm)	Vacuum suction
SC-IW-240	3 inch, 100mm to 300mm	I-shape (2mm)	Vacuum suction
SC-YW-200	100mm to 200mm	Y-shape (2mm)	Vacuum suction
SC-YW-227	100mm to 300mm	Y-shape (2mm)	Vacuum suction
SC-YW-240	100mm to 300mm	Y-shape (2mm)	Vacuum suction
3D-02229	150mm～300mm	Y-shape (2mm)	Vacuum suction
SC3-YW-240	300mm	Y-shape (3mm)	Vacuum suction
3D-01661	300mm	Y-shape (3mm)	Vacuum suction
SC3-IW-240	300mm	I-shape (3mm)	Vacuum suction

*The table above shows the specifications of JEL standard end-effectors. The other specifications are available.
*Click the items below to review the end-effectors other than JEL standard types.

Other Option

Product Lineup

Icon guide

...Atmosphere
...Vacuum
...Waterproof
...Single end-effector
...Twin end-effector
...Thin wafer
...CE marking
...JEL's standard spec.
...KCs marking