../support/man001/w000.html	und	1710469104	4665	https://www.jel-robot.com/support/man001/w000.html	Online Support | Wafer-Search Operation Procedure and Troubleshooting | Prepare the necessary equipment for wafer-search	Online Support | Wafer-Search Operation Procedure and Troubleshooting | Prepare the necessary equipment for wafer-search Home  >  Online Support  >  Manuals/Troubleshooting  >  Wafer-Search Operation Procedure and Troubleshooting  >  Prepare the necessary equipment for wafer-search Wafer-Search Operation Procedure Prepare the necessary equipment for wafer-search Necessary equipment: Instruction manual of robot Personal computer RS232C serial communication cable Teaching box Cassettes and wafers as many as the number of cassette slots Place wafers to all the slots in the cassette and set them to the position where wafer-search is started. Next, set the parameters necessary for wafer-search. Set them as the following procedures. Contents Next  Technical Information necessary equipment for wafer-search
../support/man001/w003.html	und	1710469105	5013	https://www.jel-robot.com/support/man001/w003.html	Online Support | 3: Setting of the number of cassette slots (WFC setting)	Online Support | 3: Setting of the number of cassette slots (WFC setting) Home  >  Online Support  >  Manuals/Troubleshooting  >  Wafer-Search Operation Procedure and Troubleshooting  >  3: Setting of the number of cassette slots (WFC setting) Wafer-Search Operation Procedure 3: Setting of the number of cassette slots (WFC setting) Set the number of cassette slots to be used. Set the number of cassette slots via serial communication. Input the following commands for configuration: (When the robot is $1, the commands are: $1WFC ****)  Input the Z-axis value displayed in the teaching box in "DEC". Obtain the current designated data Data to be set Contents Back Next  Technical Information cassette
../news/event2009_02.html	und	1710468632	4980	https://www.jel-robot.com/news/event2009_02.html	News | Semicon Japan 2009	News | Semicon Japan 2009 Home  >  News  >  Event News  >  Semicon Japan 2009 Semicon Japan 2009 Thank you for coming Semicon Japan 2009. We exhibited our new products. For more product information, please go to the products page or contact us. Dates: DEC.2(Wed) - 4(Fri),2009 Venue: Makuhari Messe, Chiba Japan JEL Booth No.: 4 Hall, 4A-501 Products for Exhibition MTCR4160-300-AM 4-Axis cylindrical coordinate type tape frame handling robot (for LED). SCR3100S-200-PM & SAL2241 3-Axis cylindrical coordinate type clean robot and Edge-grip type aligner for 2 - 4inch wafers. SAL38C2 Vacuum-grip type aligner for 200 - 300mm wafers. GCR4280-420-AM 4-Axis horizontal and multi-joint type clean robot for 450mm wafer Event Listings News Top MTCR4160-300-AM SCR3100S-200-PM & SAL2241 SAL38C2 GCR4280-420-AM
../news/event2015_06.html	und	1710468641	5953	https://www.jel-robot.com/news/event2015_06.html	News | SEMICON Taiwan 2015	News | SEMICON Taiwan 2015 Home  >  News  >  Event News  >  SEMICON Taiwan 2015 SEMICON Taiwan 2015 Thank you very much for coming to our exhibition booth at SEMICON Taiwan 2015 during September 2-4. For more information on our products as well as the exhibited products below, please go to the product page or contact us. Date: September 2-4, 2015 Venue: TWTC Nangang Exhibition Hall, Taiwan Booth: 4F M456 Products for Exhibition Automatic wafer transfer system for wafer container High accuracy handling of thin wafer inside the wafer container. Event Listings News Top SEMICON Taiwan 2015 banner 繝悶繧ケ繧、繝。繝シ繧ク Wafer transfer system for wafer container
../products/MTCR4200.html	und	1710468958	15370	https://www.jel-robot.com/products/MTCR4200.html	Products | MTCR4200 | Wafer Transfer Atmospheric Robot	Products | MTCR4200 | Wafer Transfer Atmospheric Robot Home 縲� Products 縲� 縲� Robot for Semiconductor MTCR4200 4-Axis Cylindrical Coordinate Clean Robot Product Video Usage Environment/Specifications Product Profile Model Name MTCR4200 Environment Clean room atmosphere Arm Twin arm Vertical Stroke 300mm / 400mm / 500mm List of Product Model Product Model Vertical Stroke Standard MTCR4200-300-AM 300mm   MTCR4200-400-AM 400mm   MTCR4200-500-AM 500mm The image above and the video are of MTCR4160-300-AM. Characteristics Designed for handling wafers in a production line or inspection line of semiconductor. High-speed handling by AC servo motor and superior cost performance compared to MTHR type. Execution of origin search is not required by using the servo motors with absolute encoders. Twin-arm reduces the wafer swap time. Base or flange mounting type is selectable. Motion monitoring is available. RS232C and parallel photo I/O are standard for control. AC servo motor installed in all axes. High-speed, high-accuracy wafer handlingby S-curved speed control. Wafer holding: end-effector with vacuum suction, passive edge, edge grip, or Bernoulli type End-effector. End-effector material: CFRP, Al, ceramic, or others. Optimal end-effector is selectable according to the carrying object and line layout. Standard Specifications Please contact us for the detailed specifications. Outline Drawing (Standard) Option End-Effector Model Name Size of Carrying Object End-effector Type (Thickness) Wafer Holding Method SC-IW-200 3 inch, 100mm to 200mm I-shape (2mm) Vacuum suction SC-IW-240 3 inch, 100mm to 300mm I-shape (2mm) Vacuum suction SC-YW-200 100mm to 200mm Y-shape (2mm) Vacuum suction SC-YW-227 100mm to 300mm Y-shape (2mm) Vacuum suction SC-YW-240 100mm to 300mm Y-shape (2mm) Vacuum suction 3D-02229 150mm�300mm Y-shape (2mm) Vacuum suction SC3-YW-240 300mm Y-shape (3mm) Vacuum suction 3D-01661 300mm Y-shape (3mm) Vacuum suction SC3-IW-240 300mm I-shape (3mm) Vacuum suction *The table above shows the specifications of JEL standard end-effectors. The other specifications are available. *Click the items below to review the end-effectors other than JEL standard types. Other Option Product Lineup Menu Prev Next Icon guide ...Atmosphere ...Vacuum ...Waterproof ...Single arm ...Twin arm ...Thin wafer ...CE marking ...JEL's standard spec. ...KCs marking MTCR4160-300-AM MTCR4200-350-AM
../support/often-1.html	und	1710469074	4484	https://www.jel-robot.com/support/often-1.html	Online Support | Frequently Asked Question: How do I set up JELDATA3, a data transfer software?	Online Support | Frequently Asked Question: How do I set up JELDATA3, a data transfer software? Home  >  Online Support  >  Frequently Asked Question  >  Communication Software FAQ: Communication Software Q: How do I set up JELDATA3, a data transfer software? A: Select a robot type in accordance with model numbers of a robot and a controller. Choose a corresponding robot type from the list. If your robot type is not in a list, please tell us the serial number of the robot. We will contact you the corresponding robot type.  Click to see JELDATA3 Operation Manual .  List of FQA  Contact Us 
../products/SART08668.html	und	1710468964	10882	https://www.jel-robot.com/products/SART08668.html	Products | SART08668 (Wrist-block unit with mapping sensor)	Products | SART08668 (Wrist-block unit with mapping sensor) Home  >  Products  >  縲� Others SART08668 Wrist-block unit with mapping sensor Usage Environment/Specifications Product Profile Model Name SART08668 Appropriate robot model STCR series Characteristics Designed for checking the wafer state in cassette. Also available for sorter system. Wrist-block unit with mapping sensor (*) for STCR series Standard end-effectors (6 types) are available for this wrist-block (refer to the following table). (*) Mapping sensor is to detect wafer presence and status in each cassette slot. Standard end-effectors available for the wrist-block Click the product image or name below to go to the product page. SC-IW-200 SC-IW-240 SC3-IW-240 SC-YW-227 SC-YW-200 3D-02229 Standard Specifications Contact us for the detailed specifications. Product Lineup Menu Prev Next Icon guide ...Atmosphere ...Vacuum ...Waterproof ...Single arm ...Twin arm ...Thin wafer ...CE marking ...JEL's standard spec. ...KCs marking 
../support/stop.html	und	1710469079	5280	https://www.jel-robot.com/support/stop.html	Online Support | Discontinued Products	Online Support | Discontinued Products Home  >  Online Support  >  Notification  >  Discontinued Products Discontinued Products April 7, 2008 JEL would like to inform our supplier's announcement that they are stopping the manufacturing of AC servo motor and AC servo amplifier which JEL robots are equipped with. JEL maintenance service for these robots will be based on the following points. Intended Robots: Robots type which include "SM" such as "L***-**-SM" or "M***-**-SM" of which were produced before 2004. Other types of robots may be included. Please confirm the robot serial number and contact JEL for details. Maintenance Service: The maintenance service for the effected robots will be available until July 2011. Please note that our maintenance service might end before July 2011 depending on the usage condition and stock of spare parts. The order of the spare parts (AC servo motor and amplifier) is available until July 2008. Repeat Orders: The manufacturing of the robots mentioned above has already been discontinued. As a replacement, we offer a new type of robot that is equipped with a new type of AC servo motor and amplifier. Replacement of the Discontinued Parts For the discontinued parts, JEL will use a replacement. Please note that it is necessary to change some parts of a robot and controller, and the cables in-between. It is unacceptable to replace only the robot or the controller. They must be replaced together.If you have any questions, please confirm the serial number of the robot and controller, and contact us.  Technical Information 
../support/index.html	und	1710469073	5506	https://www.jel-robot.com/support/index.html	Online Support | Support TOP	Online Support | Support TOP Home  >  Online Support Online Support  Technical Information support key visual
../company/jelc.html	und	1725260254	6339	https://www.jel-robot.com/company/jelc.html	Company | JEL (Changzhou) Robotics Technology Co., Ltd.	Company | JEL (Changzhou) Robotics Technology Co., Ltd. Home  >  Company  >  JEL (Changzhou) Robotics Technology Co., Ltd. JEL (Changzhou) Robotics Technology Co., Ltd. We, JEL, established JEL (Changzhou) Robotics Technology Co., Ltd. in Changzhou City, Jiangsu Province, China, on Jun. 1, 2024. In Aug. 2024, 窶廚hangzhou factory窶�, equipped with a clean room, was completed as a manufacturing facility for wafer transfer robots for semiconductors in China. At Changzhou factory, we aim to start shipping products within the 2024 fiscal year, contributing to the manufacturing and stable supply of wafer transfer robots for semiconductors in China. Address Building 5, Changzhou Oriental Automotive Electronics Industrial Park, No. 1668, Dongguan Road, Lucheng Street, Wujin District, Changzhou City, Jiangsu Province 213025, China Tel +86-13021105268 (Mobile) President Chuanyilang Sun Map of JEL (Changzhou) Robotics Technology Co., Ltd. Company TOP JEL (Changzhou) Robotics Technology Co., Ltd. JEL (Changzhou) Robotics Technology Co., Ltd.
../support/often-8.html	und	1710469077	4411	https://www.jel-robot.com/support/often-8.html	Online Support | Frequently Asked Question :Error 08 occurs when the robot is moved up and down with the arm extended. Why?	Online Support | Frequently Asked Question :Error 08 occurs when the robot is moved up and down with the arm extended. Why? Home  >  Online Support  >  Frequently Asked Question  >  Error codes or operations Error codes or operations Q: Error 08 occurs when the robot is moved up and down with the arm extended. Why? A: When the arm is extended, the vertical movement amount is restricted by the setting. Check the operating range and change the setting of vertical movement amount in accordance with the Instruction Manual.  Click to see JELDATA3 Operation Manual .  List of FQA  Contact Us 
../news/news20190313.html	und	1710468664	3791	https://www.jel-robot.com/news/news20190313.html	News | Holiday Notice: Japanese Holiday Week, Golden Week Holidays of 2019	News | Holiday Notice: Japanese Holiday Week, Golden Week Holidays of 2019 Home  >  News  >  Holiday Notice Holiday Notice JEL will be closed from 27th of April to 6th of May for Japanese holiday week, "Golden Week Holidays". In case of emergency, please contact us at the following e-mail address: 
../products/prd_result5.html	und	1710468960	9717	https://www.jel-robot.com/products/prd_result5.html	Products | End-Effector	Products | End-Effector HOME  >  Products  >  End-Effector End-Effector Search for Category End-Effector Controller Wrist-Block Unit Teaching Box Others Data processing Click the product image or name to go to the product page. Product News 3D CAD Drawings Contact Us Technical Information Products Menu 
../news/news20130412.html	und	1710468657	4199	https://www.jel-robot.com/news/news20130412.html	News | Japanese Holiday Week Information	News | Japanese Holiday Week Information Home  >  News  >  Japanese Holiday Week Information Japanese Holiday Week Information JEL will be closed for Japanese holiday week, "Golden Week" Holidays; April 27th - April 29th (Japan Time) May 3rd - May 6th, 2013 (Japan Time) In case of emergency, please contact us at the following e-mail address: News Topics 2014 2013 2012 2011 Event News 2014 2013 2012 2011 2010 2009 2008 
../news/news20211122.html	und	1710468666	3717	https://www.jel-robot.com/news/news20211122.html	News | New Year's Holiday Information	News | New Year's Holiday Information Home  >  News  >  New Year's Holiday Information New Year's Holiday Information JEL will be closed for New Year's holiday from December 29th, 2021 to January 4th, 2022 (Japan Time). In case of emergency, please contact us at the following e-mail address: 
../news/news20150527.html	und	1710468659	4114	https://www.jel-robot.com/news/news20150527.html	News | Announcement of new President	News | Announcement of new President Home  >  News  >  Announcement of new President Announcement of new President We are pleased to announce that the new President has been appointed as follows: Nobuo Sakiya, the former Executive Director, became the new President. Haruo Sakiya, the former President, became the new Board Chairman. We would greatly appreciate it if we could have your continued support. 
../news/event2008.html	und	1710468631	4259	https://www.jel-robot.com/news/event2008.html	News | Event News 2008	News | Event News 2008 Home  >  News  >  Event News  >  2008 Event News 2008 Semicon Japan 2008 Wed., Dec. 3- Fri., Dec. 5, 2008 Main exhibition machine type Sorter System : New model Single-Arm Clean Robot and Aligner for 2-4inch wafer : New model Twin-Arm Clean Robot : New model Single-Arm, 4-Axis Horizontal and Multi-Joint Type Clean Robot : New model JEL challenge for 450mm / Single-Arm, 4-Axis Horizontal and Multi-Joint Type Clean Robot : New model Click here for details.   Kochi Mechatronics Forum Tue., Mar. 11, 2008 Event Listings News Top 
../news/event2023_04.html	und	1710468654	8107	https://www.jel-robot.com/news/event2023_04.html	News | SEMICON EUROPA 2023	News | SEMICON EUROPA 2023 Home  >  News  >  Event News  >  SEMICON EUROPA 2023 SEMICON EUROPA 2023 Thank you very much for coming to our exhibition booth at SEMICON EUROPA 2023. For more information on our products as well as the exhibited products below, please go to the product page or contact us . Date   November 14 to 17, 2023 Venue Messe München, Germany SEMICON EUROPA 2023 Products for Exhibition ■6 & 8 inch Twin-arm robot + pre-aligner(edge-grip) ■8 inch Twin-arm robot(with flip unit) + pre-aligner(Bernoulli type) Event Listings News Top SEMICON EUROPA 2023 banner Our booth at SEMICON EUROPA 2023
../news/event2011_06.html	und	1710468634	6554	https://www.jel-robot.com/news/event2011_06.html	News | Semicon Japan 2011	News | Semicon Japan 2011 Home  >  News  >  Event News  >  Semicon Japan 2011 Semicon Japan 2011 Thank you very much for coming to our exhibition booth at Semicon Japan 2011. For more information on our products as well as the exhibited products below, please go to the product page or contact us. Date: DEC. 7 (Wed)窶織EC. 9 (Fri) Venue: Makuhari Messe, Chiba Japan JEL booth No.5B-607, Hall 5 Products for Exhibition Loader/Unloader System for Batch Processing of Susceptors or Trays : SSY-10020 Developed automatic loader/unloader system for batch processing such as susceptors or trays. JEL has proposed the most suitable system according to your concept and layout. End-Effector for Thin or Warped Wafer Developed low-cost type end-effector to meet the request of many customers. JEL has proposed the most suitable shape of end-effector according to your concept and layout. Super Compact Clean Robot & Aligner for Handling 2 inch-Wafer : SSCR3090S-150-PM/SAL2241 The world's top-class smallest & lightweight design. One aligner can handle 2-4 inch-wafer alignment. Horizontal and Multi-Joint Type Clean Robot for Handling 450mm-Wafer : GTCR5280-420-AM Designed for handling 450mm-wafers in high speed. Increased handling speed by 20% compared to the conventional model, and achieved high throughput by twin end-effector. Cylindrical coordinate type clean robot for 300mm wafer : MTCR4160-300-AM Increased the speed of the AC servo type twin-arm robot, and achieved higher throughput. Miniaturized a controller by 65% compared to the conventional model. Table-top Loader System : SSY-10000 Resolved the problems and issues caused by manual handling of wafers, and improved product quality and yield ratio. Event Listings News Top Loader/Unloader System for Batch Processing of Susceptors or Trays:SSY-10020 End-Effector for Thin or Warped Wafer Super Compact Clean Robot & Aligner for Handling 2 inch-Wafer:SSCR3090S-150-PM/SAL2241 Horizontal and Multi-Joint Type Clean Robot for Handling 450mm-Wafer:GTCR5280-420-AM Cylindrical coordinate type clean robot for 300mm wafer:MTCR4160-300-AM Table-top Loader System:SSY-10000
../support/man001/w007.html	und	1710469106	6207	https://www.jel-robot.com/support/man001/w007.html	Online Support |7: Setting of the stop position of wafer-search completion (WEND setting)	Online Support |7: Setting of the stop position of wafer-search completion (WEND setting) Home  >  Online Support  >  Manuals/Troubleshooting  >  Wafer-Search Operation Procedure and Troubleshooting  >  7: Setting of the stop position of wafer-search completion (WEND setting) Wafer-Search Operation Procedure 7: Setting of the stop position of wafer-search completion (WEND setting) *WEND command may not be used depending on specifications Set the stop position of wafer-search completion. Set the stop position of wafer-search completion via serial communication. Input the following commands for configuration: (When the robot is $1, the commands are: $1WEND ****) Input the pulse number that is required to move to the stop position in "DEC". Obtain the current designated data Data to be set The stop position of wafer-search completion is the position where the robot stops at the position of 窶�2: Setting of the highest slot in the cassette (WHI setting)" + "Stop position of wafer-search completion" when wafer-search is completed. Example) 窶弩HI = 4000窶� setting: Given the 窶弩END = 100窶� setting, the stop position when wafer-search is completed is 4100. Note 1: When WEND value is too large, the robot may interfere with cassettes. Note 2: When WEND value is too small, it may fall within the range of 窶�6: Setting of the detection gate width of wafer (WWG setting)窶� and it may cause an error in wafer detection of the highest slot. Contents Back Next  Technical Information example setting WHI=4000 caution of setting
../products/SVCR3330S.html	und	1710468975	16408	https://www.jel-robot.com/products/SVCR3330S.html	Products | SVCR3330S (Handling susceptor/tray) | Wafer Transfer Atmospheric Robot	Products | SVCR3330S (Handling susceptor/tray) | Wafer Transfer Atmospheric Robot Home 縲� Products 縲� 縲� Robot for Semiconductor SVCR3330S (Handling susceptor/tray) 3-Axis Cylindrical Coordinate Clean Robot Product Video Usage Environment/Specifications Product Profile Model Name SVCR3330S Environment Vacuum (Temp. 15°C to 50°C) Driving unit咾lean room atmosphere  (Temp. 15°C to 40°C) Arm Single arm Operating Range 640mm (3rd joint center) Vertical Stroke 60mm Payload Capacity 10kg (calculated for the arm 3rd joint) List of Product Model Product Model Vertical Stroke SVCR3330S-060-PM 60mm The image above and the video are of SVCR3330S-060-PM. Characteristics Designed for handling susceptor tray up to 4kg with shuttle type twin end-effector in the vacuum chamber of production line and inspection line. Cost performance is superior compared to LVHR series. Magnetic fluid sealing is used for arm joint. Vacuum sealing: Magnetic fluid sealing and bellows are used. For cleanliness: 5µm mesh filter installed for exhaust ventilation in the arm. Motion monitoring is available. RS232C and parallel photo I/O are standard for control. 2-phase stepping motor installed in all axes. Servo motor type is available. High-speed, high-accuracy wafer handlingby S-curved speed control. Wafer holding: end-effector with passive edge or edge grip type End-effector. End-effector material: CFRP, Al, ceramic, or others. Optimal end-effector is selectable according to the carrying object and line layout. Standard Specifications Representative specifications of SVCR3330S-060-PM (stepping motor type) It can be changed depending on the carrying object and end-effector type. Specifications of Robot Robot Model SVCR3330S-060-PM Carrying Object 342mm tray x 2 (Representative example) Robot Model Type Cylindrical coordinate type Control Axis 3-axis Motor Type Stepping motor Operating Range From the robot center to the wafer center Rotation Angle (Theta-axis) Vertical Stroke (Z-axis) 1075mm 330deg 60mm Carrying Speed (Ave.) Arm (R-axis) Rotation Angle (Theta-axis) Vertical Stroke (Z-axis) 250mm/sec 90deg/sec 30mm/sec Carrying Speed (Max.) Arm (R-axis) Rotation Angle (Theta-axis) Vertical Stroke (Z-axis) 380mm/sec 135deg/sec 45mm/sec Resolution Arm (R-axis) Rotation Angle (Theta-axis) Vertical Stroke (Z-axis) Below 65µm 0.0056deg 2.777µm Handling level 188.5mm (Mounting level to end-effector level) Repeatability Within ±0.2mm Cleanliness Magnetic fluid sealing and filter Vacuum resistance 1.33×10 -6 Pa Utility Power: DC24V±10% 11A Specifications of Controller Controller Model C4000 series Interface RS232C and parallel photo I/O Outline Drawing (Standard) Option End-Effector *Click the items below to review the end-effectors other than JEL standard types. Other Option *The teaching box appeared in the table may be unavailable depending on the specifications. Product Lineup Menu Prev Next Icon guide ...Atmosphere ...Vacuum ...Waterproof ...Single arm ...Twin arm ...Thin wafer ...CE marking ...JEL's standard spec. ...KCs marking SVCR3330S-060-PM SVCR3330S-060-PM
../news/news20130314.html	und	1710468657	4184	https://www.jel-robot.com/news/news20130314.html	News | Temporary Closing Information	News | Temporary Closing Information Home  >  News  >  Temporary Closing Information Temporary Closing Information JEL will be closed for a company event on April 1st, 2013 (Japan Time). In case of emergency, please contact us at the following e-mail address: Thank you for your patience and cooperation in the matter. News Topics 2014 2013 2012 2011 Event News 2014 2013 2012 2011 2010 2009 2008 
