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Bernoulli Type End-Effector (Contact type)
Product Video |
Usage Environment/SpecificationsProduct Profile
Mechanism of Bernoulli End-Effector (Contact type) |
Characteristics
- Low cost end-effector for thin or warped wafers using the Bernoulli principle
- Available for any types of JEL atmospheric robots
- Suitable design solutions with evaluation using sample wafers based on customer's request about the wafer conditions
- Wafer holding by the friction rubber to avoid displacement during operation
- Capable of handling different size of wafers with one end-effector (*Depending on the wafer size)
Thinner than the non-contact type Bernoulli end-effector - Suitable for thin wafers as the Bernoulli end-effector applies pressure to wider area of wafer compared to the vacuum suction type end-effector
Standard Specifications
Material | Aluminum |
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Surface treatment | Black alumite |
Wafer holding | By the Bernoulli’s principle using Cyclone pad and friction rubber (H-NBR) Various materials available for the contact area |
Utility | 30 to 80 L/min (Varies depending on the wafer condition) |
Please contact us for the detailed specifications.