System
SSY-10000 (Table-top loader system for 100mm wafer)Wafer Transfer System
Product Video |
Usage Environment/SpecificationsProduct Profile
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Characteristics
For various types of wafers; 2, 3 inch, 100mm glass, sapphire, SiC, or GaN or others.
Customization is available.
- Compact system integrating wafer inspection stage into wafer handling system.
- Long stroke of 190mm X-axis and 200mm Y-axis. Wafer stage position can be manually adjusted with a handle.
- Twin end-effector reduces the wafer swap time.
- Low-cost & high-performance system combining robot and passive type alignment stage.
Standard Specifications
Carrying Object | Up to 100mm wafer (glass, sapphire, SiC, or GaN or others) | ||
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Operating Range | From the robot center to the wafer center | Rotation Angle (Theta-axis) | Vertical Stroke (Z-axis) |
225mm | 360deg | 150mm | |
Carrying Speed (Ave.) |
Arm (R-axis) | Rotation Angle (Theta-axis) | Vertical Stroke (Z-axis) |
225mm/sec | 500deg/sec | 200mm/sec | |
Carrying Speed (Max.) |
Arm (R-axis) | Rotation Angle (Theta-axis) | Vertical Stroke (Z-axis) |
300mm/sec | 700deg/sec | 300mm/sec | |
Wafer Holding Method | By vacuum suction | ||
Repeatability | Within ±0.1mm | ||
Cleanliness | ISO Class 2 (at wafer transfer level when exhausting driving part) | ||
Mass | Approx. 15kg (Robot) | ||
Utility | Power: AC100V±10% 0.2kVA Vacuum: -53kPa or more |
Outline Drawing (Standard) |
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Option
Other Option
Icon guide
- ...Atmosphere
- ...Vacuum
- ...Waterproof
- ...Single arm
- ...Twin arm
- ...Thin wafer
- ...CE marking
- ...JEL's standard spec.
- ...KCs marking