../support/oftenorg180801.html	und	1710469078	19229	https://www.jel-robot.com/support/oftenorg180801.html	Online Support | Frequently Asked Question	Online Support | Frequently Asked Question Home  >  Online Support  >  Frequently Asked Question Frequently Asked Question Q: What do I need for a service request or inquiries regarding services? A: Check the serial number (6 to 8 digit number) first. In the case of error, please tell us the error code and the content of the error. Q: How do I find the serial number and error code? A: The serial number (6-to 8-digit number) is labeled or incised mainly on the lower part of connectors of robot/aligner, and the side of LED of controller. The error code is displayed on the controller LED. See where to find the serial No. See where to find the error code. Q: What is the maintenance and inspection cycle for robot? A: Although it varies depending on the robot models, users are recommended to have annual regular inspection by JEL. Please refer to the inspection manual included in the shipment. Q: Why is nothing displayed on the teaching box after connecting? A: Check the controller setting and status. Check if the select switch (R/T) of the controller is set to the T side. Disconnect the RS232C cable. Make sure the teaching box connector has not been come off. Please note that some controllers have the interlock function. Q: Why does not the controller display anything after turning on the power? A: Check if power supply is as specified in the specification. When EMG terminal is OPEN, the power will not be turned on. Please refer to the specification for the interlock and the power up procedures. Q: Why does the speed setting go back when restarting the power after changing the speed with the teaching box? A: When the input value for speed setting is out of range, you cannot change the setting. Data writing is required after speed setting. Please follow the procedure for EEPROM data writing. (See the instruction manual as the procedure varies depending on the models.) Q: Why does Error 08 occur when moving the robot up and down with the arm extended? A: The vertical movement with the arm extended is restricted with the setting. Check the operating range and change the setting of vertical movement according to the instruction manual. Q: How do I set up the communication software JELDATA3? A: Select the robot model for the software from the robot and controller type. Choose the corresponding robot model from the list. If your robot type is not in a list, please tell us your robot serial number. We will contact you the corresponding robot model. Q: Why is there no response from the controller with communication software? A: If other software is opened, close it. Check if the communication port of the computer is OPEN. Check if the opened port is available. Check if the communication cable specs are the same as those in the Control Specifications. Check if the select switch "0" is selected. Check if the teaching box is not displayed. Q: How do I backup the controller data? A: You can save data with the accompanying software JELDATA3 and the dedicated communication cable. Q: What is Body number? A: Body number is a recognition number to identify the corresponding controller to output commands when connecting several controllers. In standard setting, the body number of robot is set as 1 and aligner as 2.  Technical Information 
../products/STCR4160S.html	und	1710468971	25158	https://www.jel-robot.com/products/STCR4160S.html	Products | STCR4160S | Wafer Transfer Atmospheric Robot	Products | STCR4160S | Wafer Transfer Atmospheric Robot Home 縲� Products 縲� 縲� Robot for Semiconductor STCR4160S 4-Axis Cylindrical Coordinate Clean Robot Product Video Usage Environment/Specifications Product Profile Model Name STCR4160S Environment Clean room atmosphere Arm Twin arm Operating Range 315mm (3rd joint center) Vertical Stroke 200mm / 300mm / 400mm / 450mm / 500mm / 550mm / 600mm Payload Capacity Below 3kg (calculated for the arm 3rd joint) List of Product Model Product Model Vertical Stroke STCR4160S-200-PM 200mm STCR4160S-300-PM 300mm STCR4160S-400-PM 400mm STCR4160S-450-PM 450mm STCR4160S-500-PM 500mm STCR4160S-550-PM 550mm STCR4160S-600-PM 600mm The image above and the video are of STCR4160S-300-PM. Characteristics Designed for handling small wafers in a production line or inspection line of semiconductor. Certified CE marking. Arm lineup: 100mm, 130mm, 160mm, 200mm Twin-arm reduces the wafer swap time. Base or flange mounting type is selectable. Motion monitoring is available. RS232C and parallel photo I/O are standard for control. 2-phase stepping motor installed in all axes. High-speed, high-accuracy wafer handlingby S-curved speed control. Wafer holding: end-effector with vacuum suction, passive edge, edge grip type End-effector. End-effector material: CFRP, Al, ceramic, or others. Optimal end-effector is selectable according to the carrying object and line layout. Standard Specifications Example of standard specifications with JEL standard end-effector (vacuum type) Specifications of Robot Robot Model STCR4160S-300-PM Carrying Object Wafer up to 300mm Wafer Holding Method By vacuum suction Robot Model Type Cylindrical coordinate type Control Axis 4-axis Motor Type Stepping motor Operating Range From the robot center to the wafer center Rotation Angle (Theta-axis) Vertical Stroke (Z-axis) 575mm 340deg 300mm Carrying Speed (Ave.) Arm (R-axis) Rotation Angle (Theta-axis) Vertical Stroke (Z-axis) 570mm/sec 220deg/sec 200mm/sec Carrying Speed (Max.) Arm (R-axis) Rotation Angle (Theta-axis) Vertical Stroke (Z-axis) 1140mm/sec 270deg/sec 250mm/sec Resolution Arm (R-axis) Rotation Angle (Theta-axis) Vertical Stroke (Z-axis) Below 12.6µm 0.0045deg 6.25µm Handling level 620mm (Base mounting level to upper end-effector level) Repeatability Within ±0.1mm Cleanliness ISO Class 2 (at wafer transfer level when exhausting driving part) Utility Power: DC24V±10% 16A; Vacuum: -53kPa or more Mass Approx. 30kg Specifications of Controller Controller Model C4000 series Interface RS232C and parallel photo I/O Outline Drawing (Standard) *The outline drawing above does not have the mapping function. Outline Drawing (w/o mapping function) Outline Drawing (w/mapping function) Option Wrist-Block Unit Model Name Total Length Mapping Sensor Thickness of Attaching End-Effector SART08674 60mm   2mm SART08604 60mm   2mm SART08675 155mm   2mm SART08661 155mm Available 2mm SART08676 60mm   2mm SART08668 60mm Available 2mm *The table above shows the specifications of JEL standard wrist-block units. The other specifications are available. *Click the items below to review the wrist-block units other than JEL standard types. End-Effector Model Name Size of Carrying Object End-effector Type (Thickness) Wafer Holding Method SC-IW-200 3 inch, 100mm to 200mm I-shape (2mm) Vacuum suction SC-IW-240 3 inch, 100mm to 300mm I-shape (2mm) Vacuum suction SC-YW-200 100mm to 200mm Y-shape (2mm) Vacuum suction SC-YW-227 100mm to 300mm Y-shape (2mm) Vacuum suction SC-YW-240 100mm to 300mm Y-shape (2mm) Vacuum suction 3D-02229 150mm to 300mm Y-shape (2mm) Vacuum suction SC3-YW-240 300mm Y-shape (3mm) Vacuum suction 3D-01661 300mm Y-shape (3mm) Vacuum suction *The table above shows the specifications of JEL standard end-effectors. The other specifications are available. *Click the items below to review the end-effectors other than JEL standard types. Operating Range End-Effector/Wrist-Block Unit SART08674 SART08604 SART08675 SART08661 SART08676 SART08668 SC-IW-200 405mm 405mm 500mm 500mm 405mm 405mm SC-IW-240 445mm 445mm 540mm 540mm 445mm 445mm SC-YW-200 415mm 415mm 510mm 510mm 415mm 415mm SC-YW-227 442mm 442mm 537mm 537mm 442mm 442mm SC-YW-240 455mm 455mm 550mm 550mm 455mm 455mm 3D-02229 455mm 455mm 550mm 550mm 455mm 455mm SC3-YW-240 455mm 455mm 550mm 550mm 455mm 455mm 3D-01661 455mm 455mm 550mm 550mm 455mm 455mm *The operating range in the table that is specified by the combination of the wrist-block unit and end-effector is an example only. The other combinations are available. Other Option *The teaching box appeared in the table may be unavailable depending on the specifications. Product Lineup Menu Prev Next Icon guide ...Atmosphere ...Vacuum ...Waterproof ...Single arm ...Twin arm ...Thin wafer ...CE marking ...JEL's standard spec. ...KCs marking STCR4160S STCR4160S-300-PM
../company/download3.html	und	1710468468	5631	https://www.jel-robot.com/company/download3.html	Company | JEL E-Catalog & Website	Company | JEL E-Catalog & Website Home  >  Company  >  JEL E-Catalog & Website JEL E-Catalog & Website Click the button to view the company profile, product catalog, and website. Company TOP JEL E-Catalog JEL E-Catalog JEL Website JEL Website
../support/man002/s004.html	und	1710469130	6122	https://www.jel-robot.com/support/man002/s004.html	Online Support | JELDATA3 Operation Manual | Controller setup	Online Support | JELDATA3 Operation Manual | Controller setup Home  >  Online Support  >  Wafer-Search Operation Procedure and Troubleshooting  >  JELDATA3 Operation Manual 縲� 8. Setup JELDATA3 Operation Manual 8. Setup 8.1 Controller setup (Figure: 8-1) Controller setup window appears. ( Figure: 8-1 ) The controller setup of the designated robot (series) is automatically executed. This window appears also at the first start-up operation. 繝サSetup window for the standard robot. Select the robot series from the list and click the [Decide] button. * Click here to refer to 窶廰ist of the robot series窶� for the choice of the robot series. 繝サSetup window when the customized specification robots are included in the communicating robot. If the robot that executes communication is a standard type, select [Standard]. If the robot that executes communication is a customized specification robot, select [Custom]. 繝サWhen [Standard] is selected: Select the robot series from the list and click the [Decide] button. 繝サWhen [Custom] is selected: Select the robot series from the list and click the [Decide] button. (The figure above is an example of the list.) 繝サ[Decide] button Press the button to execute the controller setting. While executing, the progress is shown on the status bar.� Figure: 8-2 � * When [Controller setting] is completed, [Data format] is automatically executed. (Figure: 8-2) 繝サ[Cancel] button Return to the main window. Cancel cannot be executed at the first start-up. (There is no [Cancel] button indicated.) Contents 竊殖ack Next竊�  Technical Information controller setup setup window select the robot series select the communicationg robot select the robot series select the robot series status bar
../support/man002/m005-3.html	und	1710469128	6621	https://www.jel-robot.com/support/man002/m005-3.html	Online Support | Standard Data Copy Manual | Saving controller data	Online Support | Standard Data Copy Manual | Saving controller data Home  >  Online Support  >  Wafer-Search Operation Procedure and Troubleshooting  >  Standard Data Copy Manual 縲� 3. Saving controller data into PC Standard Data Copy Manual Data Copy Manual 3. Saving controller data into PC Example: Receives 窶廛 Data窶� from the controller and saves it into the PC as the file name窶徭peed.ddt窶�. (1) Click [Transceive] on the menu. (2) The [Transceive] dialog box appears. Confirm the controller body number. File type Extension 窶廣 Data窶� file (point data) adt 窶廬 Data窶� file (compound command) idt 窶廛 Data窶� file (speed data) ddt Parameter file pdt (3) Select 窶廛 Data窶� from [Select Data Type]. (4) Click the [Send] button to send the data. (5) Click the [Yes] button on the Confirmation dialog box to start sending the data. *It varies depending on the JELDATA3 ver. (6) While sending the data, the progress is shown on the status bar. (7) When the data sending is completed, click the [OK] button on the message. *When communication is not available or error messages appear from the controller, please refer to the " Error Messages ". (8) Click the [D Data] tab in the main window to display the data. Use the scroll bar or the arrow key to check the data. (9) Select [File] - [Save As] from the menu in order to save the received data. (10) Select [D Data] and click the [Decide] button on the [Select File] dialog box. (11) The [Save File As] dialog box appears. Designate the location to save in and input the file name as 窶徭peed窶�. (The extension 窶�.ddt窶� will be automatically added.) (12) Click the [Save] button to save it into the file. Contents 竊殖ack Next竊�  Technical Information transceive tab transceive dialog box select data type send button send data message status bar when data is being sent confirm message D data tab save the file select the file to save save the file save the file
../news/event2023_03.html	und	1710468654	8236	https://www.jel-robot.com/news/event2023_03.html	News | SEMICON TAIWAN 2023	News | SEMICON TAIWAN 2023 Home  >  News  >  Event News  >  SEMICON TAIWAN 2023 SEMICON TAIWAN 2023 Thank you very much for coming to our exhibition booth. For more information on our products as well as the exhibited products below, please go to the product page or contact us . Date   September 06 to 08, 2023 Venue Taipei Nangang Exhibition Center, Taiwan Booth I2924 JEL booth in SEMICON TAIWAN 2023 Products for Exhibition ■GTFR for 300 mm wafers ■Vacuum robot SVCR ■Automatic wafer transfer system for wafer container SSY ■SAL-HV for 300 mm wafers Event Listings News Top SEMICON TAIWAN 2023 banner Our booth at SEMICON TAIWAN 2023
../support/qanda/qanda1.html	und	1710469143	8982	https://www.jel-robot.com/support/qanda/qanda1.html	Online Support | Initial Operation Troubles	Online Support | Initial Operation Troubles Home 縲� Online Support  >  Wafer-Search Operation Procedure and Troubleshooting  >  Initial Operation Troubles Troubleshooting Initial Operation Troubles Q1. Unable to turn the power on A1-1 Is the controller power cable connected properly? Check the main power supply. If not, connect the cable properly. (Refer to the operation manual & spec book) A1-2 Check if the connecting part is not loosened. If the cable is loosened, connect properly. A1-3 Check the power voltage and capacity. Are the specified voltage and capacity stably supplied? (Refer to the spec book) If the power is not stably supplied, supply properly. (Refer to the spec book) A1-4 Check if the EMG terminal and REM terminal of the controller are openend. If they are opened, close them and check again. A1-5 Check if the stop signal is input from teaching box or external input (I/O or RS232C). If it is input, release it and check again. A1-6 Check the fuse of the power supply. Q2. Unable to move the robot A2-1 Check the serial number of the controller and the robot. (6-8 digits number) Are they the same? If they are different, use the same serial number of the robot and the controller. A2-2 Is the power connected properly? (Are both EMG terminal and REM terminal closed?) If not, connect the power properly. A2-3 Check if the cables between robot and controller are connected properly. Disconnect them and connect again. Make sure that connection part is locked properly. If cables are not connected, connect first and lock and check again. A2-4 Check if the robot is excited. Move the robot softly by hand. Robot moves. (It is not excited.) Check if REM terminal of the controller is opened. If it is opened, close REM terminal. A2-5 Enter the command 窶�$1窶� and check if 窶�$100窶� is returned via RS232C communication. If other status is returned, check the error code (refer to the operation manual), remove the cause, and check again. A2-6 Check if the robot is initialized. Confirm the origin search (Command $1PT) has been completed. Origin is set with 3-axis: 1101 / 4-axis: 1111/ 5-axis: 11111. If origin is not set and the response "0000" is returned, execute the origin search. A2-7 Check if the operation commands are correct. If not, confirm the operation commands again. A2-8 Check if the robot can be operated via teaching box. If still enable to move the robot and to release the error, check the robot serial number and contact JEL service section. Q3. Unable to communicate with the controller (for RS232C communication) A3-1 Check if the RS232C communication cable is connected properly. *Make sure not to connect to RS485 port. If the cable is not connected to RS232C, connect properly and check again. A3-2 Check the select switch. Is "0" selected? If not, select 窶�0窶� and check again. (*This may differ depending on the customer specs.) A3-3 Check if teaching box is not connected and it is not turned ON. If it is connected, or it is turned ON, disconnect and check again. A3-4 Check the R/T select switch. Is 窶彝窶� selected? If窶弋窶� is selected, select "R". (*This may differ depending on the customer specs.) A3-5 Check the COM port and baud rate (9600dps). If the setting is wrong, make sure to set it up correctly. A3-6 Check the robot body No. Make sure to set it up correctly. If the body No. is correct, turn the power OFF and check again. Q4. Unable to communicate with the controller (for PLC or parallel I/O) A4-1 Check if the cable is connected properly to the PLC I/O. If not, connect properly and check again. A4-2 Check the select switch. Is 窶廝窶� or 窶廚窶� selected? If窶廝窶� or 窶廚窶� is not selected, select 窶廝窶� or 窶廚窶� and check again. A4-3 Check if the PLC power is connected properly. If not, connect properly and check again. A4-4 Check if ready/busy signals are not always output. Check the ready/busy signals on the controller PLC monitor 窶戮窶�. If signals are correct, check the robot serial number (6-8 digits number) and contact JEL service section. When strobe is ON, check the system software. When strobe is OFF, turn the teaching box off.  Technical Information 
../products/semicon2023.html	und	1710468968	6997	https://www.jel-robot.com/products/semicon2023.html	Products | Introduction of product videos exhibited at Semicon Japan 2023	Products | Introduction of product videos exhibited at Semicon Japan 2023 Home  >  Products  >  Product News  >  Introduction of product videos exhibited at Semicon Japan 2023 Introduction of product videos exhibited at Semicon Japan 2023 Please take a look at the lineup of our exhibition robots for Semicon Japan 2023. Please feel free to contact us for more information about exhibition robots and our products. SSY -System with φ200㎜ SMIF POD- POD opens/closes with SMIF opener Up to 3 ports access is available with 5-Axis Horizontal and Multi-Joint Type Clean Robot STCR -TAIKO™ and thin wafer handling robot- Improved selectivity of wafer holdings Enable to handle various wafers Capable of installing large flow type Bernoulli or various sensors by increasing of flow rate, rigidity, and multi-wirings "TAIKO™" is a trademark or registered trademark of DISCO Corporation. STVCR -Vacuum robot with wafer alignment function- Enable to handle wafers correcting the wafer center position with the external alignment sensors Twin arm reduces the wafer swap time For SEMICON JAPAN 2023 page. 
../term/index.html	und	1710469239	4249	https://www.jel-robot.com/term/index.html	Technical Information | Technical Information TOP	Technical Information | Technical Information TOP Home 縲� Technical Information Technical Information Mechanisms and Properties Mechanism of Bernoulli End-Effector Stepping Motor and Servo Motor Closed-loop Control Regulations Copy Exactly 
../news/news20131224.html	und	1710468658	4142	https://www.jel-robot.com/news/news20131224.html	News | New Year's holiday Information	News | New Year's holiday Information Home  >  News  >  New Year's holiday Information New Year's holiday Information JEL will be closed for New Year's holiday from December 28th, 2013 to January 5th, 2014 (Japan Time). In case of emergency, please contact us at the following e-mail address: News Topics 2014 2013 2012 2011 Event News 2014 2013 2012 2011 2010 2009 2008 
../products/SCR3130CS.html	und	1710468966	23177	https://www.jel-robot.com/products/SCR3130CS.html	Products | SCR3130CS | Wafer Transfer Atmospheric Robot	Products | SCR3130CS | Wafer Transfer Atmospheric Robot Home 縲� Products 縲� 縲� Robot for Semiconductor SCR3130CS 3-Axis Cylindrical Coordinate Clean Robot Product Video Usage Environment/Specifications Product Profile Model Name SCR3130CS Environment Clean room atmosphere Arm Single arm Operating Range 280mm (3rd joint center) Vertical Stroke 200mm / 300mm / 400mm / 450mm / 500mm / 550mm / 600mm Payload Capacity 3kg (calculated for the arm 3rd joint) List of Product Model Product Model Vertical Stroke SCR3130CS-200-PM 200mm SCR3130CS-300-PM 300mm SCR3130CS-400-PM 400mm SCR3130CS-450-PM 450mm SCR3130CS-500-PM 500mm SCR3130CS-550-PM 550mm SCR3130CS-600-PM 600mm The image is of SCR3100CS-200-PM and the video is of SCR3160CS-300-PM. Characteristics Designed for handling small wafers in a production line or inspection line of semiconductor. Arm lineup: 100mm, 130mm, 160mm, 200mm Base or flange mounting type is selectable. Motion monitoring is available. RS232C and parallel photo I/O are standard for control. 2-phase stepping motor installed in all axes. High-speed, high-accuracy wafer handlingby S-curved speed control. Wafer holding: end-effector with vacuum suction, passive edge, edge grip type End-effector. End-effector material: CFRP, Al, ceramic, or others. Optimal end-effector is selectable according to the carrying object and line layout. Standard Specifications Example of standard specifications with JEL standard end-effector (vacuum type) Specifications of Robot Robot Model SCR3130S-200-PM Carrying Object Wafer up to 300mm Wafer Holding Method By vacuum suction Robot Model Type Cylindrical coordinate type Control Axis 3-axis Motor Type Stepping motor Operating Range From the robot center to the wafer center Rotation Angle (Theta-axis) Vertical Stroke (Z-axis) 492.7mm 340deg 200mm Carrying Speed (Ave.) Arm (R-axis) Rotation Angle (Theta-axis) Vertical Stroke (Z-axis) 500mm/sec 340deg/sec 200mm/sec Carrying Speed (Max.) Arm (R-axis) Rotation Angle (Theta-axis) Vertical Stroke (Z-axis) 1000mm/sec 500deg/sec 250mm/sec Repeatability Within ±0.1mm Cleanliness ISO Class 2 (at wafer transfer level when exhausting driving part) Utility Power: DC24V±10% 15A; Vacuum: -53kPa or more Mass Approx. 20kg Specifications of Controller Controller Model C4000 series Interface RS232C and parallel photo I/O Outline Drawing (Standard) Option Wrist-Block Unit Model Name Total Length Mapping Sensor Thickness of Attaching End-Effector SARS00169 38mm None 2mm SARS00958 38mm None 3mm SARS02659 75mm None 2mm SARS02967 75mm None 3mm SARS08603 80mm Transmissive sensor/Reflective sensor 2mm *The table above shows the specifications of JEL standard wrist-block units. The other specifications are available. *Click the items below to review the wrist-block units other than JEL standard types. End-Effector Model Name Size of Carrying Object End-effector Type (Thickness) Wafer Holding Method SC-IW-200 3 inch, 100mm to 200mm I-shape (2mm) Vacuum suction SC-IW-240 3 inch, 100mm to 300mm I-shape (2mm) Vacuum suction SC-YW-200 100mm to 200mm Y-shape (2mm) Vacuum suction SC-YW-227 100mm to 300mm Y-shape (2mm) Vacuum suction SC-YW-240 100mm to 300mm Y-shape (2mm) Vacuum suction 3D-02229 150mm to 300mm Y-shape (2mm) Vacuum suction SC3-YW-240 300mm Y-shape (3mm) Vacuum suction 3D-01661 300mm Y-shape (3mm) Vacuum suction *The table above shows the specifications of JEL standard end-effectors. The other specifications are available. *Click the items below to review the end-effectors other than JEL standard types. Operating Range End-Effector/Wrist-Block Unit SARS00169 SARS02659 SARS08603 SARS00958 SARS02967 SC-IW-200 357.7mm 420mm 425mm - - SC-IW-240 397.7mm 460mm 465mm - - SC-YW-200 367.7mm 430mm 435mm - - SC-YW-227 394.7mm 457mm 462mm - - SC-YW-240 407.7mm 470mm 475mm - - 3D-02229 407.7mm 470mm 475mm - - SC3-YW-240 - - - 407.7mm 470mm 3D-01661 - - - 407.7mm 470mm *The operating range in the table that is specified by the combination of the wrist-block unit and end-effector is an example only. The other combinations are available. Other Option *The teaching box appeared in the table may be unavailable depending on the specifications. Product Lineup Menu Prev Next Icon guide ...Atmosphere ...Vacuum ...Waterproof ...Single arm ...Twin arm ...Thin wafer ...CE marking ...JEL's standard spec. ...KCs marking SCR3130CS SCR3130CS
