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Passive-edge Holding Type End-Effector
Usage Environment/SpecificationsProduct Profile
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Characteristics
Suitable for handling warped wafer or thin wafer that cannot be held properly with the standard vacuum suction type end-effector.
Designed for handling wafer that can be contacted with the backside of the wafer edge or edge part.
Under the wafer's own weight, tapered guide is used to hold wafer (passive grip).
- Reasonably priced end-effector for handling contact-limited wafer with wafer edge
- Check the wafer presence with substrate existence sensor in atmospheric condition (option)
Specifications
Material | End-effector: Ceramic, Al, CFRP |
---|---|
Surface Treatment | Conductive Teflon coating |
Contact us for the detailed specifications.
Icon guide
- ...Atmosphere
- ...Vacuum
- ...Waterproof
- ...Single arm
- ...Twin arm
- ...Thin wafer
- ...CE marking
- ...JEL's standard spec.
- ...KCs marking