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Porous End-Effector

Usage Environment/Specifications

Product Profile

Model Name	Porous End-Effector
Carrying Size	300mm

Characteristics

Suitable for handling warped wafer or thin wafer that cannot be held properly with the standard vacuum suction type end-effector.

High purity alumina ceramic sintered body is used for the main body of end-effector, and porous ceramic is used for the wafer suction surface.
Compared with end-effectors that suction wafer by digging a ditch on the suction surface by approximately 1.5mm, the average micropore diameter of 20 µm can disperse suction pressure centering around the ditch. With this, Porous end-effector can hold thin wafer without deformation.
Particle size of mesh is selectable from Grade＃100, ＃220, to ＃400.
Conductive Teflon coating is available for suction surface.

Standard Specifications

Material	High purity alumina ceramic sintered body
Material of Suction Surface	Porous ceramic
Wafer Holding Method	Vacuum suction
Thickness	3mm
Particle Size of Mesh	44 to 74µm（Grade#220）
Average Micropore Diameter	20µm（Grade#220）

Product Lineup

Icon guide

...Atmosphere
...Vacuum
...Waterproof
...Single arm
...Twin arm
...Thin wafer
...CE marking
...JEL's standard spec.
...KCs marking