../news/topics2024.html	und	1744094847	12319	https://www.jel-robot.com/news/topics2024.html	News | Topics 2024	News | Topics 2024 Home  >  News  >  2024 News 2024 December 13, 2024 SEMICON JAPAN 2024 Thanks for coming to the exhibition. November 22, 2024 New Year's Holiday Information November 15, 2024 SEMICON EUROPA 2024 Thanks for coming to the exhibition. September 06, 2024 SEMICON TAIWAN 2024 Thanks for coming to the exhibition. September 2, 2024 Announcement of establishment of JELC and completion of Changzhou factory August 22, 2024 GTFR5280 received CE July 11, 2024 Summer Holiday Information April 30, 2024 Updated Privacy Policy page April 08, 2024 Holiday Notice JEL will be closed for a Japanese holiday week: April 27th to 29th; May 3rd to 6th. March 22, 2024 SEMICON CHINA 2024 Thanks for coming to the exhibition. March 06, 2024 Introduction of product videos exhibited at Semicon Japan 2022 Introduction of product videos exhibited at Semicon Japan 2023 February 02, 2024 SEMICON KOREA 2024 Thanks for coming to the exhibition. News List News Top SEMICON JAPAN 2024 SEMICON EUROPA 2024 SEMICON TAIWAN 2024 JELC SEMICON CHINA 2024 exhibition product videos SEMICON KOREA 2024
../news/event2016_06.html	und	1710468643	5474	https://www.jel-robot.com/news/event2016_06.html	News | SEMICON TAIWAN 2016	News | SEMICON TAIWAN 2016 Home  >  News  >  Event News  >  SEMICON TAIWAN 2016 SEMICON TAIWAN 2016 Thank you very much for coming to our agent's booth, Challentech International Corporation during the exhibition. For more information on our products, please go to the product page or contact us. Date   September 7-9, 2016 Venue TWTC Nangang Exhibition Hall (Taipei, Taiwan) Booth L506 (4F) Products for Exhibition Tape frame handling robot Safe and secure handling of tape frame. Available for tape frames of 150mm, 200mm, and 300mm. JEL ALIGN TOOL (Software for alignment adjustment) Easy-to-use and self-adjustment wafer alignment tool. Downtime can be reduced significantly. Event Listings News Top SEMICON TAIWAN 2016 SEMICON TAIWAN 2016 booth Tape frame handling robot JEL ALIGN TOOL
../support/often-5.html	und	1710469076	4621	https://www.jel-robot.com/support/often-5.html	Online Support | Frequently Asked Question :No response is returned by using the communication software. Why?	Online Support | Frequently Asked Question :No response is returned by using the communication software. Why? Home  >  Online Support  >  Frequently Asked Question  >  Communication Software Communication Software Q: No response is returned by using the communication software. Why? A: If other software is running, close it. Ensure that the communication port of PC is opened. Ensure that the opened port is available. Ensure that the communication cable specifications are the same as those specified in the Control Specifications. Ensure that the select switch is set to position 0. Ensure that the display of the teaching box is off. The communication is not available with the teaching box on.  Click to see JELDATA3 Operation Manual .  List of FQA  Contact Us 
../news/news20171130.html	und	1710468662	3427	https://www.jel-robot.com/news/news20171130.html	News | New Year's Holiday Information 2018	News | New Year's Holiday Information 2018 Home  >  News  >  New Year's Holiday Information New Year's Holiday Information JEL will be closed for New Year's holiday from December 29th, 2017 to January 4th, 2018 (Japan Time). In case of emergency, please contact us at the following e-mail address: 
../products/SC3-YW-240_end.html	und	1710468965	10643	https://www.jel-robot.com/products/SC3-YW-240_end.html	Products | SC3-YW-240 (Vacuum Type End-Effector)	Products | SC3-YW-240 (Vacuum Type End-Effector) Home  >  Products  >  縲� Others SC3-YW-240 Vacuum Type End-Effector Usage Environment/Specifications Product Profile Model Name SC3-YW-240 Carrying Size 300mm Carrying Object Mainly silicon wafer Characteristics Y-shaped vacuum suction type end-effector, suitable for handling 300mm wafer (Random access is available). Used extensively for atmospheric robot, the end-effector holds the backside of wafer by vacuum suction (negative pressure). Conductive Teflon coating on the surface of end-effector protects against damage from charging. Standard Specifications Carrying Object SEMI standard 300mm (Mainly silicon wafer) Material High purity alumina ceramic sintered body Surface Treatment Conductive Teflon coating Wafer Holding Method Vacuum suction Total Length 240mm Thickness 3mm Please contact us for the detailed specifications. Outline Drawing (Standard) Product Lineup Menu Prev Next Icon guide ...Atmosphere ...Vacuum ...Waterproof ...Single arm ...Twin arm ...Thin wafer ...CE marking ...JEL's standard spec. ...KCs marking SC3-YW-240 SC3-YW-240
../news/event2016_01.html	und	1710468641	7281	https://www.jel-robot.com/news/event2016_01.html	News | 8th Light-Tech Expo	News | 8th Light-Tech Expo Home  >  News  >  Event News  >  8th Light-Tech Expo 8th Light-Tech Expo Thank you for coming to the 8th Light-Tech Expo: Lighting Japan 2016. For more product information, please go to the products page or contact us. Date: January 13-15, 2016 Venue: Tokyo Big Sight, Japan Booth: E40-001 Products for Exhibition ■Horizontal and multi-joint type robot with vertical strokes (DGCR)(Exhibited as reference) ■Automatic wafer transfer system for wafer container ■Bernoulli type end-effector and Bernoulli hand for thin or warped wafer And many more latest models were exhibited. Event Listings News Top 8th Light-Tech Expo JEL booth at 8th Light-Tech Expo: Lighting Japan 2016
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../news/event2012_03.html	und	1710468636	5109	https://www.jel-robot.com/news/event2012_03.html	News | OPTO Taiwan 2012	News | OPTO Taiwan 2012 Home  >  News  >  Event News  >  OPTO Taiwan 2012 OPTO Taiwan 2012 Thank you very much for coming to our exhibition booth at OPTO Taiwan 2012 during June 19-21. For more information on our products as well as the exhibited products below, please go to the product page or contact us. Date : Tue., Jun. 19, 2012-Thu., Jun. 21, 2012 Venue 啜WTC Nangang Exhibition Hall, Taiwan Products for Exhibition SCR3100S-200-PM (Bernoulli type) Developed low-cost type end-effector to meet the request of many customers. JEL has proposed the most suitable shape of end-effector according to your concept and layout. SCR + SAL3261GR One robot and an aligner can handle 2-6-inch wafer, which offers small footprint. Loader/Unloader System for Batch Processing of Trays or Susceptors 售SY-10020 Developed automatic loader/unloader system for batch processing such as trays or susceptors. JEL has proposed the most suitable system according to your concept and layout. Event Listings News Top OPTO Taiwan 2012 SCR3100S-200-PM(Bernoulli type) SCR + SAL3261GR SSY-10020
../news/news20231122.html	und	1710468668	3717	https://www.jel-robot.com/news/news20231122.html	News | New Year's Holiday Information	News | New Year's Holiday Information Home  >  News  >  New Year's Holiday Information New Year's Holiday Information JEL will be closed for New Year's holiday from December 29th, 2023 to January 4th, 2024 (Japan Time). In case of emergency, please contact us at the following e-mail address: 
../products/handling_12.html	und	1710468951	6308	https://www.jel-robot.com/products/handling_12.html	Products | Introduction Video of Handling (Automatic wafer transfer system for wafer container)	Products | Introduction Video of Handling (Automatic wafer transfer system for wafer container) Home  >  Products  >  Introduction Video of Handling  >  Automatic wafer transfer system for wafer container Introduction Video of Handling Automatic wafer transfer system for wafer container SSY-11010 (Automatic wafer transfer system for wafer container) : High accuracy handling of thin wafer inside the wafer container and cassette. Equipped with mechanism of automatic lid opening/closing of the wafer container (Patent pending). Automatic recognition of wafer and the spacer (interlayer paper) in the wafer container. Automatic wafer transfer between the wafer container and the wafer cassette (package/unpackage). Available for thin wafer as equipped with Bernoulli end-effector. Video List Previous Video Next Video YouTube Official Channel
../products/handling_9.html	und	1710468953	5466	https://www.jel-robot.com/products/handling_9.html	Products | Introduction Video of Handling (Tape Frame Handling)	Products | Introduction Video of Handling (Tape Frame Handling) Home  >  Products  >  Introduction Video of Handling  >  Tape Frame Handling Introduction Video of Handling Tape Frame Handling MTCR4160 (Tape frame handling robot) High-accuracy handling of tape frames. Available for tape frames for up to 300 mm wafers. Accessible to all slots in the cassette by random access. Video List Previous Video Next Video YouTube Official Channel
../support/often-11.html	und	1710469075	4555	https://www.jel-robot.com/support/often-11.html	Online Support | Frequently Asked Question: The speed is changed using the teaching box, but returned to the original speed after the power-on again. Why?	Online Support | Frequently Asked Question: The speed is changed using the teaching box, but returned to the original speed after the power-on again. Why? Home  >  Online Support  >  Frequently Asked Question  >  Error codes or operations Error codes or operations Q: The speed is changed using the teaching box, but returned to the original speed after the power-on again. Why? A: You cannot change speed if the input speed value is out of the setting range. Data writing is required after setting the speed. Please follow the procedure to write to EEPROM. See the Instruction Manual as the procedure varies depending on the models.  Click to see JELDATA3 Operation Manual .  List of FQA  Contact Us 
../news/news20230711.html	und	1710468668	3500	https://www.jel-robot.com/news/news20230711.html	News | Summer Holiday Information 2023	News | Summer Holiday Information 2023 Home  >  News  >  Summer Holiday Information Summer Holiday Information JEL will be closed for summer holiday from August 11th to August 15th, 2023 (Japan Time). In case of emergency, please contact us at the following e-mail address: 
../news/news20140717.html	und	1710468658	4134	https://www.jel-robot.com/news/news20140717.html	News | Summer Holiday Information	News | Summer Holiday Information Home  >  News  >  Summer Holiday Information Summer Holiday Information JEL will be closed for summer holiday from August 13rd to August 17th, 2014 (Japan Time). In case of emergency, please contact us at the following e-mail address: News Topics 2014 2013 2012 2011 Event News 2014 2013 2012 2011 2010 2009 2008 
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../products/PETRI.html	und	1710468958	13325	https://www.jel-robot.com/products/PETRI.html	Products | Robot for Handling Petri Dish (For petri dish/microplate)	Products | Robot for Handling Petri Dish (For petri dish/microplate) Home 〉 Products 〉 〉 Robot for Petri Dish/Microplate Robot for Handling Petri Dish Product Video Usage Environment/Specifications Product Profile Product Model Robot for handling petri dish Environment Clean room atmosphere Arm Single arm Operating Range 555mm (Robot center to wafer center) Vertical Stroke 300mm List of Product Model Product Model Vertical Stroke GCR4210-300-AM 300mm The image and the video are of Robot for handling petri dish (GCR4210-300-AM) Characteristics Suitable for handling in sterile room, or clean environment used for medical and biotechnology applications. Microplate handling is also available. Tilt feature tilts the petri dish to aspirate the culture fluid. Transferring parts can be installed in our robots. (The specifications below are based on horizontal and multi-joint type clean robot.) Standard Specifications Specifications of GCR4210-300-AM for handling petri dish. Specifications of Robot Robot Model GCR4210-300-AM Carrying Object Petri dish (Glass) φ90mm x 21mm (*Other sizes or microplate is available.) Petri Dish Holding By edge grip (Edge grip by driving pneumatic cylinder) Robot Model Type Horizontal and multi-joint type Control Axis 4-axis Motor Type AC servo motor Operating Range 3rd Joint Center Rotation Angle (Theta-axis) Vertical Stroke (Z-axis) 400mm 335deg 300mm Carrying Speed (Ave.) Arm (R-axis) Rotation Angle (Theta-axis) Vertical Stroke (Z-axis) 165mm/sec 165deg/sec 150mm/sec Repeatability Within ±0.1mm Cleanliness ISO Class 2 (at wafer transfer level when exhausting driving part) Utility Air: For driving edge grip (0.15MPa or more); For swinging wrist-block (0.3MPa or more) Mass Robot main body: Approximately 37kg Specifications of Controller Controller Model C5000S series Interface RS232C and parallel photo I/O Outline Drawing (Standard) Product Lineup Menu Prev Next Icon guide ...Atmosphere ...Vacuum ...Waterproof ...Thin wafer ...CE marking ...JEL's standard spec. ...KCs marking Robot for handling petri dish Robot for Handling Petri Dish
../support/qandamain.html	und	1710469079	5432	https://www.jel-robot.com/support/qandamain.html	Online Support | Troubleshooting	Online Support | Troubleshooting Home  >  Online Support  >  Manuals/Troubleshooting  >  Troubleshooting Troubleshooting: Common to All The Semiconductor Robots Initial operation troubles Initial operation troubles : Initial operation troubles (PDF) Vacuum troubles Vacuum troubles : Vacuum troubles (PDF) Operation/Control troubles Operation/Control troubles : Operation/Control troubles (PDF) In case the robot arm hits something Execute the adjustment at your own risk. We recommend taking our training lesson. In case the robot arm hits something : Arm (PDF) Arm origin adjusment manual for single arm (PDF) Arm origin adjusment manual for twin arm (PDF) When error occurs When error occurs : Errors 01-06 (PDF) Error *1 (PDF) Error *2 (PDF) Error *3 (PDF) Error *4 (PDF) Error *07 (PDF) Error *08 (PDF) Error *75 (PDF) Error *77 (PDF)  Technical Information 
../products/SAL3261HV.html	und	1710468962	13172	https://www.jel-robot.com/products/SAL3261HV.html	Products | SAL3262HV (Full auto-adjustment version)	Products | SAL3262HV (Full auto-adjustment version) Home 〉 Products 〉 〉 Aligner New Aligner "SAL3000HV Series"  (Full auto-adjustment version) SAL3262HV (Multi work aligner) Wafer Aligner Product Video Usage Environment/Specifications Product Profile Product Model SAL3262HV Environment Clean room atmosphere Wafer Size 2, 3 inch, 100 to 150 mm Carrying Object Transparent, translucent, or silicon wafer The image is of SAL38C3HV . The video is of full auto-adjustment software " JEL ALIGN TOOL ". Characteristics Full auto-adjustment software  JEL ALIGN TOOL  comes with Aligner SAL3000HV series that have been released on December 14, 2016. Downtime can be reduced significantly. *Click to go to the page of New Aligner "SAL3000HV Series" (Full auto-adjustment version) (*). (*) Please note that this tool (software) is not for guaranteeing the positioning accuracy after adjustment. Make sure to check the positioning accuracy by using the customer’s inspection device at customer’s side. New type of aligner available for any material of wafer for 2, 3 inch, 100 to 150 mm wafer High-speed, high-accuracy centering and flat/notch locating are available for silicon wafer with BG tape as well as silicon, transparent, or translucent wafer. Equipped with JEL-developed image sensor, and internal motor driver and controller. Size, shape, material of spindle can be changed according to the wafer type. Bernoulli type is also available. Control: RS232C and parallel photo I/O Available for non-SEMI standard notch or flat Optional Z-axis for pick-up/place operation is available. Standard Specifications Carrying Object SEMI standard 2, 3 inch, 100 to 150 mm wafer (Transparent, translucent, silicon) Positioning Time Centering : 3 sec (Wafer pick-up/placing time excluded) Positioning Accuracy Centering: Within ±0.1 mm Flat locating/Notch locating: Within ±0.1 deg Sensor LED light + wafer edge detection with image sensor unit Wafer Size Change By command control or switch Cleanliness ISO Class 2 (at wafer transfer level when exhausting driving part) Driving Method 2-phase stepping motor (for 3 axes) Internal motor driver, controller Utility Power: DC24V±10% 3A Vacuum: -53 kPa or more Outline Drawing Product Lineup Menu Prev Next Icon guide ...Atmosphere ...Vacuum ...Waterproof ...Thin wafer ...CE marking ...JEL's standard spec. ...KCs marking SAL38C3HV SAL3262HV
../company/relation.html	und	1741825894	19775	https://www.jel-robot.com/company/relation.html	Company | Overseas Agencies and Partners	Company | Overseas Agencies and Partners Home  >  Company  >  Overseas Agencies and Partners Overseas Agencies and Partners  KOREA  TAIWAN  CHINA  U.S.A  GERMANY KOREA JELK CO., LTD. Address 75, Seokmun-gil, Seonggeo-eup, Seobuk-gu, Cheonan-si, Chungnam-do 31053, Korea Tel Services : +82-41-583-6360 Sales : +82-10-7420-6360 FAX +82-41-583-6469 E-mail URL https://www.jelk.co.kr Inatech & CORP Inc. Address #C-812，168，Gasan digital 1-ro，Geumcheon-gu，Seoul 08507，Korea TEL +82-2-2026-0660 FAX +82-2-2026-0661 E-mail URL http://www.inatechncorp.com Business Offices Dae Jeon Office Address #402, Daewoong B/D, 331, Dongdaejeon-ro, Gayang-dong, Dong-gu, Daejeon 34574, Korea TEL +82-42-626-5588 FAX +82-42-626-3067 E-mail (Dong-Su, Kang) Bu San Office Address #1106, Rowin B/D, 12, Beobwon-ro, Geoje-dong, Yeonje-gu, Busan 47511, Korea TEL +82-51-505-8615 FAX +82-51-557-5213 E-mail (Dong-Hyeon, Shin) TAIWAN Challentech International Corporation Address No.21, Taihe Rd., Zhubei City, Hsinchu County 30267, Taiwan (R.O.C.) TEL Services/Sales Contact: Lobo Shen +886-3-5536525 ext.2201 FAX +886-3-5531908 E-mail URL https://www.challentech.com.tw JEL Automation Co., Ltd. Address 1F., No. 29, Jiazheng 9th St., Zhubei City, Hsinchu County 302053, Taiwan (R.O.C.) TEL +886-3-6583741 E-mail URL https://www.jel-automation.com CHINA Beijing REJE Automation Co., Ltd. Address Building 3, No.10, Kechuang 10th Street, BDA, Beijing 101111, China TEL +86-10-5382-2087 +86-133-2115-2839 E-mail URL https://www.reje.com.cn Business Offices Shanghai Office Shanghai REJE Robotics Co., Ltd. Address Room 306-11, Building T4, Libao Plaza, 36 Shenbin Road, Minhang District, Shanghai 201106, China TEL +86-178-1202-2295 E-mail Sintaike Semiconductor Equipment (Shanghai) Co., Ltd. Address Building 6, Nanfang Urban Park, Lane 1165, Jindu Road, Minhang District, Shanghai 201108, China TEL +86-021-6088-8500 +86-135-6466-5802 E-mail URL http://www.sintaike.com U.S.A Hine Automation, LLC Address 12495 34th St. North, Suite B St. Petersburg, FL 33716, U.S.A. TEL +1-813-749-7519 E-mail URL https://hineautomation.com AES motomation Inc. Address 4041 Clipper Court Fremont, CA 94538, U.S.A. TEL +1-510-490-9400 E-mail URL http://www.motomation.com GERMANY AES motomation GmbH Address Duesselstrasse 8a D-41564 Kaarst, Germany TEL +49-0-2131-7768-10 E-mail URL http://www.motomation.com Company TOP JELK Inatech & CORP Inc. Dae Jeon Office Email Bu San Office Email Challentech International Corporation JEL Automation Co., Ltd. Beijing REJE Automation Co., Ltd. Shanghai Office Email Sintaike Hine Automation, LLC AES motomation Inc. AES motomation GmbH
../news/event2023_02.html	und	1710468654	8336	https://www.jel-robot.com/news/event2023_02.html	News | SEMICON CHINA 2023	News | SEMICON CHINA 2023 Home  >  News  >  Event News  >  SEMICON CHINA 2023 SEMICON CHINA 2023 Thank you very much for coming to our exhibition booth at SEMICON CHINA 2023. For more information on our products as well as the exhibited products below, please go to the product page or contact us . Date   June 29 to July 01, 2023 Venue Shanghai New International Expo Centre (SNIEC), Shanghai Booth E6407 ReJe booth in SEMICON CHINA 2023 Products for Exhibition ■SCR3160 with flip unit+SMIF(ReJe products) ■Vacuum robot SVCR2260 ■EFEM(STCR4200[path-planning type]+SAL38C3HV+L/P(TDK) Event Listings News Top SEMICON CHINA 2023 banner Our booth at SEMICON CHINA 2023
../support/often.html	und	1710469078	11349	https://www.jel-robot.com/support/often.html	Online Support | Frequently Asked Question	Online Support | Frequently Asked Question Home  >  Online Support  >  Frequently Asked Question Frequently Asked Question This page provides the frequently asked questions on our robots or products. Please click on a question below to go to the corresponding answer. If you have any questions, please contact us . See “Before Contact” below and provide us information such as a serial number or error codes. The recommended periodic inspection or maintenance interval of our robot is 1 year . *Note that the interval may vary depending on robot models. For details, please refer to the Maintenance and Inspection manual attached upon delivery. Please refer to the serial number first to contact us on support. Contact us the error codes or contents for any error. Serial Number (6- to 8-digit number) A serial number is labeled or incised mainly on the lower part of connectors of robot/aligner, and the side of the LED display of a controller.  See where to find a serial number Error Code Error codes are displayed on a controller's LED display.  See where to find error codes List of Frequently Asked Questions (FQA) Click one of the following buttons to jump to a specified category.  Communication Software  Error Codes or Operations  Others Communication Software Software settings or data backup Q: How do I set up JELDATA3, a data transfer software? Q: How do I back up the controller data? Q: In the Controller Setup (L) window of JELDATA3, a setting specified in the Control Specifications or Instruction Manual cannot be selected. Q: How to change speed parameters with commands? (Applicable model: SHR and STHR) Communication software errors Q: No response is returned by using the communication software. Why? Error Codes or Operations Error codes Q: Error 08 occurs when the robot is moved up and down with the arm extended. Why? Operations of Robot, Controller, or Teaching BOX (pendant) Q: The controller does not display anything after the power-on. Why? Q: The teaching box is connected, but nothing is displayed on the teaching box display. Why? Q: The speed is changed using the teaching box, but returned to the original speed after the power-on again. Why? Others Q: What is "body number"? 
../news/event2011_02.html	und	1710468633	4439	https://www.jel-robot.com/news/event2011_02.html	News | OPTO Taiwan 2011	News | OPTO Taiwan 2011 Home  >  News  >  Event News  >  OPTO Taiwan 2011 OPTO Taiwan 2011 Thank you very much for coming to our Challentech International Corporation booth at the OPTO Taiwan 2011 during June 14-16.For more information on our products as well as the exhibited products below, please go to the product page or contact us. Date: Tue., June 14 - Thu., June 16 Venue: TWTC Nangang Exhibition Hall Products for Exhibition Robot & aligner for 2 to 4 inch wafers for LED : SSCR3115N-150-PM & SSCR2090S-PM & SAL3241GR This robot & aligner is especially designed for handling small wafers and has small footprint. There are armless type and link-arm type. Event Listings News Top Robot & aligner for 2 to 4 inch wafers for LED : SSCR3115N-150-PM & SSCR2090S-PM & SAL3241GR 
../err403.html	und	1710469265	3102	https://www.jel-robot.com/err403.html	JEL Corporation | 403 Forbidden	JEL Corporation | 403 Forbidden Home  >  Message 403 Forbidden Page Not Found Sorry, the page you are looking for is either not existing or updated and cannot be found. 
