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3D-02229Vacuum Type End-Effector

3D-02229

Usage Environment/Specifications


Product Profile

Model Name3D-02229
Carrying Size150 to 300mm
Carrying ObjectMainly silicon wafer

Characteristics

Y-shaped vacuum suction type end-effector, suitable for handling wafer from 150 to 300mm (Random access is available).
Used extensively for atmospheric robot, the end-effector holds the backside of wafer by vacuum suction (negative pressure).
Conductive Teflon coating on the surface of end-effector protects against damage from charging.


Standard Specifications

Carrying Object SEMI standard 150 to 300mm (Mainly silicon wafer)
Material High purity alumina ceramic sintered body
Surface Treatment Conductive Teflon coating
Wafer Holding Method Vacuum suction
Total Length 242mm
Thickness 2mm

Please contact us for the detailed specifications.

Outline Drawing (Standard)
3D-02229

Product Lineup


Icon guide
  • ...Atmosphere
  • ...Vacuum
  • ...Waterproof
  • ...Single arm
  • ...Twin arm
  • ...Thin wafer
  • ...CE marking
  • ...JEL's standard spec.
  • ...KCs marking