Others

• Low cost end-effector for thin or warped wafers using the Bernoulli principle
• Available for any types of JEL atmospheric robots
• Suitable design solutions with evaluation using sample wafers based on customer's request about the wafer conditions
• Avoid displacement by the guide at the edges during operation
• Wafers are lifted without contacting end-effector except the edges
• One size of wafer per one end-effector
• Suitable for thin wafers as the Bernoulli end-effector applies pressure to wider area of wafer compared to the vacuum suction type end-effector
• Useful for the wafers which cannot be contacted for both sides

Please contact us for the detailed specifications.