../news/event2025_01.html	und	1740123224	8303	https://www.jel-robot.com/news/event2025_01.html	News | SEMICON KOREA 2025	News | SEMICON KOREA 2025 Home  >  News  >  Event News  >  SEMICON KOREA 2025 SEMICON KOREA 2025 Thank you very much for coming to our exhibition booth at SEMICON KOREA 2025. For more information on our products as well as the exhibited products below, please go to the product page or contact us . Date   February 19 to 21, 2025 Venue COEX (Convention and Exhibition Center), Seoul, Korea Booth No. A628 Inatech & CORP booth in SEMICON KOREA 2025 Products for Exhibition ■GTFR for 300 mm wafers ■SAL-HV for 300 mm wafers ■STCR for 300 mm wafers (flip unit, vacuum, edge-grip) Event Listings News Top SEMICON KOREA 2025 banner Our booth at SEMICON KOREA 2025
../support/qanda/qanda4.html	und	1710469145	6016	https://www.jel-robot.com/support/qanda/qanda4.html	Online Support | In Case the Robot Arm Hits Something	Online Support | In Case the Robot Arm Hits Something Home 縲� Online Support  >  Wafer-Search Operation Procedure and Troubleshooting  >  In Case the Robot Arm Hits Something Troubleshooting In Case the Robot Arm Hits Something Q1. The origin position has not been changed A1-1 Check the teaching point. Check if the transfer point has not been displaced. Reduce the speed and operate again. If the teaching point has been displaced, check the origin position of the robot. Execute the adjustment and the teaching again as required. (Refer to the origin adjustment manual below.) A1-2 If the teaching point has not been displaced, reduce the speed and check the operation. Q2. The axis has been displaced. A2-1 Check the external damage. Check if the robot can be operated via teaching box. If the robot cannot be operated via teaching box, or error occurs and the robot cannot be operated, contact JEL service section. A2-2 Check if the arm can transfer. Check if there is no interference, deformation, or breakage in the arm. Check if the readjustment is possible by executing the teaching again. If readjustment or repair is not possible, contact JEL service section for service. A2-3 Adjust the origin position. (Refer to the origin adjustment manual below for single arm and twin arm.) If readjustment is impossible, contact JEL service section for service. A2-4 Adjust the origin position after executing the origin search. Refer to the spec book. After the adjustment: It is necessary to execute the teaching again. Execute the teaching. After the teaching: Check the operation and confirm that the robot can transfer with no problem. Origin adjustment manual Execute the adjustment at your own risk. We recommend taking our training lesson. Arm origin adjusment manual for single arm (PDF) Arm origin adjusment manual for twin arm (PDF)  Technical Information 
../support/man001/t012.html	und	1710469103	5097	https://www.jel-robot.com/support/man001/t012.html	Online Support |12: The results or wafer search differ from the actual wafer condition.	Online Support |12: The results or wafer search differ from the actual wafer condition. Home  >  Online Support  >  Manuals/Troubleshooting  >  Wafer-Search Operation Procedure and Troubleshooting  >  12: The results or wafer-search differ from the actual wafer condition. Troubleshooting of Wafer Search Operation 12: The results or wafer-search differ from the actual wafer condition. When the output of wafer-search results is checked via PLC, compare the results of wafer-search between via PLC and via serial communication. When the results are different, refer to 窶�11: The results of wafer-search differ between via Parallel I/O and via serial communication.窶� . When there are wafers in the actual setting but the results show that there is no wafer, check 窶�5: Setting of the maximum detection width of wafer (WWM setting)窶� .Check if it is larger than the detected width at 窶�12: Reading out of the detection width of wafer-search窶� .The setting may differ from the actual detected values when, for example, wafer thickness has been set based on the calculation from the robot resolution. Contents Back  Technical Information 
../news/event2025_02.html	und	1743145847	8902	https://www.jel-robot.com/news/event2025_02.html	News | SEMICON CHINA 2025	News | SEMICON CHINA 2025 Home  >  News  >  Event News  >  SEMICON CHINA 2025 SEMICON CHINA 2025 Thank you very much for coming to our exhibition booth at SEMICON CHINA 2025. For more information on our products as well as the exhibited products below, please go to the product page or contact us . Date   March 26 to 28, 2025 Venue Shanghai New International Expo Centre (SNIEC), Shanghai Booth REJE: Hall E7-7008, SINTAIKE: Hall N2-2336 REJE & SINTAIKE booth in SEMICON CHINA 2025 Products for Exhibition ■REJE booth: JFR -PLP Transfer Robot- ■SINTAIKE booth: EFEM with φ300 mm Event Listings News Top SEMICON CHINA 2025 banner Our booth at SEMICON CHINA 2025
../products/handling.html	und	1710468950	4627	https://www.jel-robot.com/products/handling.html	Products | Introduction Video of Handling	Products | Introduction Video of Handling Home  >  Products  >  Introduction Video of Handling Introduction Video of Handling  Closed-loop Control 300mm SORTER SYSTEM (4-port inline type) System for handling 2 inch wafer Automatic wafer transfer system for wafer container Waterproof Handling Mapping operation (Through-beam mapping) Tape Frame Handling Path Planning Handling Susceptor/Tray Handling Multi Work Aligner Bernoulli Type Handling Microplate/Petri Dish Handling NEW YouTube Official Channel
../news/event2012_04.html	und	1710468636	5895	https://www.jel-robot.com/news/event2012_04.html	News | SEMICON Taiwan 2012	News | SEMICON Taiwan 2012 Home  >  News  >  Event News  >  SEMICON Taiwan 2012 SEMICON Taiwan 2012 Thank you very much for coming to our exhibition booth at SEMICON Taiwan 2012 during September 5-7. For more information on our products as well as the exhibited products below, please go to the product page or contact us. Date: September 5, 2012 - September 7, 2012 Venue: TWTC Nangang Exhibition Hall Booth: No. 324 Products for Exhibition Bernoulli Type End-effector for 6-12 inches We demonstrated how the bernoulli type end-effector for 6-12 inches holds sample wafers. 繝サBernoulli type End-effector is a low-cost type suitable to accommodate thin or warped wafer. 繝サIt is available to any type of our atmospheric robot. 繝サJEL provides the most suitable design according to your arbitrary shapes such as the size of wafer, its warp or thickness by taking sample wafer tests. SCR3100S-200-PM (Bernoulli type) Developed low-cost type end-effector to meet the request of many customers. JEL has proposed the most suitable shape of end-effector according to your concept and layout. SCR + SAL3261GR One robot and an aligner can handle 2-6-inch wafer, which offers small footprint. Loader/Unloader System for Batch Processing of Trays or Susceptors 售SY-10020 Developed automatic loader/unloader system for batch processing such as trays or susceptors. JEL has proposed the most suitable system according to your concept and layout. Event Listings News Top SEMICON Taiwan 2012 SCR3100S-200-PM(Bernoulli type) SCR3100S-200-PM(Bernoulli type) SCR + SAL3261GR SSY-10020
../support/training.html	und	1710469081	12560	https://www.jel-robot.com/support/training.html	Online Support | Training Information	Online Support | Training Information Home  >  Online Support  >  Training Information Training Information JEL provides our customers who purchased our robots with robot training for safety and efficient use. For a training request, price or any questions, please feel free to consult with us at the address listed in the bottom. Two courses outlined below are available (paid courses). We offer certificate to the personnel who completed the course. Course Target Contents Day Time Standard (2 days) For users who use the robot for the first time For users who want to understand the basic robot operation 1. Usage Safety Cautions for installation and use 2. Outlines of robots and parts Outlines and names of robot Day 1 09:30 - 12:00 3. Adjustment Mounting/dismounting of the wrist-block and the end-effector Right angle adjustment of the wrist-block and the end-effector Leveling and adjustment Day 1 13:00 - 17:00 4. Turning on the power 窶� start up Connecting of power Checking of each interlock Case example of troubles and resolution 5. Inspection with controllers Select switch monitoring Outlines of display bits Outlines of error codes Outlines of functions and connections Day 2 09:30 - 12:00 6. Practical training with actual robots Robot operation Teaching Compound commands 7. Questions and answers Day 2 13:00 - 17:00 Maintenance (3 days) For personnel responsible for the maintenance 1. Usage Safety Cautions for installation and use 2. Outlines of robots and parts Outlines and names of robot Day 1 09:30 - 12:00 3. Adjustment Mounting/dismounting of the wrist-block and end-effector Right angle adjustment of the wrist-block and end-effector Leveling and adjustment Adjustment of arm extending/retracting direction Adjustment of arm distance between axes Day 1 13:00 - 17:00 4. Inspection with controllers Select switch monitoring Outlines of display bits Outlines of error codes Outlines of functions and connections Day 2 09:30 - 12:00 5. Replacement Sensor replacement of each unit Motor replacement of each unit Encoder replacement of each unit Day 2 13:00 - 17:00 6. Maintenance and Inspection Items of regular inspection Mounting/dismounting of cover Greasing Filter replacement Battery replacement Day 3 09:30 - 12:00 7. Practical training with actual robots Robot operation Teaching Compound commands 8. Questions and answers Day 3 13:00 - 17:00 JEL prepares training robot. Please note that in case of a robot with particular specifications, we might ask the customer to bring it or use other similar robot. Training contents and schedules may vary depending on the number of students, the robot type, or the progress. Contact information JEL Corporation 2-8-20, Kusado-cho, Fukuyama-city, Hiroshima, 720-0831 Japan Tel: +81-84-932-6500 FAX: +81-84-932-6501 E-mail: Contact sales representative or Service Engineering Section.  Technical Information 
../products/SAL38C2HV.html	und	1710468962	14739	https://www.jel-robot.com/products/SAL38C2HV.html	Products | SAL38C3HV (Full auto-adjustment version)	Products | SAL38C3HV (Full auto-adjustment version) Home 〉 Products 〉 〉 Aligner New Aligner "SAL3000HV Series"  (Full auto-adjustment version) SAL38C3HV (Multi work aligner) Wafer Aligner Product Video Usage Environment/Specifications Product Profile Product Model SAL38C3HV Environment Clean room atmosphere Wafer Size 200 to 300 mm Carrying Object Transparent, translucent, or silicon wafer The image is of SAL38C3HV. The video is of full auto-adjustment software " JEL ALIGN TOOL ". Characteristics Full auto-adjustment software  JEL ALIGN TOOL  comes with Aligner SAL3000HV series that have been released on December 14, 2016. Downtime can be reduced significantly. *Click to go to the page of New Aligner "SAL3000HV Series" (Full auto-adjustment version) (*). (*) Please note that this tool (software) is not for guaranteeing the positioning accuracy after adjustment. Make sure to check the positioning accuracy by using the customer’s inspection device at customer’s side. New type of aligner available for any material of wafer for 200 to 300 mm wafer High-speed, high-accuracy centering and flat/notch locating are available for silicon wafer with BG tape as well as silicon, transparent, or translucent wafer. Equipped with JEL-developed image sensor, and internal motor driver and controller. Size, shape, material of spindle can be changed according to the wafer type. Bernoulli type is also available. Control: RS232C and parallel photo I/O Available for non-SEMI standard notch or flat Optional Z-axis for pick-up/place operation is available. Standard Specifications Carrying Object SEMI standard 200 to 300 mm wafer (Transparent, translucent, silicon) Positioning Time Centering : 3 sec (Wafer pick-up/placing time excluded) Positioning Accuracy Centering: Within ±0.1 mm Flat locating/Notch locating: Within ±0.1 deg Sensor LED light + wafer edge detection with image sensor unit Wafer Size Change By command control or switch Cleanliness ISO Class 2 (at wafer transfer level when exhausting driving part) Driving Method 2-phase stepping motor (for 3 axes) Internal motor driver, controller Utility Power: DC24V±10% 3A Vacuum: -53 kPa or more Outline Drawing Product Lineup Menu Prev Next Icon guide ...Atmosphere ...Vacuum ...Waterproof ...Thin wafer ...CE marking ...JEL's standard spec. ...KCs marking SAL38C3HV SAL38C3HV
../products/handling_5.html	und	1710468952	6392	https://www.jel-robot.com/products/handling_5.html	Products | Introduction Video of Handling (Multi Work Aligner)	Products | Introduction Video of Handling (Multi Work Aligner) Home  >  Products  >  Introduction Video of Handling  >  Multi Work Aligner Introduction Video of Handling Multi Work Aligner Multi work aligner SAL3482HV ： New aligner "SAL3000HV Series" (Full auto-adjustment version) that allows alignment for various kinds of wafers. New type of aligner available for any material of wafer for 100 to 200mm wafer. Available for silicon wafer with BG tape as well as silicon, transparent, or translucent wafer. *Also available for other sizes: SAL3262HV for 2 inch to 150mm wafer and SAL38C3HV for 200 to 300mm wafer  Click here to see the details of SAL3000HV Series (Full auto-adjustment version) Video List Previous Video Next Video Contact Us Click here for general inquiries. Contact Information YouTube Official Channel
../support/form-user.html	und	1710469073	6824	https://www.jel-robot.com/support/form-user.html	Online Support | Software User Registration	Online Support | Software User Registration Home  >  Online Support  >  JEL's various software  >  Software Download >  User Registration Software User Registration For the software user registration, fill in the form below and click the confirmation. We will send you the user ID and password in return. Please fill in the form with the correct information below. Filling an incorrect form may delay your application. Required Company  *Please provide the full company name. URL of company website Required Name Required TEL OK tel Required Country Required Email address Required Re-enter email address Required Confirmation If you understand the content of the above and agree to it, click the box. Send    Reset  Technical Information 
../company/fukuyama_show.html	und	1710468470	11645	https://www.jel-robot.com/company/fukuyama_show.html	Company | Head Office Showroom	Company | Head Office Showroom Home  >  Company  >  Head Office  >  Head Office Showroom Head Office Showroom Contact JEL Corporation Head Office Tel +81-84-932-6500 FAX +81-84-932-6501 E-MAIL Current Displayed Robots New models and main products are on display in Head Office Showroom. Please contact the address above for a visit. 5-Axis Horizontal and Multi-Joint Type Clean Robot: GTFR5280 / Multi work aligner: SAL38C3HV Designed for handling wafers in EFEM. New type of aligner available for any material of wafer for 200 to 300 mm wafer. for 25 wafers batch transfer, 300 mm wafers: KHR3480 Capable of transferring 25 wafers at once. The transfer time can be significantly reduced by batch transfer. Available for the layout with multiple cassettes by equipping a rotation axis. Clean robot with batch end-effector for 5 pieces of wafer: MTCR4160L High-speed handling of cassette with different pitches for such as vertical furnace. Wafer transfer robot: STCR4160SN-300-CM / Aligner: SAL38C2(Optical Aligner) New type of twin-arm clean robot with low-cost, high-speed handling, and no step-out error. Wafer aligner for semiconductor production or inspection lines. Automatic wafer transfer system for wafer container: SSY-20010 High accuracy transport of thin wafer inside the wafer container. Table-top loader system for 100mm wafer: SSY-10000 Available for various types of wafers; 2, 3 inch, 100mm glass, sapphire, SiC, or GaN or others Table-top Loader System: SSY-10000 Resolved the problems and issues caused by manual handling of wafers. Also improved product quality and yield ratio. Bernoulli type end-effector ( Contact type / Non-contact type ) and Bernoulli hand for thin or warped wafer Low-cost Bernoulli type end-effector available for customization. As an ideal end-effector for thin and warped wafers, we provide the Bernoulli type end-effector at its most suitable design according to the customers窶� system layout. Company TOP Head Office Showroom email address of JEL GTFR5280/SAL38C3HV KHR3480 Clean robot with batch end-effector for 5 pieces of wafer Wafer transfer robot/Aligner Automatic wafer transfer system for wafer container SSY-10000 SSY-10000 Bernoulli type end-effector and Bernoulli hand for thin or warped wafer
../site/privacy.html	und	1714442504	5821	https://www.jel-robot.com/site/privacy.html	Privacy Policy	Privacy Policy Home  >  Privacy Policy Privacy Policy JEL Corporation (hereinafter referred to as the "Company") is compliant with Personal Information Protection Low in Japan and handles any and all information pertaining to any personal information. Definition of Personal Information Personal Information is all information pertaining to any person's name, age, telephone number, E-mail address, address, etc. by which such person can be identified. Purpose of Utilize the Personal Information The Personal Information that the Company has obtained shall be used for the following purposes only; 1, When conducting any and all things needed to respond to any enquires 2, When the Company needs to contact or make announcement for the recruitment activities 3, When the Company needs to contact for any other purposes Provision of Any Personal Information to Any Third Party The Company shall never provide any and all Personal Information obtained to any other Third Party without obtaining prior consent. However, the Company may provide any Personal Information to any Third Party, provided that such information falls under any of the following items; 1, Provided by the laws and regulations 2, When required to protect the lives and properties in the cases where it is difficult to obtain consent 3, When required to cooperate the affairs or business concerning information conducted by a state organ, or a local public entity where obtaining consent is likely to hinder the proper execution of the said affairs of business Correction or Deletion of the Personal Information If you wish to correct or delete any Personal Information provided, please contact: The Company will deal with the matter as soon as the Company confirms the identification. Modification of the Personal Information The Company may modify the Privacy Policy from time to time. When any modification is made, the Company will post on the website to bring the users' notice. We regard the users agree to the modification of the Personal Information at the time when users access this site. Cookies Policy The purpose of using cookies on this website is to enhance its usability by saving information related to user choices. Additionally, the collected information may be used for analyzing your website usage patterns, improving the website窶冱 performance, and enhancing the services we provide to you. contact email address
../products/ACTIVE_end.html	und	1710468943	10450	https://www.jel-robot.com/products/ACTIVE_end.html	Products | Edge-grip Type End-Effector	Products | Edge-grip Type End-Effector Home  >  Products  >  縲� Others Edge-grip Type End-Effector Product Video Usage Environment/Specifications Product Profile Model Name Edge-grip Type End-Effector Carrying Size Various sizes are available. Contact us for the detailed specifications. The image above and the video are of edge-grip type end-effector. Characteristics End-effector for handling backside-treated wafer when backside of wafer is inaccessible. Suitable for handling to the drop-in type stage as centering of wafer during operation is available. Air cylinder moves guide back and forth to hold the front-back side of wafer. Holding wafer edge without contacting the backside of wafer Wafer centering is available by holding wafer edge High speed handling is available Guide can check the wafer presence during operation Specifications Material End-effector: Ceramic, Al, CFRP Contact part with wafer: PEEK Surface Treatment Conductive Teflon coating Utility Air哂ir cylinder drive 0.09 MPa or morearies depending on the specifications� Contact us for the detailed specifications. Product Lineup Menu Prev Next Icon guide ...Atmosphere ...Vacuum ...Waterproof ...Single arm ...Twin arm ...Thin wafer ...CE marking ...JEL's standard spec. ...KCs marking Edge-grip end-effector
../news/news20200629.html	und	1710468665	4237	https://www.jel-robot.com/news/news20200629.html	News | Establishment of New Factory	News | Establishment of New Factory Home >  News >  Establishment of New Factory Establishment of New Factory Thank you very much for your outstanding support. JEL is pleased to announce the establishment of a new factory, which will start operation on JUL.1, 2020. This is the 3rd manufacturing base and the largest one in the JEL facilities. It is located near the head office to reinforce the mass production and research & development. This new factory allowing us to decentralize production and react faster to customer needs, which leads the new market development and further improvement of customer satisfaction. Under the new organizational structure at JEL, we will strive to further improve the customer experience and services.  Click here for the page on Saba factory. 
../products/prd_result0.html	und	1710468959	7290	https://www.jel-robot.com/products/prd_result0.html	Products | Lineup	Products | Lineup HOME  >  Products  >  Lineup Lineup Data processing Click the product image or name to go to the product page. Product News 3D CAD Drawings Contact Us Technical Information Products Menu 
../news/event2021_01.html	und	1710468651	9173	https://www.jel-robot.com/news/event2021_01.html	News | SEMICON KOREA 2021	News | SEMICON KOREA 2021 Home  >  News  >  Event News  >  SEMICON KOREA 2021 SEMICON KOREA 2021 We are exhibiting our robots with INA CORP., LTD., a sales agency in Korea. We will exhibit various actual robots, including the latest models. Please visit us and experience our new products. Date   February 03 to 05, 2021 Venue COEX (Convention and Exhibition Center), Seoul, Korea Booth No. A254 LINK  Click here to see the official site INA booth in SEMICON KOREA 2019 Products for Exhibition Horizontal and multi-joint type single-arm robot "GTCR5280" Twin end-effector mounted on the single-arm has the same function as a twin-arm robot. Origin-search is unnecessary by using AC servo motors with absolute encoders. Wafer Transfer Robot "STCR" High reliability: Closed-loop control achieves no step-out error under rapid load change or acceleration. Reduced origin search time: By absolute encoder Event Listings News Top SEMICON KOREA 2021 banner Our booth at SEMICON KOREA 2019 Horizontal and multi-joint type single-arm robot GTCR5280 Warped Wafer Aligner with Auto warp measurement SAL3000HV
../news/event2012_02.html	und	1710468635	4837	https://www.jel-robot.com/news/event2012_02.html	News | SEMICON China 2012	News | SEMICON China 2012 Home  >  News  >  Event News  >  SEMICON China 2012 SEMICON China 2012 Thank you very much for coming to our exhibition booth at Semicon China 2012 during March 20-22. For more information on our products as well as the exhibited products below, please go to the product page or contact us. Products for Exhibition SCR3100S-200-PM (Bernoulli type) Developed low-cost type end-effector to meet the request of many customers. JEL has proposed the most suitable shape of end-effector according to your concept and layout. SCR + SAL3261GR One robot and an aligner can handle 2-6-inch wafer, which offers small footprint. GCR4210-300-AM High-speed wafer handling to the 2 FOUP cassettes placed side by side is available without track axis.Suited for the high-speed handling of 300mm-wafer in the semiconductor manufacturing equipment and inspection equipment. Event Listings News Top SCR3100S-200-PM(Bernoulli type) SCR + SAL3261GR GCR4210-300-AM
../company/fukuyama_solar.html	und	1710468470	4601	https://www.jel-robot.com/company/fukuyama_solar.html	Company | Operation of a solar power plant in Head Office	Company | Operation of a solar power plant in Head Office Home  >  Company  >  Head Office  >  Operation of a solar power plant in Head Office Operation of a solar power plant in Head Office On October 31, 2013, JEL started operation of an approximately 51.2 kw solar power plant in Head Office to promote clean energy. Its 320 solar panels convert the solar light into electricity. This plant has solar electric generating capacity of 53 megawatt-hours in a year, which is expected to cover about 14 households' annual power consumption (*). We will further promote the environmentally-friendly efforts to save energy and electricity. *Calculating 3.6 megawatt-hours per household Reference from the Federation of Electric Power Companies of Japan Company TOP solar power plant of Head Office
