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Edge-grip Type End-Effector

Product Video

Usage Environment/Specifications

Product Profile

Model Name	Edge-grip Type End-Effector
Carrying Size	Various sizes are available.
Carrying Size	Contact us for the detailed specifications.

The image above and the video are of edge-grip type end-effector.

Characteristics

End-effector for handling backside-treated wafer when backside of wafer is inaccessible.
Suitable for handling to the drop-in type stage as centering of wafer during operation is available.
Air cylinder moves guide back and forth to hold the front-back side of wafer.

Holding wafer edge without contacting the backside of wafer
Wafer centering is available by holding wafer edge
High speed handling is available
Guide can check the wafer presence during operation

Specifications

Material	End-effector: Ceramic, Al, CFRP
Material	Contact part with wafer: PEEK
Surface Treatment	Conductive Teflon coating
Utility	Air：Air cylinder drive 0.09 MPa or more（Varies depending on the specifications）

Product Lineup

Icon guide

...Atmosphere
...Vacuum
...Waterproof
...Single arm
...Twin arm
...Thin wafer
...CE marking
...JEL's standard spec.
...KCs marking