Robot for Semiconductor

MCR3160C3-Axis Cylindrical Coordinate Clean Robot

Usage Environment/Specifications

Product Profile

Model Name	MCR3160C
Environment	Clean room atmosphere
Arm	Single arm
Operating Range	400mm (3rd joint center)
Vertical Stroke	300mm / 400mm / 500mm
Payload Capacity	4kg (calculated for the arm 3rd joint)

List of Product Model

Product Model		Vertical Stroke
Standard	MCR3160C-300-AM	300mm
	MCR3160C-400-AM	400mm
	MCR3160C-500-AM	500mm

The image above is of MCR3160C-300-AM.

Characteristics

Designed for handling 300mm wafers in a production line or inspection line of semiconductor.
High-speed handling by AC servo motor and superior cost performance compared to MHR type.
Execution of origin search is not required by using the servo motors with absolute encoders.

Base or flange mounting type is selectable.
Motion monitoring is available.
RS232C and parallel photo I/O are standard for control.
AC servo motors with absolute encoders installed in all axes.
High-speed, high-accuracy wafer handlingby S-curved speed control.
Wafer holding: end-effector with vacuum suction, passive edge, edge grip, or Bernoulli type End-effector.
End-effector material: CFRP, Al, ceramic, or others.
Optimal end-effector is selectable according to the carrying object and line layout.

Standard Specifications

Example of standard specifications with JEL standard end-effector (vacuum type)
Specifications of Robot
Robot Model	MCR3160C-300-AM
Carrying Object	Wafer up to 300mm
Wafer Holding Method	By vacuum suction
Robot Model Type	Cylindrical coordinate type	Control Axis	3-axis
Motor Type	AC servo motor
Operating Range	From the robot center to the wafer center	Rotation Angle (Theta-axis)	Vertical Stroke (Z-axis)
Operating Range	567.7mm	340deg	300mm
Carrying Speed(Ave.)	Arm (R-axis)	Rotation Angle (Theta-axis)	Vertical Stroke (Z-axis)
Carrying Speed(Ave.)	1000mm/sec	360deg/sec	350mm/sec
Carrying Speed (Max.)	Arm (R-axis)	Rotation Angle (Theta-axis)	Vertical Stroke (Z-axis)
Carrying Speed (Max.)	1800mm/sec	580deg/sec	530mm/sec
Resolution	Arm (R-axis)	Rotation Angle (Theta-axis)	Vertical Stroke (Z-axis)
Resolution	Below 9.82µm	0.0015deg	1.96µm
Handling level	639mm (Base mounting level to end-effector level)
Repeatability	Within ±0.1mm
Cleanliness	ISO Class 2 (at wafer transfer level when exhausting driving part)
Utility	Power: AC200V single phase ±10% 3kVA; Vacuum: -53kPa or more
Specifications of Controller
Controller Model	C5000S series
Interface	RS232C and parallel photo I/O

Outline Drawing (Standard)

Option

End-Effector

*Click the items below to review the end-effectors other than JEL standard types.

Other Option

Product Lineup

Icon guide

...Atmosphere
...Vacuum
...Waterproof
...Single arm
...Twin arm
...Thin wafer
...CE marking
...JEL's standard spec.
...KCs marking