../company/outline.html	und	1721267885	7552	https://www.jel-robot.com/company/outline.html	Company | Profile	Company | Profile Home  >  Company  >  Profile Profile Name JEL Corporation Head Office Address 2-8-20, Kusado-cho, Fukuyama-city, Hiroshima, 720-0831 Head Office Tel +81-84-932-6500 Head Office FAX +81-84-932-6501 E-mail Capital 74,570,000 Yen Founded 1993 Closing May (June to May) Representative Nobuo Sakiya Director Yoshinobu Monden, Haruo Sakiya Executive Officer Tamotsu Asano, Shinichiro Matsuoka, Tsuneyuki Kaneta Auditor Katsuhiko Asada Employees 265 (July, 2024) Type of business Manufacture and sales of electronic equipment Major products Wafer transfer robot and wafer handling system for semiconductors FPD glass substrate transfer robot and FPD glass handling system Major clients Semiconductor/FPD equipment manufacturers, Automobile manufacturers Semiconductor/FPD device manufacturers Main Bank MUFG Bank, Ltd. Head Office Entrance of Head Office Map of JEL Head Office   Transportation by taxi It takes 7min. from JR Fukuyama station by taxi. When you take a taxi, please tell the driver to go to the JEL in Kusado-cho. Organization Company TOP JEL Head Office map of JEL Head Office Organization
../support/man002/m002.html	und	1710469127	4679	https://www.jel-robot.com/support/man002/m002.html	Online Support | JELDATA3 Operation Manual | 2. Operating Environment	Online Support | JELDATA3 Operation Manual | 2. Operating Environment Home  >  Online Support  >  Wafer-Search Operation Procedure and Troubleshooting  >  JELDATA3 Operation Manual 縲� 2. Operating Environment JELDATA3 Operation Manual 2. Operating Environment Necessary devices Environment Personal Computer PC/AT Compatible OS Windows95/98/ME/2000/XP/vista(*1)/7(*1) Memory 128M bytes or more recommended Hard Disk 10M bytes or more free space Others COM port 1 Channel (COM1 to COM16� (*1) For vista/7, JELDATA3 Ver. 1.3.1 or more is required. Click here to download the latest version of JELDATA3. Contents 竊殖ack Next竊�  Technical Information 
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../products/SSY-20010.html	und	1710468971	14150	https://www.jel-robot.com/products/SSY-20010.html	Products | SSY-20010 (Automatic wafer transfer system for wafer container)	Products | SSY-20010 (Automatic wafer transfer system for wafer container) Home 〉 Products 〉 〉 System SSY-20010 Automatic wafer transfer system for wafer container Product Video Usage Environment/Specifications Product Profile Product Model SSY-20010 Environment Clean room atmosphere Applicable Cassette Type 300 mm container, 300 mm wafer cassette Wafer Size 300 mm Carrying Object Silicon wafer, spacer (interlayer paper) Various wafer sizes are available. Contact us for the number of wafer containers and cassettes, or aligner installation. The image and video above is of SSY-20010. Characteristics High accuracy transport of thin wafer in the wafer container. Automatic wafer transfer between the wafer container and the wafer cassette. Available for thin wafer as equipped with Bernoulli end-effector. Automatic identification of wafer and the spacer (interlayer paper). Automatic identification of the height of wafer. The number of cassettes and the wafer sizes can be customized. Automatic lid opening/closing of the wafer container. Wafer container : made by Achilles Corporation. Fan filter unit (HEPA) is installed for the cleanliness. Color sensor allows spacers (interlayer papers) with different colors to be detected easily. (Please contact JEL for details.) Standard Specifications Various wafer sizes are available. Contact us for the number of wafer containers and cassettes, or aligner installation. Carrying Object 300 mm silicon wafer, 300 mm spacer (interlayer paper) Applicable Cassette Type 300 mm wafer container, 300 mm cassette (FOUP) Cleanliness Fan filter units is installed. External Dimensions 1350 (W) x 1434 (D) x 1900 (H) (mm) Utility Power: AC200V±10%  Clean air: 0.5 MPa 250 NL/min or more  Vacuum: -70kPa or more Mass 450 kg Outline Drawing (Standard) Product Lineup Menu Prev Next Icon guide ...Atmosphere ...Vacuum ...Waterproof ...Thin wafer ...CE marking ...JEL's standard spec. ...KCs marking SSY-20010 (Automatic wafer transfer system for wafer container) SSY-20010
../products/FLIP_UNIT_wrist.html	und	1710468947	10606	https://www.jel-robot.com/products/FLIP_UNIT_wrist.html	Products | Flip Unit	Products | Flip Unit Home  >  Products  >  縲� Others Flip Unit Wrist-block Unit Product Video Usage Environment/Specifications Product Profile Model Name Flip Unit Applicable Wafer 2, 3 inch, 100 to 300mm wafer *Flip unit for 450mm is available Contact us for the details The image above and the video are of Flip Unit. Characteristics Suitable for the system or robot that requires treatment of both sides of wafer. Compact and lightweight design: Minimized by 50% compared to the conventional model. High-speed flip: Speed improved by 20% for 300mm wafer, by 50% for smaller wafers, comparedto the conventional mode Low vibration: Newly developed motor driver and control system enable low vibration Vacuum suction, edge grip, or Bernoulli is available. Standard Specifications Carrying Object 2, 3inch, 100 to 300mm wafer (*Also available for 450mm wafer. Contact us for the detailed specifications.) Operating Range 190deg Carrying Speed (Ave.) 180deg/sec (300mm wafer) Carrying Speed (Max.) 300deg/sec (300mm wafer) Wafer Holding Method End-effector with vacuum suction, edge grip, or Bernoulli Utility Power: DC24V (Supplied from robot) Contact us for the detailed specifications. Product Lineup Menu Prev Next Icon guide ...Atmosphere ...Vacuum ...Waterproof ...Single arm ...Twin arm ...Thin wafer ...CE marking ...JEL's standard spec. ...KCs marking Flip Unit
../products/SART08661.html	und	1710468963	10873	https://www.jel-robot.com/products/SART08661.html	Products | SART08661 (Wrist-block unit with mapping sensor)	Products | SART08661 (Wrist-block unit with mapping sensor) Home  >  Products  >  縲� Others SART08661 Wrist-block unit with mapping sensor Usage Environment/Specifications Product Profile Model Name SART08661 Appropriate robot model STCR series Characteristics Designed for checking the wafer state in cassette. Also available for sorter system. Wrist-block unit with mapping sensor (*) for STCR series Standard end-effectors (6 types) are available for this wrist-block (refer to the following table). (*) Mapping sensor is to detect wafer presence and status in each cassette slot. Standard end-effectors available for the wrist-block Click the product image or name below to go to the product page. SC-IW-200 SC-IW-240 SC3-IW-240 SC-YW-227 SC-YW-200 3D-02229 Specifications Contact us for the detailed specifications. Product Lineup Menu Prev Next Icon guide ...Atmosphere ...Vacuum ...Waterproof ...Single arm ...Twin arm ...Thin wafer ...CE marking ...JEL's standard spec. ...KCs marking 
../inquiry/contact.html	und	1735261501	5010	https://www.jel-robot.com/inquiry/contact.html	Contact Us | Contact Information	Contact Us | Contact Information Home  >  Contact Us  >  Contact Information Contact Information Head Office TEL +81-84-932-6500 (Switchboard) +81-84-932-6505 (English speaking sales representative) FAX +81-84-932-6501 E-MAIL Tokyo Branch TEL +81-3-5825-9071 FAX +81-3-5825-9072 E-MAIL Office Hour Office Hour Monday to Friday 8:50-18:00 Close during national holidays, year-and and New Year holidays, and mid-August holidays. After Hours Contact Number Sales (Overseas representative) Matsuoka: +81-80-3891-0920(Cell phone) Service / Maintenance Doi: +81-80-6307-2804(Cell phone) Ito: +81-70-7565-6486(Cell phone) Technical Information 
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../news/event2016_07.html	und	1710468643	5397	https://www.jel-robot.com/news/event2016_07.html	News | Int'l Smart Display & Touch Panel Exhibition 2016	News | Int'l Smart Display & Touch Panel Exhibition 2016 Home  >  News  >  Event News  >  Int'l Smart Display & Touch Panel Exhibition 2016 Int'l Smart Display & Touch Panel Exhibition 2016 Thank you very much for coming to our agent's booth, Challentech International Corporation during the exhibition. For more information on our products, please go to the product page or contact us. Date   August 24-26, 2016 Venue TWTC Nangang Exhibition Hall (Taipei, Taiwan) Booth M936 (4F) Products for Exhibition Tape frame handling robot Safe and secure handling of tape frame. Available for tape frames of 150mm, 200mm, and 300mm. Event Listings News Top Int Touch Taiwan 2016 booth Tape frame handling robot
../news/event2022_01.html	und	1710468652	8574	https://www.jel-robot.com/news/event2022_01.html	News | SEMICON KOREA 2022	News | SEMICON KOREA 2022 Home  >  News  >  Event News  >  SEMICON KOREA 2022 SEMICON KOREA 2022 Thank you very much for coming to our exhibition booth at SEMICON KOREA 2022. For more information on our products as well as the exhibited products below, please go to the product page or contact us . Date   February 09 to 11, 2022 Venue COEX (Convention and Exhibition Center), Seoul, Korea Booth No. A254 INA booth in SEMICON KOREA 2022 Products for Exhibition ■GTFR for 300 mm wafers ■Low head SAL-HV for 300 mm wafers ■KHR for 25 wafers batch transfer (300 mm wafers) ■STCR for 150 or 200 mm chemical compound wafer ■SAL for 150 or 200 mm chemical compound wafer ■MTCR for tape frame for 300 mm wafers ■5-Axis Horizontal and Multi-Joint Type GTCR ■4-Axis cylindrical Coordinate Type STCR Event Listings News Top SEMICON KOREA 2022 banner Our booth at SEMICON KOREA 2022
../company/korea.html	und	1735284345	5807	https://www.jel-robot.com/company/korea.html	Company | Korea Branch	Company | Korea Branch Home  >  Company  >  Korea Branch Korea Branch With the expansion of business in the Korean market, JEL Corporation established JEL Corporation Korea Liaison Office in March 2018. Its status was changed from a liaison office to a branch on April 2020. Address F20Ho, 4F 401,402Ho, 526, Maesonggosaek-ro, Gwonseon-gu, Suwon-si, Gyeonggi-do 16634, Korea Tel Korea: +82-10-3481-6360 Japan: +81-80-6340-9905 (080-6340-9905) E-mail Branch Manager Itaro Ishihara Company TOP JEL Corporation Korea Branch building Korea Branch email address
../news/topics2020.html	und	1710468671	11191	https://www.jel-robot.com/news/topics2020.html	News | Topics 2020	News | Topics 2020 Home  >  News  >  2020 News 2020 November 30 2020 New Year's Holiday Information September 25, 2020 SEMICON TAIWAN 2020 Thanks for coming to the exhibition. July 22, 2020 Summer Holiday Information June 29, 2020 Establishment of New Factory We have established New Factory, JEL窶冱 fourth base in Japan. June 29, 2020 SEMICON CHINA 2020 Thanks for coming to the exhibition. April 8, 2020 Holiday Notice JEL will be closed for a Japanese holiday week: April 25th, 26th and 29th; May 2nd to 6th. April 1, 2020 Korea Liaison Office was changed to Korea Branch on April 1 2020. February 14, 2020 SEMICON CHINA 2020 will be delayed January 31, 2020 SEMICON KOREA was canceled News List News Top SEMICON TAIWAN 2020 New Factory SEMICON CHINA 2020 Korea Liaison Office SEMICON CHINA 2020 will be delayed SEMICON KOREA 2020
../support/man001/t008.html	und	1710469102	5414	https://www.jel-robot.com/support/man001/t008.html	Online Support |8: A wafer placed diagonally over the higher and lower cassettes cannot be detected when wafer-search is started.	Online Support |8: A wafer placed diagonally over the higher and lower cassettes cannot be detected when wafer-search is started. Home  >  Online Support  >  Manuals/Troubleshooting  >  Wafer-Search Operation Procedure and Troubleshooting  >  8: A wafer is placed diagonally and cannot be detected Troubleshooting of Wafer Search Operation 8: A wafer is placed diagonally and cannot be detected The gate width of wafer-search is not correct. As specified in 窶�6: Setting of the detection gate width of wafer (WWG setting)窶� , change it smaller than the current setting. When the setting of the gate width is too large, the gate width above and below the cassette overlap and cross-slotted wafers cannot be detected. For the figure above, 1st slot and 2nd slot are judged as cross-slotted.     (1) The command 窶弃M窶� enables wafer-search to move to the start position.     (2) The command 窶弩FS窶� enables wafer-search to be started.     (3) The command 窶弩FK窶� enables wafer-search to read out whether there are wafers or not.     When wafers are detected, the status 窶�1窶� is displayed per slot. When wafers are not detected, the status is 窶�0窶�.     Thickness error is 窶弩窶� and the off position (cross-slotted) is 窶廢窶�. Contents Back Next  Technical Information wafer placed diagonally
../news/news20141120.html	und	1710468659	4157	https://www.jel-robot.com/news/news20141120.html	News | New Year's Holiday Information	News | New Year's Holiday Information Home  >  News  >  New Year's Holiday Information New Year's Holiday Information JEL will be closed for New Year's holiday from December 27nd, 2014 to January 4th, 2015 (Japan Time). In case of emergency, please contact us at the following e-mail address: News Topics 2014 2013 2012 2011 Event News 2014 2013 2012 2011 2010 2009 2008 
../news/event2011_05.html	und	1710468634	4622	https://www.jel-robot.com/news/event2011_05.html	News | PV Taiwan 2011	News | PV Taiwan 2011 Home  >  News  >  Event News  >  PV Taiwan 2011 PV Taiwan 2011 Thank you for coming PV Taiwan 2011 . We exhibited our new products. For more product information, please go to the products page or contact us. Date: OCT. 5, 2011 (WED) - OCT. 7, 2011 (FRI) Venue: Taipei World Trade Center(TWTC) Products for Exhibition Robot & aligner for 2 to 4 inch wafers for LED : SSCR3115N-150-PM & SSCR2090S-PM & SAL3241GR This robot is specially designed for handling 2-4 inch small wafers such as for LED and PV products. It has minimized footprint and lightweight body. Please visit our booth to see the actual operation of 2 types of robot,armless type and link-arm type. This robot & aligner is especially designed for handling small wafers and has small footprint. There are armless type and link-arm type. Event Listings News Top Robot & aligner for 2 to 4 inch wafers for LED : SSCR3115N-150-PM & SSCR2090S-PM & SAL3241GR
../support/support03.html	und	1710469080	6242	https://www.jel-robot.com/support/support03.html	Online Support | Software Download	Online Support | Software Download Home  >  Online Support  >  JEL's various software  >  Software Download Software Download For a new user User registration is required to download software. Click "User Registration" and enter the necessary information. We will send you an email which contains your "User ID" and "Password". *Please note that for a new user it may take a few days for us to send you your ID and password. For a registered user Enter "User ID" and "Password" and click "Login" to go to the software download page. User ID: Password:  Technical Information User registration Login
../products/SVCR3260.html	und	1710468975	16498	https://www.jel-robot.com/products/SVCR3260.html	Products | SVCR3260 | Wafer Transfer Atmospheric Robot	Products | SVCR3260 | Wafer Transfer Atmospheric Robot Home 縲� Products 縲� 縲� Robot for Semiconductor SVCR3260 3-Axis Cylindrical Coordinate Clean Robot Product Video Usage Environment/Specifications Product Profile Model Name SVCR3260 Environment Vacuum (Temp. 15°C to 50°C) Driving unit咾lean room atmosphere  (Temp. 15°C to 40°C) Arm Single arm Operating Range 520mm (3rd joint center) Vertical Stroke 20mm / 40mm Payload Capacity 2kg (calculated for the arm 3rd joint) List of Product Model Product Model Vertical Stroke SVCR3260-020-PM 20mm SVCR3260-040-PM 40mm The image above and the video are of SVCR3260-040-PM. Characteristics Designed for handling wafers in the vacuum chamber of production line and inspection line. Double payload and superior cost performance compared to SVHR series. Compatible with SVHR series and it is possible to replace or upgrade into SVCR series. Magnetic fluid sealing is used for arm joint. Vacuum sealing: Magnetic fluid sealing and bellows are used. For cleanliness: 5µm mesh filter installed for exhaust ventilation in the arm. Motion monitoring is available. RS232C and parallel photo I/O are standard for control. 2-phase stepping motor installed in all axes. Servo motor type is available. High-speed, high-accuracy wafer handlingby S-curved speed control. Wafer holding: end-effector with passive edge or edge grip type End-effector. End-effector material: CFRP, Al, ceramic, or others. Optimal end-effector is selectable according to the carrying object and line layout. Standard Specifications Representative specifications of SVCR3260-040-PM. It can be changed depending on the carrying object and end-effector type. Specifications of Robot Robot Model SVCR3260-040-PM Carrying Object Wafer up to 300mm Robot Model Type Cylindrical coordinate type Control Axis 3-axis Motor Type Stepping motor Operating Range 3rd joint center Rotation Angle (Theta-axis) Vertical Stroke (Z-axis) 520mm 330deg 40mm Carrying Speed (Ave.) Arm (R-axis) Rotation Angle (Theta-axis) Vertical Stroke (Z-axis) 300mm/sec 120deg/sec 20mm/sec Carrying Speed (Max.) Arm (R-axis) Rotation Angle (Theta-axis) Vertical Stroke (Z-axis) 550mm/sec 170deg/sec 30mm/sec Resolution Arm (R-axis) Rotation Angle (Theta-axis) Vertical Stroke (Z-axis) Below 82µm 0.009deg 1.25µm Handling level 98mm (Mounting level to upper end-effector level Repeatability Within ±0.1mm Cleanliness Magnetic fluid sealing and filter Vacuum resistance 1.33×10 -6 Pa Utility Power: DC24V±10% 8A Specifications of Controller Controller Model C4000 series Interface RS232C and parallel photo I/O Outline Drawing (Standard) Option End-Effector *Click the items below to review the end-effectors other than JEL standard types. Other Option *The teaching box appeared in the table may be unavailable depending on the specifications. Product Lineup Menu Prev Next Icon guide ...Atmosphere ...Vacuum ...Waterproof ...Single arm ...Twin arm ...Thin wafer ...CE marking ...JEL's standard spec. ...KCs marking SVCR3260-040-PM SVCR3260-040-PM
../news/event2009_01.html	und	1710468632	4409	https://www.jel-robot.com/news/event2009_01.html	News | Semicon Korea 2009	News | Semicon Korea 2009 Home  >  News  >  Event News  >  Semicon Korea 2009 Korea 2009 Thank you for coming Semicon Korea 2009. We exhibited our new products. For more product information, please contact us or go to the product page. Dates: JAN.20(Tue) - 22(Thu),2009 Venue: Convention and Exhibition Center (COEX) Seoul, Korea Products for Exhibition Single-Arm Clean Robot for 2-4inch wafer : New model JEL challenge for 450mm / Single-Arm, 4-Axis Horizontal and Multi-Joint Type Clean Robot : New model Event Listings News Top Single-Arm Clean Robot for 2-4inch wafer : New model JEL challenge for 450mm / Single-Arm, 4-Axis Horizontal and Multi-Joint Type Clean Robot : New model
../news/news20200407.html	und	1710468665	3795	https://www.jel-robot.com/news/news20200407.html	News | Holiday Notice: Japanese Holiday Week, Golden Week Holidays of 2019	News | Holiday Notice: Japanese Holiday Week, Golden Week Holidays of 2019 Home  >  News  >  Holiday Notice Holiday Notice JEL will be closed for the following for a Japanese holiday week, Golden Week Holidays: April 25th, 26th and 29th; May 2nd to 6th. In case of emergency, please contact us at the following e-mail address: 
../support/man001/t007.html	und	1710469102	5404	https://www.jel-robot.com/support/man001/t007.html	Online Support |7: Some wafers cannot be detected with wafer-search.	Online Support |7: Some wafers cannot be detected with wafer-search. Home  >  Online Support  >  Manuals/Troubleshooting  >  Wafer-Search Operation Procedure and Troubleshooting  >  7: Some wafers cannot be detected with wafer-search. Troubleshooting of Wafer Search Operation 7: Some wafers cannot be detected with wafer-search. When the orientation flat surface is in the direction of sensor detection, some models (sensors) may not detect wafers. Please refer to the specification. The reflective sensor may not detect wafers from the front of wafers. When teaching, make sure that the position is slightly off the front of wafers. For the sensor using a reflect board, make sure that the teaching has been set at right angle to the reflect board. When the teaching has not been set at right angle to the reflect board, the amount of incident light decreases and wafers may not be detected correctly. When the speed of wafer-search becomes faster, the detection width tends to be smaller than the actual wafer width. Refer to 窶�8: Setting of the speed of wafer search (WSP setting)窶� of Wafer-Search Operation Procedure and set it smaller. Also refer to 窶�4: Setting of the minimum detection width of wafer (WWN setting)窶� of Wafer-Search Operation Procedure and change the setting. Contents Back Next  Technical Information 
../support/ws_proc_memu.html	und	1710469082	8069	https://www.jel-robot.com/support/ws_proc_memu.html	Online Support | Wafer-Search Operation Procedure and Troubleshooting 	Online Support | Wafer-Search Operation Procedure and Troubleshooting Home  >  Online Support  >  Manuals/Troubleshooting  >  Wafer-Search Operation Procedure and Troubleshooting Wafer-Search Operation Procedure and Troubleshooting Wafer-search is a function to check the wafer condition or wafer presence status in the cassettes. This reference manual does not guarantee the results of any operation conducted by a customer. Please pay sufficient attention when performing the operation. For any questions, please feel free to contact us at the address below. JEL Corporation 2-8-20, Kusado-cho, Fukuyama-city, Hiroshima, 720-0831 Japan Tel: +81-84-932-6500 FAX: +81-84-932-6501 E-mail: Contact sales representative or Service Engineering Section. Wafer-Search Operation Procedure For wafer-search, follow the procedures as follows. Prepare the necessary equipment Wafer-search setting 1: Setting of the lowest slot of the cassette (WLO setting) Wafer-search setting 2: Setting of the highest slot of the cassette (WHI setting) Wafer-search setting 3: Setting of the number of cassette slots (WFC setting) Wafer-search setting 4: Setting of the minimum detection width of wafer (WWN setting) Wafer-search setting 5: Setting of the maximum detection width of wafer (WWM setting) Wafer-search setting 6: Setting of the detection gate width of wafer (WWG setting) Wafer-search setting 7: Setting of the stop position of wafer search completion (WEND setting) Wafer-search setting 8: Setting of the speed of wafer search (WSP setting) Wafer-search setting 9: Teaching and setting of the start position of wafer search Wafer-search setting 10: Execution of wafer search Wafer-search setting 11: Reading out of the wafer search results Wafer-search setting 12: Reading out of the detection width of wafer search Wafer-search setting 13: Output the results of wafer-search to I/O Wafer-search setting 14: Output the results of wafer-search and the wafer condition to I/O Troubleshooting of Wafer Search 1: Wafer-search sensor does not respond. 2: Error 窶廢08窶� or 窶廚ommand Error窶� occurs and wafer-search does not start. 3: Search failure occurs in the middle slot of the cassette when wafer-search is started. 4: Search failure occurs in the low slot of the cassette when wafer-search is started. 5: Search failure occurs in the top slot of the cassette when wafer-search is started. 6: Search failure occurs when wafer-search is started using a thin wafer. 7: Some wafers cannot be detected with wafer-search. 8: A wafer is placed diagonally and cannot be detected. 9: A wafer cannot be detected when wafer-search is started after cassettes have been changed. 10: After changing wafer-search data and its setting, wafer-search data is found to disappear. 11: The results of wafer-search differ between via Parallel I/O and via serial communication. 12: The results or wafer-search differ from the actual wafer condition.  Technical Information 
../products/C5000S_cont.html	und	1710468945	10200	https://www.jel-robot.com/products/C5000S_cont.html	Products | C5000S | Controller	Products | C5000S | Controller Home  >  Products  >  縲� Others C5000S Controller Usage Environment/Specifications Product Profile Model Name C5000S Interface RS232C and parallel photo I/O The image above is of C5000S. Characteristics JEL has accumulated know-how on methods of the controller development of our robots for semiconductors or FPD. Customization is available. Contact us for the detailed specifications. Compact and lightweight design Yaskawa Electric Corporation Servo Motor Controller interface: RS232C and parallel photo I/O (8 bit IN and OUT, I/O extension available) are standard. High-speed and smooth operation by S-curved speed control Easy teaching with the teaching box Flexible combined operations by compound commands Standard Specifications Outline Drawing (Standard) Product Lineup Menu Prev Next Icon guide ...Atmosphere ...Vacuum ...Waterproof ...Single arm ...Twin arm ...Thin wafer ...CE marking ...JEL's standard spec. ...KCs marking C5000S C5000S
../support/man001/w014.html	und	1710469108	5918	https://www.jel-robot.com/support/man001/w014.html	Online Support |14: Output the results of wafer-search and the wafer condition to I/O	Online Support |14: Output the results of wafer-search and the wafer condition to I/O Home  >  Online Support  >  Manuals/Troubleshooting  >  Wafer-Search Operation Procedure and Troubleshooting  >  14唹utput the results of wafer-search and the wafer condition to I/O Wafer-Search Operation Procedure 14唹utput the results of wafer-search and the wafer condition to I/O After executing wafer-search ( 10: Execution of wafer search ), output the results of wafer-search and the wafer condition to I/O. Output the results of wafer-search and the wafer condition via serial communication. Input the following commands for configuration: Select: Designate the number of slots to be output When executing the commands, the data whether there are wafers or not in the slots which correspond to the output data and the wafer conditions are output to I/O. Output the data whether there are wafers or not to the output data 0-3, and output the wafer conditions to the output data 4-7. 笳hether there are wafers or not:       "ON" : Wafer is detected.       "OFF": Wafer is not detected. 笳afer condtions:   When the data whether there are wafers or not is "ON":       "ON" : Normal       "OFF": Double   When the data whether there are wafers or not is "OFF":       "ON" : Cross-slotted       "OFF": None (including errors other than double or cross-slotted� Contents Back  Technical Information 
