JEL-Leading Manufacturer of Clean Robot

Robot for Semiconductor

STCR4160SN (For thin wafer or wafer-edge hold)4-Axis Cylindrical Coordinate Clean Robot

STCR4160SN (For thin wafer or wafer-edge hold)

Product Video

Usage Environment/Specifications

Product Profile

Model NameSTCR4160SN
EnvironmentClean room atmosphere
ArmTwin arm
Operating Range475mm (3rd joint center)
Vertical Stroke200mm / 300mm / 400mm / 450mm / 500mm
Payload Capacity3kg (calculated for the arm 3rd joint)

List of Product Model

Product ModelVertical Stroke
STCR4160SN-200-PM200mm
STCR4160SN-300-PM300mm
STCR4160SN-400-PM400mm
STCR4160SN-450-PM450mm
STCR4160SN-500-PM500mm
  • The image above and the video are of STCR4160SN-300-PM.

Characteristics

For handling thin wafer or wafer-edge hold with low-cost, high-speed handling, and no step-out error

  • High reliability: Stepping motor installed, but no step-out by JEL unique control.
  • High rigidity: payload capacity of 3kg (calculated for the arm 3rd joint/including wrist-block, end-effector and wafer)
  • Base or flange mounting type is selectable.

Standard Specifications

Specifications: upper end-effector with JEL end-effector by vacuum suction (wafer edge); lower end-effector with JEL Bernoulli End-effector for thin wafer
Specifications of Robot
Robot Model STCR4160SN-300-PM
Wrist-Brock SART09362 End-Effector Upper end-effector: 3D-09371
Lower end-effector: 3D-09370
Carrying Object Up to 300mm silicon wafer
Wafer Holding Method Upper end-effector: By vacuum suction (wafer edge)
Lower end-effector: By Cyclone pad suction and friction generated by friction rubber (Various materials are available for contact parts.)
Robot Model Type Cylindrical coordinate type Control Axis 4-axis
Motor Type 2-phase pulse motors installed in all axes.
Operating Range From the robot center to the wafer center Rotation Angle (Theta-axis) Vertical Stroke (Z-axis)
625mm 340deg 300mm
Carrying Speed (Ave.) Arm (R-axis) Rotation Angle (Theta-axis) Vertical Stroke (Z-axis)
400mm/sec 180deg/sec 200mm/sec
Carrying Speed (Max.) Arm (R-axis) Rotation Angle (Theta-axis) Vertical Stroke (Z-axis)
800mm/sec 220deg/sec 250mm/sec
Repeatability Within ±0.1mm
Cleanliness ISO Class 2 (at wafer transfer level when exhausting driving part)
Utility Power: DC24V±10% 16A  
Clean air: 60 SLM or more, 0.1 to 0.3 MPa  Vacuum: -53kPa or more
Mass Approx. 30kg (Robot)
Specifications of Controller
Controller Model C4000 series
Interface RS232C and parallel photo I/O
Outline Drawing (Standard)
STCR4160SN (For thin wafer or wafer-edge hold)

Option

Other Option

Product Lineup

Icon guide
  • ...Atmosphere
  • ...Vacuum
  • ...Waterproof
  • ...Single arm
  • ...Twin arm
  • ...Thin wafer
  • ...CE marking
  • ...JEL's standard spec.
  • ...KCs marking