Aligner
SAL20C1 (Edge-grip type)Wafer Aligner
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Usage Environment/SpecificationsProduct Profile
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Characteristics
Designed for aligning wafers in a production line or inspection line of semiconductor.
Edge grip type aligner minimizes the wafer contact.
- High-speed, high-accuracy centering and notch locating by the edge-grip function.
- Designed to reduce the contamination.
- RS232C and parallel photo I/O are standard for control.
Standard Specifications
| Carrying Object | SEMI standard 300 mm silicon wafer |
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| Positioning Accuracy | Centering: Within ±0.3 mm Notch locating: Within ±0.3 deg |
| Positioning Time | Notch search: 2.5 sec (Notch search only) |
| Sensor | Transmissive LED sensor |
| Cleanliness | 0.1 µm/cf Class 1 (at wafer transfer level when exhausting driving part) |
| Driving method | 2-phase stepping motor (for 2 axes)(internal motor driver) |
| Utility | Power: DC24V±10% 2A |
| Outline Drawing |
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Icon guide
- ...Atmosphere
- ...Vacuum
- ...Waterproof
- ...Thin wafer
- ...CE marking
- ...JEL's standard spec.
- ...KCs marking