../recruit/index.html	und	1710469013	3480	https://www.jel-robot.com/recruit/index.html	Employment | Employment TOP	Employment | Employment TOP Home  >  Employment Employment  Please click here for the employment page (in Japanese). Employment Employment (Japanese) 
../support/man001/w004.html	und	1710469105	5145	https://www.jel-robot.com/support/man001/w004.html	Online Support | 4: Setting of the minimum detection width of wafer (WWN setting)	Online Support | 4: Setting of the minimum detection width of wafer (WWN setting) Home  >  Online Support  >  Manuals/Troubleshooting  >  Wafer-Search Operation Procedure and Troubleshooting  >  4: Setting of the minimum detection width of wafer (WWN setting) Wafer-Search Operation Procedure 4: Setting of the minimum detection width of wafer (WWN setting) Set the minimum detection width of wafer to be used. When the width detected in wafer-search is smaller than the minimum detection width , it is judged as thickness error. Set the minimum detection width of wafer via serial communication. Input the following commands for configuration: Input the minimum detection width in 窶廛EC窶�. Obtain the current designated data Data to be set Contents Back Next  Technical Information minimum detection width of wafer
../products/prd_result2.html	und	1710468959	13011	https://www.jel-robot.com/products/prd_result2.html	Products | Aligner	Products | Aligner HOME  >  Products  >  Aligner Aligner Search for Carrying Object 2'' 3'' 100mm 125mm 150mm 200mm 300mm Holding Method Vacuum Edge Grip Bernoulli Show all Material Silicon Transparent Show all Data processing Click the product image or name to go to the product page. Product News 3D CAD Drawings Contact Us Technical Information Products Menu 
../news/event2020_01_1.html	und	1710468649	6767	https://www.jel-robot.com/news/event2020_01_1.html	News | SEMICON KOREA was canceled	News | SEMICON KOREA was canceled Home  >  News  >  Event News  >  SEMICON KOREA was canceled SEMICON KOREA was canceled With the World Health Organization窶冱 (WHO) declaration of the coronavirus as a public health emergency of international concern (PHEIC) on Jan. 30, SEMI will no longer host SEMICON Korea 2020 that had been scheduled from Feb. 5 to 7.  Click to see the official page. Event Listings News Top SEMICON KOREA 2020 banner
../products/handling_14.html	und	1710468952	6293	https://www.jel-robot.com/products/handling_14.html	Products | Introduction Video of Handling：300mm SORTER SYSTEM (4-port inline type)	Products | Introduction Video of Handling：300mm SORTER SYSTEM (4-port inline type) Home  >  Products  >  Introduction Video of Handling  >  300mm SORTER SYSTEM (4-port inline type) Introduction Video of Handling 300mm SORTER SYSTEM (4-port inline type) 300mm SORTER SYSTEM (4-port inline type with 300 wafers/h throughput) : Pick up 300 mm wafers from FOUP cassette and sort. Loading/unloading wafer is also available besides sorting. Other types of SORTER SYSTEM: 300mm SORTER SYSTEM (4-port facing type with 400 wafers/h throughput) 300mm SORTER SYSTEM (4-port inline type with 600 wafers/h throughput) 150mm SORTER SYSTEM Video List Previous Video Next Video YouTube Official Channel
../products/SWCR3160CS.html	und	1710468975	15807	https://www.jel-robot.com/products/SWCR3160CS.html	Products | SWCR3160CS (Waterproof) | Wafer Transfer Atmospheric Robot	Products | SWCR3160CS (Waterproof) | Wafer Transfer Atmospheric Robot Home 縲� Products 縲� 縲� Robot for Semiconductor SWCR3160CS (Waterproof) 3-Axis Cylindrical Coordinate Clean Robot Product Video Usage Environment/Specifications Product Profile Model Name SWCR3160CS Environment Clean room atmosphere Arm Single arm Operating Range 312mm (3rd joint center) Vertical Stroke 200mm / 300mm Payload Capacity Below 3kg (calculated for the arm 3rd joint) List of Product Model Product Model Vertical Stroke SWCR3160CS-200-PM 200mm SWCR3160CS-300-PM 300mm The image above and the video are of SWCR3160CS-200-PM (Waterproof). Characteristics Designed for handling 300mm wafers in a LSI production line under the condition of acid or alkaline mist (IP64). Flip and edge grip functions are available. Corrosion protection for arm by Teflon coating V-type seals are used for waterproof of arm joint. Viton seals are used for parts joint. Bellows are used for waterproof of vertical axis. Motion monitoring is available. RS232C and parallel photo I/O are standard for control. 2-phase stepping motor installed in all axes. High-speed, high-accuracy wafer handlingby S-curved speed control. Wafer holding: end-effector with vacuum suction, passive edge, or edge grip type End-effector. Optimal end-effector is selectable according to the carrying object and line layout. Standard Specifications Example of standard specifications with edge grip type end-effector. Specifications of Robot Carrying Object Wafer up to 300mm Wafer Holding Method By edge grip Robot Model Type Cylindrical coordinate type Control Axis 3-axis Motor Type Stepping motor Operating Range From the robot center to the wafer center Rotation Angle (Theta-axis) Vertical Stroke (Z-axis) 312mm 340deg 300mm Carrying Speed (Ave.) Arm (R-axis) Rotation Angle (Theta-axis) Vertical Stroke (Z-axis) 250mm/sec 120deg/sec 70mm/sec Carrying Speed (Max.) Arm (R-axis) Rotation Angle (Theta-axis) Vertical Stroke (Z-axis) 500mm/sec 160deg/sec 85mm/sec Resolution Arm (R-axis) Rotation Angle (Theta-axis) Vertical Stroke (Z-axis) Below 49µm 0.0214deg Below 12.5µm Handling level 255mm (Mounting level to end-effector level) Repeatability Within ±0.2mm Utility Power: DC24V±10% 15A; Positive pressure: 0.15MP Specifications of Controller Controller Model C4000 series Interface RS232C and parallel photo I/O Outline Drawing (Standard) Option End-Effector *Click the items below to review the end-effectors other than JEL standard types. Other Option Product Lineup Menu Prev Next Icon guide ...Atmosphere ...Vacuum ...Waterproof ...Single arm ...Twin arm ...Thin wafer ...CE marking ...JEL's standard spec. ...KCs marking SWCR3160CS-400-PM SWCR3160CS-300-PM
../news/event2013.html	und	1710468636	6321	https://www.jel-robot.com/news/event2013.html	News | Event News 2013	News | Event News 2013 Home  >  News  >  Event News  >  2013 Event News 2013 SEMICON Japan 2013 Date: December 4-6, 2013 Main exhibition machine type Clean robot & Aligner for handling 450mm wafer: GCR4280-420-AM/SAL30J1HV (New model) Clean robot & Aligner for handling wafer: STCR4160SN-300-PM (New model)/SAL3481HV (New model) Table-top loader system: SSY-10000 Clean robot for handling wafer & Bernoulli type aligner: STCR4160SN-300-PM (New model)/SAL3481 Bernoulli type end-effector and Bernoulli type wafer handling tool for thin or warped wafer: Bernoulli Hand: BRP-01 Click here for details.   SEMICON Taiwan 2013 Date: September 4-6, 2013 Main exhibition machine type Bernoulli hand Bernoulli type end-effector for thin or warped wafersanufactured by JEL� High speed handling MTCR: MTCR4160CS-300 Compact clean robot & Aligner for handling 2, 3 inch, 100, 150mm wafers: SCR3100S-200-PM/SAL3261GR Click here for details.   OPTO Taiwan 2013 Date: June 18-20, 2013 Main exhibition machine type High speed handling MTCR: MTCR4160CS-300 Bernoulli type end-effector for thin or warped wafersanufactured by JEL� Compact clean robot & Aligner for handling 2, 3 inch, 100, 150mm wafers: SCR3100S-200-PM/SAL3261GR Click here for details.   The 5th LED/OLED Lighting Technology Expo: Lighting Japan Date : Wed., January 16 - Fri., January 18, 2013 Main exhibition machine type Loader/Unloader System for Batch Processing of Trays or Susceptors: SSY-10020 Bernoulli type end-effector for thin or warped wafersanufactured by JEL� Clean robot & Aligner for handling thin, 150-200mm wafers: STCR4160S-300-PM/SAL3682 Compact clean robot & Aligner for handling 2-3-inch, 100-150mm wafers: SCR3100S-200-PM/SAL3261GR Click here for details.   Event Listings News Top 
../news/event2022.html	und	1710468652	7131	https://www.jel-robot.com/news/event2022.html	News | Event News 2022	News | Event News 2022 Home  >  News  >  Event News  >  2022 Event News 2022 SEMICON JAPAN 2022 Date: December 14 to 16, 2022 Major exhibits GTFR for 300 mm wafers SAL-HV for 300 mm wafers KHR for 25 wafers batch transfer (300 mm wafers) MTCR for マ�300 mm TAIKO邃「 wafer SAL forマ�300 mm TAIKO邃「 wafer "TAIKO邃「" is a trademark or registered trademark of DISCO Corporation.  Click here for details.   SEMICON TAIWAN 2022 Date: September 14 to 16, 2022 Major exhibits GTFR for 300 mm wafers Low head SAL-HV for 300 mm wafers STCR for 150 or 200 mm chemical compound wafer SAL for 150 or 200 mm chemical compound wafer  Click here for details.   SEMICON KOREA 2022 Date: February 09 to 11, 2022 Major exhibits GTFR for 300 mm wafers Low head SAL-HV for 300 mm wafers KHR for 25 wafers batch transfer (300 mm wafers) STCR for 150 or 200 mm chemical compound wafer SAL for 150 or 200 mm chemical compound wafer MTCR for tape frame for 300 mm wafers 5-Axis Horizontal and Multi-Joint Type GTCR 4-Axis cylindrical Coordinate Type STCR  Click here for details.   Event Listings News Top 
../support/man001/w012.html	und	1710469107	6331	https://www.jel-robot.com/support/man001/w012.html	Online Support |12: Reading out of the detection width of wafer search	Online Support |12: Reading out of the detection width of wafer search Home  >  Online Support  >  Manuals/Troubleshooting  >  Wafer-Search Operation Procedure and Troubleshooting  >  12: Reading out of the detection width of wafer-search Wafer-Search Operation Procedure 12: Reading out of the detection width of wafer-search After executing wafer-search ( 10: Execution of wafer-search ), read out the detection width of wafers. Read out the detection width of wafer-search via serial communication. Input the following commands for configuration: The results of detected width of wafers are to be read out. The response from the controller is as follows: Response � Return value and Search results The data of detection width Three-digit decimal number without signs Read out the data equivalent to the number of cassette slots only ( 3: Setting of the number of cassette slots (WFC setting) ). For example) To output 窶徨obot $1, 25 slots of the cassette with wafers placed in all slots, neither cross-slotted nor thickness errors, and the detected widths are all 100窶�, the following will be displayed. 橸シ�1100,100,100,100,100,100,100,100,100,100,100,100,100,100,100,100,100,100, 100,100,100,100,100,100,100 *The thickness is different form the actual thickness of wafers. *When speed of wafer-search ( 8: Setting of the speed of wafer-search (WSP setting) ) becomes faster, the detection width tends to be smaller than the actual wafer width. Contents Back Next  Technical Information 
../products/PASSIVE_end.html	und	1710468958	10229	https://www.jel-robot.com/products/PASSIVE_end.html	Products | Passive-edge Holding Type End-Effector	Products | Passive-edge Holding Type End-Effector Home  >  Products  >  縲� Others Passive-edge Holding Type End-Effector Usage Environment/Specifications Product Profile Model Name Passive-edge Holding Type End-Effector Carrying Size Various sizes are available. Contact us for the detailed specifications. Characteristics Suitable for handling warped wafer or thin wafer that cannot be held properly with the standard vacuum suction type end-effector. Designed for handling wafer that can be contacted with the backside of the wafer edge or edge part. Under the wafer's own weight, tapered guide is used to hold wafer (passive grip). Reasonably priced end-effector for handling contact-limited wafer with wafer edge Check the wafer presence with substrate existence sensor in atmospheric condition (option) Specifications Material End-effector: Ceramic, Al, CFRP Surface Treatment Conductive Teflon coating Contact us for the detailed specifications. Product Lineup Menu Prev Next Icon guide ...Atmosphere ...Vacuum ...Waterproof ...Single arm ...Twin arm ...Thin wafer ...CE marking ...JEL's standard spec. ...KCs marking Passive-edge Holding Type End-Effector
../news/news20191128.html	und	1710468665	3717	https://www.jel-robot.com/news/news20191128.html	News | New Year's Holiday Information	News | New Year's Holiday Information Home  >  News  >  New Year's Holiday Information New Year's Holiday Information JEL will be closed for New Year's holiday from December 28th, 2019 to January 5th, 2020 (Japan Time). In case of emergency, please contact us at the following e-mail address: 
../news/news20161117.html	und	1710468661	3427	https://www.jel-robot.com/news/news20161117.html	News | New Year's Holiday Information 2017	News | New Year's Holiday Information 2017 Home  >  News  >  New Year's Holiday Information New Year's Holiday Information JEL will be closed for New Year's holiday from December 29th, 2016 to January 4th, 2017 (Japan Time). In case of emergency, please contact us at the following e-mail address: 
../company/results.html	und	1723176445	3824	https://www.jel-robot.com/company/results.html	Company | Results	Company | Results Home  >  Company  >  Results Results Our monthly accounting reporting procedures follow generally accepted accounting practices which indicate that the ratio of equity capital has been over 50%. Company TOP total number of robot shipments equity capital ratio
../news/news20151117.html	und	1710468660	3537	https://www.jel-robot.com/news/news20151117.html	News | New Year's Holiday Information 2016	News | New Year's Holiday Information 2016 Home  >  News  >  New Year's Holiday Information New Year's Holiday Information JEL will be closed for New Year's holiday from December 29th, 2015 to January 3rd, 2016 (Japan Time). In case of emergency, please contact us at the following e-mail address: 
../products/C4000B_cont.html	und	1710468945	10169	https://www.jel-robot.com/products/C4000B_cont.html	Products | C4000B | Controller	Products | C4000B | Controller Home  >  Products  >  縲� Others C4000B Controller Usage Environment/Specifications Product Profile Model Name C4000B Interface RS232C and parallel photo I/O The image above is of C4000B. Characteristics JEL has accumulated know-how on methods of the controller development of our robots for semiconductors or FPD. Customization is available. Contact us for the detailed specifications. Compact and lightweight design Stepping motor: bipolar stepping motor Controller interface: RS232C and parallel photo I/O (8 bit IN and OUT, I/O extension available) are standard. High-speed and smooth operation by S-curved speed control Easy teaching with the teaching box Flexible combined operations by compound commands Standard Specifications Outline Drawing (Standard) Product Lineup Menu Prev Next Icon guide ...Atmosphere ...Vacuum ...Waterproof ...Single arm ...Twin arm ...Thin wafer ...CE marking ...JEL's standard spec. ...KCs marking C4000B C4000B
../support/qanda/qanda5.html	und	1710469145	18707	https://www.jel-robot.com/support/qanda/qanda5.html	Online Support | When Error Occurs	Online Support | When Error Occurs Home 縲� Online Support  >  Troubleshooting 縲� When Error Occurs Troubleshooting When Error Occurs When Error occurs Check the error number on the controller LED display. [When error occurs] The last four errors are displayed in 2- digit hexadecimal number. The latest error is shown on the leftmost side and the error history is shown in order. [Example of display] Remove the cause of the error (Refer to the below tables) and return to the normal operation. Error "01""02""03""04""05""06" *When errors in the table above occur, Error ("01""02""03""04""05""06") occurs. Cause of the error : Communication setting is wrong. : Noise in the communication cable. : Disconnect/connect RS232C cable or teaching box cable A01-1 Via communication: Execute Command 窶彝D窶� to clear the error. A01-2 Via PLC: Execute PLC command 窶�10h窶� to clear the error. A01-3 Via Teaching Box: Press CLR key to clear the error. Remove the cause of the error and return to the usual operation. Error "*1"(step-out error) When Error "*1"(step-out error) occurs: Error "*1" occurs "*" shows the axis number. Remove the cause of the axis. (1: Arm 1 axis (right), 2: Rotation axis, 3: Arm 2 axis (left), 4: Z-axis, 5: X-axis) Cause of the error : Overload is applied to the axis. : Disconnection or connection problem of the cables between robot and the controller. : Improper setting of the servo data. (Only for SM/AM specs) : Emergency stop (stop by EMG/REM input) : Encoder pulse order contains noise. : Change of the step-out setting value. (not for all the robot type) : Controller driver problem : Motor problem A*1-1 Via communication: Execute Command "RD" to clear the error. A*1-2 Via PLC: Execute PLC command "10h" to clear the error. A*1-3 Via Teaching Box: Press CLR key to clear the error. Remove the cause of the error and return to the usual operation. Make sure there is no interference within the operation range of robot beforehand. It is not necessary to execute "origin search". A*1-4 When the error occurs again: Check if the robot (axis) is excited by moving the robot softly by hand. When moved (not excited), check the motor cable. Connect the cable properly and lock it. A*1-5 Check if there is no interference with the robot. Check the operating environment. When interfered, remove the interference object using teaching box, and recover. A*1-6 Check if the robot can be moved manually when the main power is turned OFF. (Z-axis has a brake and never moves. Also in some models, X-axis (track -axis) has a brake and never moves.) When the robot cannot be operated manually: Check if there is no object interfering with axes. Check if the robot is within the operation range. Check if the main power is turned OFF. Check the breaker. Check if there is no interference. A*1-7 Check if JOG movement is available using the teaching box. If not, check if external stop order is not input from REM or I/O. A*1-8 Check the power supply voltage. Check if driver setting (volume, switch), speed setting, or step-out detection has not been changed. Error "*2" (limit stop) When Error "*2" (limit stop) occurs: Error "*2" occurs "*" shows the axis number. Remove the cause of the axis. (1: Arm 1 axis (right), 2: Rotation axis, 3: Arm 2 axis (left), 4: Z-axis, 5: X-axis) Cause of the error : Each axis reached the movement limit during operation. : Disconnection or connection problem of the cables between robot and the controller. : Disconnection of the limit sensor cable, or sensor failure. : Improper setting or setting change of the software limit. (Only for absolute type) : Current position is out of the operation range. : Change or resetting of the original position. (Only for absolute type) A*2-1 Via communication: Execute Command 窶彝D窶� to clear the error. A*2-2 Via PLC: Execute PLC command 窶�10h窶� to clear the error. A*2-3 Via Teaching Box: Press CLR key to clear the error. Remove the cause of the error and return to the usual operation. It is not necessary to execute "origin search". A*2-4 When the error occurs again: Check the connector. Check if there is no disconnection of the cable. If the cable is loosened or disconnected, turn the power OFF and plug the connector properly. In the case of disconnection, replace the cables. A*2-5 Check if the current position is within the operation range. When the current position is out of the range: Execute the origin search with ORG button of the teaching box. After turning the power OFF, move the robot back around the ORG position manually and restart the operation. For absolute type: check if the setting of the software limit or origin has not been changed. A*2-6 Can the errors be cleared? If not, after turning the power OFF, move the robot back around the ORG position manually and restart the operation. For absolute type: check if the setting of the software limit or origin is not changed. A*2-7 When the error occurs after operating the robot, check the robot serial number and contact JEL service section. Error "*3" (adjust error) When Error "*3" (adjust error) occurs: Error "*3" (adjust error) occurs "*" shows the axis number. Remove the cause of the axis. (1: Arm 1 axis (right), 2: Rotation axis, 3: Arm 2 axis (left), 4: Z-axis, 5: X-axis) Cause of the error : Output error or setting error of the driver. : Setting of ADJUST is wrong. : External stress to the robot. A*3-1 Via communication: Execute Command 窶彝D窶� to clear the error. A*3-2 Via PLC: Execute PLC command 窶�10h窶� to clear the error. A*3-3 Via Teaching Box: Press CLR key to clear the error. Remove the cause of the error and return to the usual operation. It is not necessary to execute "origin search". A*3-4 When the error occurs again: Check the driver setting. When setting is wrong or changed, return the setting to the original one and check again. A*3-5 Check if there is no interference with the robot. When interfered, remove the interference object using teaching box, and recover. A*3-6 Check the ADJUST setting. When the error cannot be cleared, after turning the power OFF, move the robot back around the ORG position manually and restart the operation. For absolute type: check if the setting of the software limit or origin is not changed. A*3-7 When the error occurs after operating the robot, check the robot serial number and contact JEL service section. Error "*4" (displacement during stop) When Error "*4" (displacement during stop) occurs, Error *4 occurs. "*" shows the axis number. Remove the cause of the axis. (1: Arm 1 axis (right), 2: Rotation axis, 3: Arm 2 axis (left), 4: Z-axis, 5: X-axis) Cause of the error : Each axis reached the movement limit during operation. : Disconnection or connection problem of the cables between robot and the controller. : Emergency stop : Encoder pulse order contains noise. : Change of the displacement setting value. (not for all the robot type) : Improper setting of the servo data. A*4-1 Via communication: Execute Command 窶彝D窶� to clear the error. A*4-2 Via PLC: Execute PLC command 窶�10H窶� to clear the error. A*4-3 Via Teaching Box: Press CLR key to clear the error. Remove the cause of the error and return to the usual operation. It is not necessary to execute "origin search". A*4-4 When the error occurs again: Check if the robot (axis) is excited by moving the robot softly by hand. When moved (not excited), check the motor cable. Connect the cable properly and lock it. A*4-5 Check if there is no interference with the robot. When interfered, remove the interference object using teaching box, and recover. A*4-6 Check if the robot can be moved manually when the main power is turned OFF. (Z-axis has a brake and never moves. Also in some models, X-axis (track -axis) has a brake and never moves.) When the robot cannot be operated manually: Check if there is no object interfering with axes. Check if the robot is within the operation range. Check if the main power is turned OFF. Check the breaker. Check if there is no interference. A*4-7 Check if JOG movement is available using the teaching box. If not, check if external stop order is not input from REM or I/O. A*4-8 Check if speed setting has not been changed. Check if driver setting (volume, switch) has not been changed. Check if servo data has not been changed. Check if displacement detection has not been changed. Error "07"(Alarm input stop) When Error "07"(Alarm input stop) occurs: Error "07" occurs Cause of the error : Emergency stop signal is input from teaching box. : Teaching box is disconnected or has connection problem. : Emergency stop signal is input via PLC. : REM terminal is opened. After clear the input signal: A07-1 Via communication: Execute Command "RD" to clear the error. A07-2 Via PLC: Execute PLC command "10h" to clear the error. A07-3 Via Teaching Box: Press CLR key to clear the error. Remove the cause of the error and return to the usual operation. It is not necessary to execute "origin search". Error "08"(Command error) When Error "08"(Command error) occurs: Error "08" occurs Cause of the error : Command format is wrong. : Command usage is wrong. : Command is input during operation. A08-1 Via communication: Execute Command "RD" to clear the error. A08-2 Via PLC: Execute PLC command "10h" to clear the error. A08-3 Via Teaching Box: Press CLR key to clear the error. Remove the cause of the error and return to the usual operation. It is not necessary to execute "origin search". Error "75"(Interlock error) When Error "75"(Interlock error) occurs: Error "75" occurs Cause of the error : Robot moves while the interlock input is OFF. After turning the interlock input ON: A75-1 Via communication: Execute Command "RD" to clear the error. A75-2 Via PLC: Execute PLC command "10h" to clear the error. A75-3 Via Teaching Box: Press CLR key to clear the error. Remove the cause of the error and return to the usual operation. It is not necessary to execute "origin search". Error "77"(Servo alarm) When Error "77"(Interlock error) occurs: Error "77" occurs Cause of the error : Overload is applied to each axis. : Disconnection or connection problem of the cables between robot and the controller. : Servo alarm is input. : Voltage shortage A77-1 Via communication: Execute Command "RD" to clear the error. A77-2 Via PLC: Execute PLC command "10h" to clear the error. A77-3 Via Teaching Box: Press CLR key to clear the error. Remove the cause of the error and return to the usual operation. It is not necessary to execute "origin search". *Note: Error 77 cannot be cleared depending on the robot specifications. In this case, turn the power OFF and recover. A77-4 When the error occurs again: Check the driver alarm on the display. When alarm is displayed: Check each axis and turn the main power OFF. Wait 15 sec and check again. If the error occurs again, check the robot serial number and contact JEL service section. A77-5 Clear the error and check if JOG operation is available using teaching box. If JOG operation is not available, check the operation parameter. Check the original position. A77-6 Operate the robot again, and check the driver status when the error 77 is occurred.  Technical Information 
