Robot for Semiconductor

GCR4280 (For large diameter wafer)4-Axis Horizontal and Multi-Joint Type Clean Robot

Product Video

Usage Environment/Specifications

Product Profile

Model Name	GCR4280
Environment	Clean room atmosphere
Arm	Single arm
Operating Range	553mm (3rd joint center)
Vertical Stroke	300mm / 420mm
Payload Capacity	Below 4kg (calculated for the arm 3rd joint)

List of Product Model

Product Model		Vertical Stroke
Standard	GCR4280-300-AM	300mm
	GCR4280-420-AM	420mm

The image above and the video are of GCR4280-300-AM.

Characteristics

Designed for handling large diameter wafer in a production line or inspection line of semiconductor.
Execution of origin search is not required by using the servo motors with absolute encoders.

3 FOUP access is available for robot only (for 300mm wafer). 2 FOUP access is available without a track for 450mm wafer.
Base or flange mounting type is selectable.
Motion monitoring is available.
AC servo motors with absolute encoders installed in all axes.
High-speed, high-accuracy wafer handling by S-curved speed control and optimizing pass control.
Wafer holding: end-effector with vacuum suction, passive edge, or edge grip.
End-effector material: CFRP, Al, ceramic, or others.
Optimal end-effector is selectable according to the carrying object and line layout.

Standard Specifications

Example of standard specifications with JEL standard end-effector (vacuum type) for 300mm wafer.
Specifications of Robot
Robot Model	GCR4280-300-AM
Carrying Object	SEMI standard up to 450mm silicon wafer, small glass substrate
Wafer Holding Method	By vacuum suction
Robot Model Type	Horizontal and multi-joint type	Control Axis	4-axis
Motor Type	AC servo motor
Operating Range	From the robot center to the wafer center	Rotation Angle (Theta-axis)	Vertical Stroke (Z-axis)
Operating Range	863mm	335deg	300mm
Carrying Speed (Ave.)	Arm (R-axis)	Rotation Angle (Theta-axis)	Vertical Stroke (Z-axis)
Carrying Speed (Ave.)	900mm	250deg/sec	300mm/sec
Carrying Speed (Max.)	Arm (R-axis)	Rotation Angle (Theta-axis)	Vertical Stroke (Z-axis)
Carrying Speed (Max.)	1300mm	350deg/sec	450mm/sec
Resolution	Arm (R-axis)	Rotation Angle (Theta-axis)	Vertical Stroke (Z-axis)
Resolution	0.0018deg	0.0015deg	1.96µm
Handling level	669mm (Base mounting level to end-effector level)
Cleanliness	ISO Class 2 (at wafer transfer level when exhausting driving part)
Repeatability	Within ±0.1mm
Utility	Power: AC200V single phase ±10% 2kVA; Vacuum: -53kPa or more
Specifications of Controller
Controller Model	C5000S series
Interface	RS232C and parallel photo I/O

Outline Drawing (Standard)

Option

End-Effector

*Click the items below to review the end-effectors other than JEL standard types.

Other Option

Product Lineup

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Contact Information

Icon guide

...Atmosphere
...Vacuum
...Waterproof
...Single arm
...Twin arm
...Thin wafer
...CE marking
...JEL's standard spec.
...KCs marking