../company/saba2.html	und	1710468473	4556	https://www.jel-robot.com/company/saba2.html	Company | Establishment of New Factory	Company | Establishment of New Factory Home  >  Company  >  Establishment of New Factory Establishment of New Factory Saba factory JEL is pleased to announce the establishment of a new factory, which will start operation on JUL.1, 2020. This new factory allowing us to reinforce the mass production and react faster to various customer needs. Address 245-1 Saba-cho, Fukuyama-city, Hiroshima, 720-0835 Japan Company TOP Saba Factory
../news/event2012_05.html	und	1710468636	7618	https://www.jel-robot.com/news/event2012_05.html	News | SEMICON Japan 2012	News | SEMICON Japan 2012 Home  >  News  >  Event News  >  SEMICON Japan 2012 SEMICON Japan 2012 Thank you for coming Semicon Japan 2010. We exhibited our new products. For more product information, please go to the products page or contact us. Date: Wed., December 5 - Fri., December 7, 2012 Venue: Makuhari Messe, Chiba Japan JEL booth: No. 4B-607 Products for Exhibition Clean robot & Aligner for handling 450mm wafers: GTCR5365-420-AM/MTCR4240-420-AM with slider/SAL3CJ1 We present the robot and aligner for handling 450 mm wafers. One is accessible horizontally without a slider and the other with a slider. We introduce you to the best transfer option. Bernoulli type end-effector for thin or warped wafersanufactured by JEL� We have developed the low-cost Bernoulli type end-effector. As an ideal end-effector for thin and warped wafers, we provide the Bernoulli type end-effector at its most suitable design according to the customers窶� system layout. In the exhibition you can test it using 300mm wafers or you can bring 150mm-300mm wafers for the test. Twin-arm clean robot with flip unit & Aligner for handling thin, 150mm and 200mm wafers: NEW STCR4160S-300-PMentative�/SAL3481 We introduce you to transfer for thin wafers by using our Bernoulli type end-effector. With twin-arm flip unit robot, we demonstrate transfer for thin, 150mm and 200mm wafers. Aligner for thin wafers, which can handle 150mm and 200mm wafers alike, will also be introduced. Flip unit is installed at both arms to handle both 150mm and 200mm wafers simultaneously. Compact clean robot & Aligner for handling 2-3-inch, 100-150mm wafers: SCR3100S-200-PM/SAL3261GR One robot and one aligner can handle 2-3-inch, 100-150mm wafers. We offer the compact system with flexibility. Event Listings News Top SEMICON Japan2012 Bernoulli type End-effector 
../support/often-14.html	und	1710469075	4318	https://www.jel-robot.com/support/often-14.html	Online Support | Frequently Asked Question : What is "body number"?	Online Support | Frequently Asked Question : What is "body number"? Home  >  Online Support  >  Frequently Asked Question  >  Other troubleshooting Other troubleshooting Q: What is "body number"? A: A body number is an identification number to identify the corresponding controller to output commands when several controllers are connected. In a standard setting, a robot is set to body number 1 and an aligner to body number 2.  Click to see JELDATA3 Operation Manual .  List of FQA  Contact Us 
../products/STCR4130S.html	und	1710468971	23862	https://www.jel-robot.com/products/STCR4130S.html	Products | STCR4130S | Wafer Transfer Atmospheric Robot	Products | STCR4130S | Wafer Transfer Atmospheric Robot Home 縲� Products 縲� 縲� Robot for Semiconductor STCR4130S 4-Axis Cylindrical Coordinate Clean Robot Product Video Usage Environment/Specifications Product Profile Model Name STCR4130S Environment Clean room atmosphere Arm Twin arm Operating Range 255mm (3rd joint center) Vertical Stroke 200mm / 300mm / 400mm / 450mm / 500mm / 550mm / 600mm Payload Capacity Below 3kg (calculated for the arm 3rd joint) List of Product Model Product Model Vertical Stroke STCR4130S-200-PM 200mm STCR4130S-300-PM 300mm STCR4130S-400-PM 400mm STCR4130S-450-PM 450mm STCR4130S-500-PM 500mm STCR4130S-550-PM 550mm STCR4130S-600-PM 600mm The image above and the video are of STCR4160S-300-PM. Characteristics Designed for handling small wafers in a production line or inspection line of semiconductor. Arm lineup: 100mm, 130mm, 160mm, 200mm Twin-arm reduces the wafer swap time. Base or flange mounting type is selectable. Motion monitoring is available. RS232C and parallel photo I/O are standard for control. 2-phase stepping motor installed in all axes. High-speed, high-accuracy wafer handlingby S-curved speed control. Wafer holding: end-effector with vacuum suction, passive edge, edge grip type End-effector. End-effector material: CFRP, Al, ceramic, or others. Optimal end-effector is selectable according to the carrying object and line layout. Standard Specifications Example of standard specifications with JEL standard end-effector (vacuum type) Specifications of Robot Robot Model STCR4130S-200-PM Carrying Object Wafer up to 300mm Wafer Holding Method By vacuum suction Robot Model Type Cylindrical coordinate type Control Axis 4-axis Motor Type Stepping motor Operating Range From the robot center to the wafer center Rotation Angle (Theta-axis) Vertical Stroke (Z-axis) 515mm 340deg 200mm Carrying Speed (Ave.) Arm (R-axis) Rotation Angle (Theta-axis) Vertical Stroke (Z-axis) 470mm/sec 220deg/sec 170mm/sec Carrying Speed (Max.) Arm (R-axis) Rotation Angle (Theta-axis) Vertical Stroke (Z-axis) 940mm/sec 270deg/sec 210mm/sec Repeatability Within ±0.1mm Cleanliness ISO Class 2 (at wafer transfer level when exhausting driving part) Utility Power: DC24V±10% 16A; Vacuum: -53kPa or more Mass Approx. 30kg Specifications of Controller Controller Model C4000 series Interface RS232C and parallel photo I/O Outline Drawing (Standard) Option Wrist-Block Unit Model Name Total Length Mapping Sensor Thickness of Attaching End-Effector SART08674 60mm   2mm SART08604 60mm   2mm SART08675 155mm   2mm SART08661 155mm Available 2mm SART08676 60mm   2mm SART08668 60mm Available 2mm *The table above shows the specifications of JEL standard wrist-block units. The other specifications are available. *Click the items below to review the wrist-block units other than JEL standard types. End-Effector Model Name Size of Carrying Object End-effector Type (Thickness) Wafer Holding Method SC-IW-200 3 inch, 100mm to 200mm I-shape (2mm) Vacuum suction SC-IW-240 3 inch, 100mm to 300mm I-shape (2mm) Vacuum suction SC-YW-200 100mm to 200mm Y-shape (2mm) Vacuum suction SC-YW-227 100mm to 300mm Y-shape (2mm) Vacuum suction SC-YW-240 100mm to 300mm Y-shape (2mm) Vacuum suction 3D-02229 150mm to 300mm Y-shape (2mm) Vacuum suction SC3-YW-240 300mm Y-shape (3mm) Vacuum suction 3D-01661 300mm Y-shape (3mm) Vacuum suction *The table above shows the specifications of JEL standard end-effectors. The other specifications are available. *Click the items below to review the end-effectors other than JEL standard types. Operating Range End-Effector/Wrist-Block Unit SART08674 SART08604 SART08675 SART08661 SART08676 SART08668 SC-IW-200 405mm 405mm 500mm 500mm 405mm 405mm SC-IW-240 445mm 445mm 540mm 540mm 445mm 445mm SC-YW-200 415mm 415mm 510mm 510mm 415mm 415mm SC-YW-227 442mm 442mm 537mm 537mm 442mm 442mm SC-YW-240 455mm 455mm 550mm 550mm 455mm 455mm 3D-02229 455mm 455mm 550mm 550mm 455mm 455mm SC3-YW-240 455mm 455mm 550mm 550mm 455mm 455mm 3D-01661 455mm 455mm 550mm 550mm 455mm 455mm *The operating range in the table that is specified by the combination of the wrist-block unit and end-effector is an example only. The other combinations are available. Other Option *The teaching box appeared in the table may be unavailable depending on the specifications. Product Lineup Menu Prev Next Icon guide ...Atmosphere ...Vacuum ...Waterproof ...Single arm ...Twin arm ...Thin wafer ...CE marking ...JEL's standard spec. ...KCs marking STCR4130S STCR4130S
../news/event2024_03.html	und	1725605972	8238	https://www.jel-robot.com/news/event2024_03.html	News | SEMICON TAIWAN 2024	News | SEMICON TAIWAN 2024 Home  >  News  >  Event News  >  SEMICON TAIWAN 2024 SEMICON TAIWAN 2024 For more information on our products as well as the exhibited products below, please go to the product page or contact us . Date   September 04 to 06, 2024 Venue Taipei Nangang Exhibition Center, Taiwan Booth No. L0300(TaiNEX Hall 1-4F) Booth in SEMICON TAIWAN 2024 Products for Exhibition ■GTFR for 300 mm wafers (Edge-grip type) ■SAL-HV for 300 mm wafers (Edge-grip type Aligner) ■STCR for 300 mm, 200 mm wafers Event Listings News Top SEMICON TAIWAN 2024 banner Our booth at SEMICON TAIWAN 2024
../news/event2015.html	und	1710468639	6591	https://www.jel-robot.com/news/event2015.html	News | Event News 2015	News | Event News 2015 Home  >  News  >  Event News  >  2015 Event News 2015 SEMIOCN Japan 2015 Date: December 16-18, 2015 Main exhibition machine type Horizontal and multi-joint type robot with vertical strokes (DGCR)(Exhibited as reference) Automatic wafer transfer system for wafer container And many more... Click here for details.   SEMIOCN Taiwan 2015 Date: September 2-4, 2015 Main exhibition machine type Automatic wafer transfer system for wafer container Click here for details.   OPTO Taiwan 2015 Date: June 16-18, 2015 Click here for details.   SEMICON China 2015 Date: March 17-19, 2015 Main exhibition machine type Robot for handling 2 inch wafer Logger system Automatic wafer transfer system for wafer container Table-top loader system Robot for handling 300mm wafer Click here for details.   AUTOMATION WORLD (AIMEX) 2015 Date: March 18-20, 2015 Main exhibition machine type Clean robot with batch end-effector for 5 pieces of wafer Logger system Click here for details.   SEMICON Korea 2015 Date: February 4-6, 2015 Main exhibition machine type Clean robot with batch end-effector for 5 pieces of wafer Logger system Click here for details.   7th LED/OLED Lighting Technology Expo Date: January 14-16, 2015 Main exhibition machine type Automatic wafer transfer system for wafer container Logger system Robots for handling 2 inch wafer Table-top loader system Bernoulli type end-effector and Bernoulli type wafer handling tool for thin or warped wafer Click here for details.   Event Listings News Top 
../products/STCR4160S_brnl.html	und	1710468972	16810	https://www.jel-robot.com/products/STCR4160S_brnl.html	Products | STCR4160S (with flip unit) | Wafer Transfer Atmospheric Robot	Products | STCR4160S (with flip unit) | Wafer Transfer Atmospheric Robot Home 縲� Products 縲� 縲� Robot for Semiconductor STCR4160S (with flip unit) 4-Axis Cylindrical Coordinate Clean Robot Product Video Usage Environment/Specifications Product Profile Model Name STCR4160S Environment Clean room atmosphere Arm Twin arm Operating Range 315mm (3rd joint center) Vertical Stroke 200mm / 300mm / 400mm / 450mm / 500mm / 550mm / 600mm Payload Capacity 3kg (calculated for the arm 3rd joint) List of Product Model Product Model Vertical Stroke STCR4160S-200-PM 200mm STCR4160S-300-PM 300mm STCR4160S-400-PM 400mm STCR4160S-450-PM 450mm STCR4160S-500-PM 500mm STCR4160S-550-PM 550mm STCR4160S-600-PM 600mm The image above and the video are of STCR4160S-300-PM (with flip unit). Characteristics Transfer for thin wafers by using our Bernoulli type end-effector. Energy-saving design by installing stepping motor in all axes. Twin arm reduces the wafer swap time. Flip unit is installed at both arms. Base or flange mounting type is selectable. Standard Specifications Example of standard specifications with JEL Bernoulli end-effector. Specifications of Robot Robot Model STCR4160S-300-PM Carrying Object SEMI standard  150, 200mm silicon wafer Wafer Holding Method By Cyclone pad suction and friction generated by friction rubber (Various materials are available for contact parts.) Robot Model Type Cylindrical coordinate type Control Axis 4-axis Motor Type Stepping motor Operating Range From the robot center to the wafer center Rotation Angle (Theta-axis) Vertical Stroke (Z-axis) 640mm 340deg 300mm Carrying Speed (Ave.) Arm (R-axis) Rotation Angle (Theta-axis) Vertical Stroke (Z-axis) 500mm/sec 180deg/sec 200mm/sec Carrying Speed (Max.) Arm (R-axis) Rotation Angle (Theta-axis) Vertical Stroke (Z-axis) 1230mm/sec 300deg/sec 250mm/sec Cleanliness ISO Class 2 (at wafer transfer level when exhausting driving part) Utility Power: DC24V±10% 16A; Positive pressure air: 60 SLM or more (2-vacuum line), 0.1 to 0.3 MPa Mass Approx. 30kg Specifications of Controller Controller Model C4000 series Interface RS232C and parallel photo I/O Outline Drawing (Standard) Option Wrist-Block Unit Model Name Total Length Mapping Sensor Thickness of Attaching End-Effector SART08674 60mm   2mm *The table above shows the specifications of JEL standard wrist-block units. The other specifications are available. *Click the items below to review the wrist-block units other than JEL standard types. End-Effector *Click the items below to review the end-effectors other than JEL standard types. Other Option *The teaching box appeared in the table may be unavailable depending on the specifications. Product Lineup Menu Prev Next Icon guide ...Atmosphere ...Vacuum ...Waterproof ...Single arm ...Twin arm ...Thin wafer ...CE marking ...JEL's standard spec. ...KCs marking STCR4160S-300-PM(with flip unit) STCR4160S-300-PM(with flip unit)
../products/SCR3160CS.html	und	1710468966	23766	https://www.jel-robot.com/products/SCR3160CS.html	Products | SCR3160CS | Wafer Transfer Atmospheric Robot	Products | SCR3160CS | Wafer Transfer Atmospheric Robot Home 縲� Products 縲� 縲� Robot for Semiconductor SCR3160CS 3-Axis Cylindrical Coordinate Clean Robot Product Video Usage Environment/Specifications Product Profile Model Name SCR3160CS Environment Clean room atmosphere Arm Single arm Operating Range 340mm (3rd joint center) Vertical Stroke 200mm / 300mm / 400mm / 450mm / 500mm / 550mm / 600mm Payload Capacity 3kg (calculated for the arm 3rd joint) List of Product Model Product Model Vertical Stroke SCR3160CS-200-PM 200mm SCR3160CS-300-PM 300mm SCR3160CS-400-PM 400mm SCR3160CS-450-PM 450mm SCR3160CS-500-PM 500mm SCR3160CS-550-PM 550mm SCR3160CS-600-PM 600mm The image is of SCR3100CS-200-PM and the video is of SCR3160CS-300-PM. Characteristics Designed for handling small wafers in a production line or inspection line of semiconductor. Arm lineup: 100mm, 130mm, 160mm, 200mm Base or flange mounting type is selectable. Motion monitoring is available. RS232C and parallel photo I/O are standard for control. 2-phase stepping motor installed in all axes. High-speed, high-accuracy wafer handlingby S-curved speed control. Wafer holding: end-effector with vacuum suction, passive edge, edge grip type End-effector. End-effector material: CFRP, Al, ceramic, or others. Optimal end-effector is selectable according to the carrying object and line layout. Standard Specifications Example of standard specifications with JEL standard end-effector (vacuum type) Specifications of Robot Robot Model SCR3160CS-300-PM Carrying Object Wafer up to 300mm Wafer Holding Method By vacuum suction Robot Model Type Cylindrical coordinate type Control Axis 3-axis Motor Type Stepping motor Operating Range From the robot center to the wafer center Rotation Angle (Theta-axis) Vertical Stroke (Z-axis) 502.7mm 340deg 300mm Carrying Speed (Ave.) Arm (R-axis) Rotation Angle (Theta-axis) Vertical Stroke (Z-axis) 610mm/sec 340deg/sec 250mm/sec Carrying Speed (Max.) Arm (R-axis) Rotation Angle (Theta-axis) Vertical Stroke (Z-axis) 1220mm/sec 500deg/sec 320mm/sec Resolution Arm (R-axis) Rotation Angle (Theta-axis) Vertical Stroke (Z-axis) Below 12.6µm 0.0045deg 6.25µm Repeatability Within ±0.1mm Cleanliness ISO Class 2 (at wafer transfer level when exhausting driving part) Utility Power: DC24V±10% 15A; Vacuum: -53kPa or more Mass Approx. 25kg Specifications of Controller Controller Model C4000 series Interface RS232C and parallel photo I/O Outline Drawing (Standard) Option Wrist-Block Unit Model Name Total Length Mapping Sensor Thickness of Attaching End-Effector SARS00169 38mm None 2mm SARS00958 38mm None 3mm SARS02659 75mm None 2mm SARS02967 75mm None 3mm SARS08603 80mm Transmissive sensor/Reflective sensor 2mm *The table above shows the specifications of JEL standard wrist-block units. The other specifications are available. *Click the items below to review the wrist-block units other than JEL standard types. End-Effector Model Name Size of Carrying Object End-effector Type (Thickness) Wafer Holding Method SC-IW-200 3 inch, 100mm to 200mm I-shape (2mm) Vacuum suction SC-IW-240 3 inch, 100mm to 300mm I-shape (2mm) Vacuum suction SC-YW-200 100mm to 200mm Y-shape (2mm) Vacuum suction SC-YW-227 100mm to 300mm Y-shape (2mm) Vacuum suction SC-YW-240 100mm to 300mm Y-shape (2mm) Vacuum suction 3D-02229 150mm to 300mm Y-shape (2mm) Vacuum suction SC3-YW-240 300mm Y-shape (3mm) Vacuum suction 3D-01661 300mm Y-shape (3mm) Vacuum suction *The table above shows the specifications of JEL standard end-effectors. The other specifications are available. *Click the items below to review the end-effectors other than JEL standard types. Operating Range End-Effector/Wrist-Block Unit SARS00169 SARS02659 SARS08603 SARS00958 SARS02967 SC-IW-200 357.7mm 420mm 425mm - - SC-IW-240 397.7mm 460mm 465mm - - SC-YW-200 367.7mm 430mm 435mm - - SC-YW-227 394.7mm 457mm 462mm - - SC-YW-240 407.7mm 470mm 475mm - - 3D-02229 407.7mm 470mm 475mm - - SC3-YW-240 - - - 407.7mm 470mm 3D-01661 - - - 407.7mm 470mm *The operating range in the table that is specified by the combination of the wrist-block unit and end-effector is an example only. The other combinations are available. Other Option *The teaching box appeared in the table may be unavailable depending on the specifications. Product Lineup Menu Prev Next Icon guide ...Atmosphere ...Vacuum ...Waterproof ...Single arm ...Twin arm ...Thin wafer ...CE marking ...JEL's standard spec. ...KCs marking SCR3160CS SCR3160CS-300-PM
../support/support04.html	und	1710469080	3821	https://www.jel-robot.com/support/support04.html	Online Support | Manuals/Troubleshooting	Online Support | Manuals/Troubleshooting Home  >  Online Support  >  Manuals/Troubleshooting Manuals/Troubleshooting Wafer Search Operation Procedure and Troubleshooting Troubleshooting Standard Data Copy Manual Compound Commands Reference Manual  Technical Information 
../news/event2016_05.html	und	1710468643	5002	https://www.jel-robot.com/news/event2016_05.html	News | OPTO Taiwan 2016	News | OPTO Taiwan 2016 Home  >  News  >  Event News  >  OPTO Taiwan 2016 OPTO Taiwan 2016 Thank you very much for coming to our agent's booth, Challentech International Corporation during the exhibition. For more information on our products, please go to the product page or contact us. Date   June 15-17, 2016 Venue TWTC Nangang Exhibition Hall, Taiwan Booth J720 Event Listings News Top OPTO Taiwan 2016 OPTO Taiwan 2016 booth
../products/POROUS_end.html	und	1710468959	10534	https://www.jel-robot.com/products/POROUS_end.html	Products | Porous End-Effector	Products | Porous End-Effector Home  >  Products  >  縲� Others Porous End-Effector Usage Environment/Specifications Product Profile Model Name Porous End-Effector Carrying Size 300mm Characteristics Suitable for handling warped wafer or thin wafer that cannot be held properly with the standard vacuum suction type end-effector. High purity alumina ceramic sintered body is used for the main body of end-effector, and porous ceramic is used for the wafer suction surface. Compared with end-effectors that suction wafer by digging a ditch on the suction surface by approximately 1.5mm, the average micropore diameter of 20 µm can disperse suction pressure centering around the ditch. With this, Porous end-effector can hold thin wafer without deformation. Particle size of mesh is selectable from Grade�100, �220, to �400. Conductive Teflon coating is available for suction surface. Standard Specifications Material High purity alumina ceramic sintered body Material of Suction Surface Porous ceramic Wafer Holding Method Vacuum suction Thickness 3mm Particle Size of Mesh 44 to 74µmrade#220� Average Micropore Diameter 20µmrade#220� Contact us for the detailed specifications. Product Lineup Menu Prev Next Icon guide ...Atmosphere ...Vacuum ...Waterproof ...Single arm ...Twin arm ...Thin wafer ...CE marking ...JEL's standard spec. ...KCs marking Porous End-Effector
../news/event2013_03.html	und	1710468637	6166	https://www.jel-robot.com/news/event2013_03.html	News | SEMICON Taiwan 2013	News | SEMICON Taiwan 2013 Home  >  News  >  Event News  >  SEMICON Taiwan 2013 SEMICON Taiwan 2013 Thank you very much for coming to our exhibition booth at SEMICON Taiwan 2013 during September 4-6. For more information on our products as well as the exhibited products below, please go to the product page or contact us. Date: September 4-6, 2013 Venue: TWTC Nangang Exhibition Hall, Taiwan Booth: No. L700 Products for Exhibition Bernoulli hand Light and compact, the Bernoulli hand holds thin wafers using the Bernoulli principle. Wafer breakage risk is minimized due to non-suction holding. Bernoulli type end-effector for thin or warped wafersanufactured by JEL� We have developed the low-cost Bernoulli type end-effector. As an ideal end-effector for thin and warped wafers, we provide the Bernoulli type end-effector at its most suitable design according to the customers窶� system layout. High speed handling MTCR : MTCR4160CS-300 High speed handling and cost performance are achieved by installing AC servo motors in all axes. Compact clean robot & Aligner for handling 2, 3 inch, 100, 150mm wafers : SCR3100S-200-PM/SAL3261GR We present the robot for safety and high-accuracy handling of 2, 3inch, and 100, 150mm LED sapphire wafer, and the aligner for high-accuracy centering for wafer. We offer the compact system with flexibility. Event Listings News Top SEMICON Taiwan 2013 SEMICON Taiwan 2013 booth Bernoulli hand Bernoulli type end-effector for thin or warped wafers High speed handling MTCR Compact clean robot & Aligner for handling 2-3-inch, 100-150mm wafers:SCR3100S-200-PM/SAL3261GR
../news/news20200722.html	und	1710468665	3500	https://www.jel-robot.com/news/news20200722.html	News | Summer Holiday Information 2020	News | Summer Holiday Information 2020 Home  >  News  >  Summer Holiday Information Summer Holiday Information JEL will be closed for summer holiday from August 13th to August 16th, 2020 (Japan Time). In case of emergency, please contact us at the following e-mail address: 
../news/event2018_04.html	und	1710468647	9608	https://www.jel-robot.com/news/event2018_04.html	News | SEMICON JAPAN 2018	News | SEMICON JAPAN 2018 Home  >  News  >  Event News  >  SEMICON JAPAN 2018 SEMICON JAPAN 2018 Thank you very much for coming to our exhibition booth. For more information on our products as well as the exhibited products below, please go to the product page or contact us . Date   Wed., December 12 - Fri., December 14, 2018 Venue Tokyo Big Sight, Japan Booth East Exhibition Hall 4 4835 (Located between Hall 4 and Hall 5.) Access Map & Floor Plan  Products for Exhibition  JEL booth in Semicon Japan 2018 Access Map & Floor Plan Products for Exhibition ■Automatic wafer transfer system for wafer container ■Warped wafer aligner with auto-adjustment software And more latest models will be exhibited. Event Listings News Top SEMICON JAPAN 2018 logo JEL booth at the exhibition SEMICON JAPAN 2018 booth map
../company/visit.html	und	1710468475	13338	https://www.jel-robot.com/company/visit.html	Company | Factory Tour 	Company | Factory Tour Home  >  Company  >  Head Office  >  Factory Tour Head Office Tour Head Office Appearance The current head office in Kusado-cho, Fukuyama, was originally opened as Fukuyama Factory in August 2008, and the head office functions have been centralized in Fukuyama factory since October 2008. An extended building was completed in May 2015 to improve productivity and quality in manufacturing. The address of the registered head office was changed on December 1, 2018. Entrance At the entrance, we welcome our customers cheerfully. Showroom Looking at the current models operating in the showroom, customers can realize the real instrument under consideration more easily. Tokyo branch also has a similar showroom. Design Room We make our robots and products in the design room. Divided in mechanical, electrical, and soft design sections, each specialist staff desings by working together with each customer and discussing our proposed solution in response to customers窶� request. For new product development, we have developed products to satisfy customers by considering the best forms and accuracy to meet the needs based on sales information. Training Room To realize the product maintenance by customers, we provide maintenance trainings for various robots. Our training menu varies from a 3-day standard to custom programs to meet customers窶� requests. Clean Room 1, 2 Clean Room 1 Area: About 526m 2 Clean Room 2 Area: About 246m 2 Cleanliness: Class 10,000 After assembling the wafer transfer robot for semiconductors and FPD glass substrate transfer robot and conducting a performance inspection and pre-shipment inspection, we make shipment to each user. The HEPA filter (99.97%) ventilates the clean room 25 times an hour. Together with Clean Room 1 and 2, we are capable of manufacturing over 300 robots a month (when robot is converted to our standard robot, SCR series). Clean Room 2 is where parts are assembled by unit to make up robots. Shipping Room / Packing Room Shipping Room / Packing Room is an area we prepare for final packing for the products finished the assembly and inspections. In our last process flow, we put products into the dedicated packages fitting to each shipping product. A roof at the entrance is provided for delivery where large trucks can pull up alongside the building. From small products as represented by robot for semiconductors to large systems, we can deliver regardless of weather conditions. Clean Room 3 Area: About 237m 2 Ceiling height: 4m Cleanliness: Class 10,000 Clean Room 3, new clean room located in the new building completed in May 2015 is equipped with a jib crane. The HEPA filter (99.97%) ventilates the clean room 10 times an hour. Clean Booth Area: About 11.6m 2 (Outside Dimension: W2895 x L4020 x H3525� Cleanliness: Class 1 Air circulation type clean booth installed in a clean room in March 2016 is capable of measuring with larger and a cleaner atmosphere as compared with the existing clean room. (The area and volume are increased by 1.8 times and 2.6 times.) Conventional ULPA filter (99.999% (particle diameter of 0.1 to 0.2 µm)) is improved to ULPA+PTFE filter (99.9999% (particle diameter of 0.1 µm)). To meet a requirement of higher cleanliness, particle measurement is performed in a class 1 clean booth aiming to manufacture reliable products. Clean Room 4 Area: About 129m 2 Ceiling height: 8.5m (Height of the crane from ground: 7m) Cleanliness: Class 100,000 Clean Room 4, new clean room located in the new building completed in May 2015 is equipped with two overhead traveling cranes. The HEPA filter (99.97%) ventilates the clean room 7 times an hour. Large-sized products are manufactured with a high ceiling, estimating the total production of 10 large-sized systems a month. Development Section In the Development Section, the examination of new product specifications or development of new products are conducted to meet the customer's needs. This room is the start of many JEL new products to come. Company TOP Head Office Head Office Head Office showroom design room training room Clean Room 1 Packing Room / Assembly Preparation Room Clean Room 3 Clean booth Clean Room 4 Development Section
../company/kochi_salon.html	und	1710468471	3596	https://www.jel-robot.com/company/kochi_salon.html	Company | Lounge in JEL Kochi	Company | Lounge in JEL Kochi Home  >  Company  >  JEL Kochi  >  Lounge in JEL Kochi Lounge in JEL Kochi Company TOP 
../products/GCR4210_AM.html	und	1710468948	23166	https://www.jel-robot.com/products/GCR4210_AM.html	Products | GCR4210 (Servo motor type) | Wafer Transfer Atmospheric Robot	Products | GCR4210 (Servo motor type) | Wafer Transfer Atmospheric Robot Home 縲� Products 縲� 縲� Robot for Semiconductor GCR4210 (AC servo motor) 4-Axis Horizontal and Multi-Joint Type Clean Robot Product Video Usage Environment/Specifications Product Profile Model Name GCR4210 Environment Clean room atmosphere Arm Single arm Operating Range 400mm (3rd joint center) Vertical Stroke 300mm / 320mm / 500mm Payload Capacity Below 4kg (calculated for the arm 3rd joint) List of Product Model Product Model Vertical Stroke GCR4210-300-AM 300mm GCR4210-320-AM 320mm GCR4210-500-AM 500mm The image above and the video are of GCR4210-300-AM. Characteristics Designed for handling 300mm wafers in a production line or inspection line of semiconductor. Execution of origin search is not required by using the servo motors with absolute encoders. 2 FOUP access is available without a track. Base or flange mounting type is selectable. Motion monitoring is available. AC servo motors with absolute encoders installed in all axes RS232C and parallel photo I/O are standard for control. High-speed, high-accuracy wafer handling by S-curved speed control and optimizing pass control. 1.8 times faster compared to GHR4206 type. End-effector material: CFRP, Al, ceramic, or others. Optimal end-effector is selectable according to the carrying object and line layout. Standard Specifications Example of standard specifications with JEL standard end-effector (vacuum type) Specifications of Robot Robot Model GCR4210-300-AM Carrying Object Up to 300mm silicon wafer Wafer Holding Method By vacuum suction Robot Model Type Horizontal and multi-joint type Control Axis 4-axis Motor Type AC servo motor Operating Range From the robot center to the wafer center Rotation Angle (Theta-axis) Vertical Stroke (Z-axis) 760mm 335deg 300mm Carrying Speed Arm (R-axis) Rotation Angle (Theta-axis) Vertical Stroke (Z-axis) 635mm/0.8sec 335deg/1.0sec 300mm/0.9sec Repeatability Within ±0.1mm Cleanliness ISO Class 2 (at wafer transfer level when exhausting driving part) Utility Power: AC200V Single phase ±10% 2kVA; Vacuum: -53kPa or more Mass Approx. 37kg Specifications of Controller Controller Model C5000S series Interface RS232C and parallel photo I/O Outline Drawing (Standard) Option Wrist-Block Unit Model Name Total Length Mapping Sensor Thickness of Attaching End-Effector SARS00169 38mm None 2mm SARS00958 38mm None 3mm SARS02659 75mm None 2mm SARS02967 75mm None 3mm SARS08603 80mm Transmissive sensor/Reflective sensor 2mm *The table above shows the specifications of JEL standard wrist-block units. The other specifications are available. *Click the items below to review the wrist-block units other than JEL standard types. End-Effector Model Name Size of Carrying Object End-effector Type (Thickness) Wafer Holding Method SC-IW-200 3 inch, 100mm to 200mm I-shape (2mm) Vacuum suction SC-IW-240 3 inch, 100mm to 300mm I-shape (2mm) Vacuum suction SC-YW-200 100mm to 200mm Y-shape (2mm) Vacuum suction SC-YW-227 100mm to 300mm Y-shape (2mm) Vacuum suction SC-YW-240 100mm to 300mm Y-shape (2mm) Vacuum suction 3D-02229 150mm�300mm Y-shape (2mm) Vacuum suction SC3-YW-240 300mm Y-shape (3mm) Vacuum suction 3D-01661 300mm Y-shape (3mm) Vacuum suction SC3-IW-240 300mm I-shape (3mm) Vacuum suction *The table above shows the specifications of JEL standard end-effectors. The other specifications are available. *Click the items below to review the end-effectors other than JEL standard types. Operating Range End-Effector/Wrist-Block Unit SARS00169 SARS02659 SARS08603 SARS00958 SARS02967 SC-IW-200 562.7mm 625mm 630mm - - SC-IW-240 602.7mm 665mm 670mm - - SC-YW-200 572.7mm 635mm 640mm - - SC-YW-227 599.7mm 662mm 667mm - - SC-YW-240 612.7mm 675mm 680mm - - 3D-02229 612.7mm 675mm 680mm - - SC3-YW-240 - - - 612.7mm 675mm 3D-01661 - - - 612.7mm 675mm SC3-IW-240 - - - 602.7mm 665mm *The operating range in the table that is specified by the combination of the wrist-block unit and end-effector is an example only. The other combinations are available. Other Option Product Lineup Menu Prev Next Icon guide ...Atmosphere ...Vacuum ...Waterproof ...Single arm ...Twin arm ...Thin wafer ...CE marking ...JEL's standard spec. ...KCs marking GCR4210-300-AM GCR4210-300-AM
../support/man002/e002.html	und	1710469126	5591	https://www.jel-robot.com/support/man002/e002.html	Online Support | JELDATA3 Operation Manual | Error Messages 	Online Support | JELDATA3 Operation Manual | Error Messages Home  >  Online Support  >  Wafer-Search Operation Procedure and Troubleshooting  >  JELDATA3 Operation Manual 縲� Error Messages Error Messages 2. Errors related to Files 2.1 窶廡ile Open Error窶� Cause: The file could be damaged. Solution: Reinstall the JELDATA3. If the error occurred in the data file, the file can not be recovered. 2.2 窶廡ile Read Error窶� Cause: (1) Read the data file of the different robot from the setting at the [Controller Setup]. Read the data file that was saved in a different controller setting from the current setting. (2) The contents of the data file are changed incorrectly. (3) If an error occurs while [Data Initialization] is executing, the JELDATA3 system file can be changed or damaged. Solution: (1) Read the data file of the robot that is selected at the [Controller Setup]. (Refer to 窶�8.1 Controller Setup" of the JELDATA3 Operation Manual 窶�.) When the data file is correct, select the right robot at [Setup] 竊端Controller Setup] from the menu. (2) Restore the data to the original state. (3) Reselect the robot at [Setup] 竊端Controller Setup] from the menu. (Refer to 窶�8.1 Controller Setup" of the JELDATA3 Operation Manual 窶�.) 2.3 窶廡ile Write Error窶� Cause: Disc space is not enough to save the data file. Solution: Save the data after making enough disk space. Contents 竊殖ack Next竊�  Technical Information 
../products/LHR3400C.html	und	1710468956	16104	https://www.jel-robot.com/products/LHR3400C.html	Products | LHR3400C (FPD glass substrate) | FPD glass substrate transfer robot	Products | LHR3400C (FPD glass substrate) | FPD glass substrate transfer robot Home 縲� Products 縲� 縲� Robot for FPD LHR3400C (FPD glass substrate) 3-Axis Cylindrical Coordinate Clean Robot Usage Environment/Specifications Product Profile Model Name LHR3400C Environment Clean room atmosphere (Temp. 15°C to 40°C) *Vacuum robot:vacuum chamber temp. 15°C to 50°C or less Arm Single arm Operating Range 1550mm (From robot center to substrate center) Vertical Stroke 400mm / 500mm / 600mm 760mm / 900mm / 1500mm Payload Capacity Below 15kg (calculated for the arm 3rd joint) List of Product Model Product Model Vertical Stroke LHR3400C-400-AM 400mm LHR3400C-500-AM 500mm LHR3400C-600-AM 600mm LHR3400C-760-AM 760mm LHR3400C-900-AM 900mm LHR3400C-1500-AM 1500mm The image above is of LHR3400C-900-AM (telescope type for Z-axis: 760mm, 900mm, 1500mm). Characteristics Designed for handling FPD substrate in a PFD production line or inspection line. Telescope type is available for Z-axis of 760mm or longer, which allows the low-passline. Execution of origin search is not required by using the servo motors with absolute encoders. Arm lineup: 400mm, 500mm, 700mm Base or flange mounting type is selectable. Motion monitoring is available. RS232C and parallel photo I/O are standard for control. AC servo motors with absolute encoders installed in all axes. High-speed, high-accuracy glass handling by S-curved speed control. Wafer holding: end-effector with vacuum suction, passive edge, edge grip, or Bernoulli type End-effector End-effector material: CFRP, Al, ceramic, or others. Sensors (for alignment, substrate existence detection, mapping) can be installed in the end-effector. Optimal end-effector is selectable according to the carrying object and line layout. Standard Specifications Representative specifications of LHR3400C-600-AM. It can be changed depending on the carrying object and end-effector type. Specifications of Robot Robot Model LHR3400C-600-AM Carrying Object 730mm×920mm×1.1mm FPD glass substrate(representative example) Robot Model Type Cylindrical coordinate type Control Axis 3-axis Motor Type AC servo motor Operating Range From robot center to substrate center Rotation Angle (Theta-axis) Vertical Stroke (Z-axis) 1550mm 330deg 600mm Carrying Speed (Ave.) Arm (R-axis) Rotation Angle (Theta-axis) Vertical Stroke (Z-axis) 1375mm/1.8sec 180deg/1.5sec 600mm/1.7sec Resolution Arm (R-axis) Rotation Angle (Theta-axis) Vertical Stroke (Z-axis) Below 8.2µm 0.0008deg 2.4µm Handling level 217mm (Mounting level to upper end-effector level Repeatability Within ±0.2mm Cleanliness 0.3µm/cf Class 10 (at transfer level when exhausting driving) Utility Power: AC200V single phase ±10% 3 kVA; Vacuum: -73 kPa or more Outline Drawing (Standard) Option End-Effector *Click the items below to review the end-effectors other than JEL standard types. Other Option Product Lineup Menu Prev Next Icon guide ...Atmosphere ...Vacuum ...Waterproof ...Single arm ...Twin arm ...Thin wafer ...CE marking ...JEL's standard spec. ...KCs marking LHR3400C-900-AM LHR3400C-900-AM
../company/index.html	und	1730174730	7204	https://www.jel-robot.com/company/index.html	Company | Company TOP	Company | Company TOP Home  >  Company Leading Manufacturer of Clean Robot JEL is known as the "Leading Manufacturer of Clean Robot". About JEL Corporation Since the foundation in 1993, JEL has grown as a leading manufacturer of clean robot for semiconductors and FPD glass substrates. JEL robots have been used by more than 2,800 customers worldwide, which has earned us a reputation for high quality products and stable supply system. Aiming at a satisfying life by enjoying both work and private life, our company name, JEL is named after an acronym for "  J ob E njoy L ife " . Network of JEL Corporation Centering on the head Office, JEL has 3 domestic sales and manufacturing bases in Japan. Also JEL's overseas network covers international markets through subsidiary in China, Korea Branch, and overseas agents & partners in Korea, Taiwan, China, USA, and Germany. Our products and services are distributed quickly and smoothly through JEL's domestic and overseas network. Corporate Vision Customer Satisfaction Comes First Reliability with customers and vendors is the foundation of management to provide products that satisfy customers. Innovation and Motivation The best customer service results in a workplace where employees are motivated to be innovative. Speed It is our policy that "the best product would be useless unless the customer receives it in time". Technology and Experience Through the extensive experience and our own technologies, we strive to develop products that exactly meet customers' needs. Reliable Results More than 20-year manufacturing experience provides customers with the best cost performance products. Company key visual JEL robot JEL network
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../products/term006.html	und	1710468976	5823	https://www.jel-robot.com/products/term006.html	Technical Information | Closed-loop Control	Technical Information | Closed-loop Control Home 縲� Technical Information 縲� Closed-loop Control Closed-loop Control In addition to the regular stepping motor and servo motor, the closed-loop type stepping motor has been newly included in our lineup for the drive motor of robot. The closed-loop type stepping motor is used in SCR3000CSN series and STCR4000SN series . In our product model name, "SM" is added in the end for the robot using the closed-loop type stepping motor. What is closed-loop control? The closed-loop control stepping motor has a feedback function which is a characteristics of the servo motor. The rotation-axis and the speed of the motor drive are detected by the rotation detection device (encoder) and are fed back to the motor driver. The closed-loop control is operated so that the difference between the feedback and the rotate instruction that have been previously input from the controller to motor driver will be within a designated deviation. Characteristics of closed-loop control 1. Reliability of positioning will improve. 2. No step-out error under rapid load change, while open-loop type stepping motor may cause a step-out. 3. Deviation is judged by the feedback so that overload detection is enabled. Related Products 
../support/man001/w011.html	und	1710469107	6048	https://www.jel-robot.com/support/man001/w011.html	Online Support |11: Reading out of wafer-search results	Online Support |11: Reading out of wafer-search results Home  >  Online Support  >  Manuals/Troubleshooting  >  Wafer-Search Operation Procedure and Troubleshooting  >  11: Reading out of wafer-search results Wafer-Search Operation Procedure 11: Reading out of wafer-search results After executing wafer-search , read out the results of wafer-search. Read out the results of wafer-search via serial communication. Input the following commands for configuration: This operation reads out the results of wafer-search. The response from the controller is as follows: Response � Return value and Search results Read out the data equivalent to the number of cassette slots ( 窶�3: Setting of the number of cassette slots (WFC setting)窶�) and the following status is displayed: 0: No wafers detected 1: Wafers detected W: Thickness error E: Cross-slotted *The contents of status display varies depending on specifications. Please refer to the instruction manual. For example) To output 窶徨obot $1, 25 slots of the cassette with wafers placed in all slots, neither cross-slotted nor thickness errors", the following status will be displayed. >�11�1�1�1�1�1�1�1�1�1�1�1�1�1�1�1�1�1�1�1�1�1�1�1�1 Contents Back Next  Technical Information 
../products/BERNOULLI_pinset.html	und	1710468944	14505	https://www.jel-robot.com/products/BERNOULLI_pinset.html	Products | BERNOULLI Bernoulli Hand	Products | BERNOULLI Bernoulli Hand Home  >  Products  >  縲� Bernoulli Hand Product Video Usage Environment/Specifications Product Profile Model Name Bernoulli Hand Carrying Object 2 to 3 inch, 100 to 150mm (*) * Also available for 200mm or 300mm. Contact us for the detailed specifications. Click to go to the page of Mechanism of Bernoulli End-Effector. Characteristics Light and compact, the Bernoulli hand holds thin wafers using the Bernoulli principle. Wafer breakage risk is minimized due to non-suction holding. With the flexible front edge, the Bernoulli hand picks up wafers from the wafer containers or wafer cassettes and places wafers in them. Accessible to various substrates as well as wafers. Wafers can be lifted by the Cyclone effect. Wafer holding by the pad (Fluorine-contained rubber) The operator can adjust the hand in various angles with a flexible tube. Standard Specifications Carrying object 2 to 3 inch, 100 to 150mm wafer Material Aluminum Surface treatment Cyclone pad: Black alumite; Other parts of front edge: White alumite Wafer holding By the Bernoulli窶冱 principle using Cyclone pad Payload Below 50g Environment of operation Clean air, N2 Supply pressure Below 0.3MPa (Connection port) Maximum air flow 15L/min Mass 110g No oil is required for the slide parts of release switch. No. of cyclone pads used in standard model: 1 piece Wafer holding by the pad (Fluorine-contained rubber) Mounting bracket: 120-degree type (Standard Model), 90-degree type (Option) Please contact us for the detailed specifications. Pressure and lift force diagram Operating range of flexible tube Model No. Two types of Bernoulli Hand are available. BRP-01 is a short front edge type, which is suitable for horizontal installation or wafer containers. BRP-02 is a long front edge type, which is suitable for horizontally-mounted cassettes. BRP-01(Short front edge) BRP-02(Long front edge) Product Lineup Menu Prev Next Icon guide ...Atmosphere ...Vacuum ...Waterproof ...Single arm ...Twin arm ...Thin wafer ...CE marking ...JEL's standard spec. ...KCs marking Bernoulli Hand
../news/news20220405.html	und	1710468666	3795	https://www.jel-robot.com/news/news20220405.html	News | Holiday Notice: Japanese Holiday Week, Golden Week Holidays of 2022	News | Holiday Notice: Japanese Holiday Week, Golden Week Holidays of 2022 Home  >  News  >  Holiday Notice Holiday Notice JEL will be closed for the following for a Japanese holiday week, Golden Week Holidays: April 29th to May 1st; May 3rd to 5th. In case of emergency, please contact us at the following e-mail address: 
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../products/GCR4280.html	und	1710468948	16357	https://www.jel-robot.com/products/GCR4280.html	Products | GCR4280 (For large diameter wafer) | Wafer Transfer Atmospheric Robot	Products | GCR4280 (For large diameter wafer) | Wafer Transfer Atmospheric Robot Home 縲� Products 縲� 縲� Robot for Semiconductor GCR4280 (For large diameter wafer) 4-Axis Horizontal and Multi-Joint Type Clean Robot Product Video Usage Environment/Specifications Product Profile Model Name GCR4280 Environment Clean room atmosphere Arm Single arm Operating Range 553mm (3rd joint center) Vertical Stroke 300mm / 420mm Payload Capacity Below 4kg (calculated for the arm 3rd joint) List of Product Model Product Model Vertical Stroke Standard GCR4280-300-AM 300mm   GCR4280-420-AM 420mm The image above and the video are of GCR4280-300-AM. Characteristics Designed for handling large diameter wafer in a production line or inspection line of semiconductor. Execution of origin search is not required by using the servo motors with absolute encoders. 3 FOUP access is available for robot only (for 300mm wafer). 2 FOUP access is available without a track for 450mm wafer. Base or flange mounting type is selectable. Motion monitoring is available. AC servo motors with absolute encoders installed in all axes. High-speed, high-accuracy wafer handling by S-curved speed control and optimizing pass control. Wafer holding: end-effector with vacuum suction, passive edge, or edge grip. End-effector material: CFRP, Al, ceramic, or others. Optimal end-effector is selectable according to the carrying object and line layout. Standard Specifications Example of standard specifications with JEL standard end-effector (vacuum type) for 300mm wafer. Specifications of Robot Robot Model GCR4280-300-AM Carrying Object SEMI standard up to 450mm silicon wafer, small glass substrate Wafer Holding Method By vacuum suction Robot Model Type Horizontal and multi-joint type Control Axis 4-axis Motor Type AC servo motor Operating Range From the robot center to the wafer center Rotation Angle (Theta-axis) Vertical Stroke (Z-axis) 863mm 335deg 300mm Carrying Speed (Ave.) Arm (R-axis) Rotation Angle (Theta-axis) Vertical Stroke (Z-axis) 900mm 250deg/sec 300mm/sec Carrying Speed (Max.) Arm (R-axis) Rotation Angle (Theta-axis) Vertical Stroke (Z-axis) 1300mm 350deg/sec 450mm/sec Resolution Arm (R-axis) Rotation Angle (Theta-axis) Vertical Stroke (Z-axis) 0.0018deg 0.0015deg 1.96µm Handling level 669mm (Base mounting level to end-effector level) Cleanliness ISO Class 2 (at wafer transfer level when exhausting driving part) Repeatability Within ±0.1mm Utility Power: AC200V single phase ±10% 2kVA; Vacuum: -53kPa or more Specifications of Controller Controller Model C5000S series Interface RS232C and parallel photo I/O Outline Drawing (Standard) Option End-Effector *Click the items below to review the end-effectors other than JEL standard types. Other Option Product Lineup Menu Prev Next Contact Us Click here for general inquiries. Contact Information Icon guide ...Atmosphere ...Vacuum ...Waterproof ...Single arm ...Twin arm ...Thin wafer ...CE marking ...JEL's standard spec. ...KCs marking GCR4280-300-AM GCR4280-420-AM
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../support/thanks.html	und	1710469081	4228	https://www.jel-robot.com/support/thanks.html	Online Support | Confirmation page of software user registration	Online Support | Confirmation page of software user registration Home  >  Online Support  >  JEL's various software  >  Software Download  >  Confirmation page of software user registration Confirmation of Software User Registration Thank you very much for your interest in user registration of our software. The confirmation email is sent to the email address you entered on the form. When your application is confirmed we will email you the user ID and password soon. Please note if you register for the first time, it may take a few days. Thank your for your patience.  Technical Information 
../news/event2015_07.html	und	1710468641	5967	https://www.jel-robot.com/news/event2015_07.html	News | SEMICON Japan 2015	News | SEMICON Japan 2015 Home  >  News  >  Event News  >  SEMICON Japan 2015 SEMICON Japan 2015 Thank you very much for coming to our exhibition booth. For more information on our products as well as the exhibited products below, please go to the product page or contact us . Date: Wed., December 16 - Fri., December 18, 2015 Venue: Tokyo Big Sight, Japan JEL booth No.: East Exhibition Hall 5 5321 (Near the center of Hall 5) Products for Exhibition ■Horizontal and multi-joint type robot with vertical strokes (DGCR)(Exhibited as reference) ■Automatic wafer transfer system for wafer container Event Listings News Top SEMICON Japan 2015 JEL booth/SEMICON Japan 2015
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../news/event2014.html	und	1710468638	5384	https://www.jel-robot.com/news/event2014.html	News | Event News 2014	News | Event News 2014 Home  >  News  >  Event News  >  2014 Event News 2014 SEMICON Japan 2014 Date: December 3-5, 2014 Main exhibition machine type Automatic wafer transfer system for wafer container Logger system Clean robot with batch end-effector for 5 pieces of wafer Robots for handling 2 inch wafer Robot for handling petri dishes Click here for details.   SEMICON Taiwan 2014 Date: September 3-5, 2014 Main exhibition machine type Clean robot for handling wafer: STCR4160SN-300-CM (New model) Table-top loader system: SSY-10000 Bernoulli type end-effector and Bernoulli type wafer handling tool for thin or warped wafer: Bernoulli Hand: BRP-02 Click here for details.   6th LED/OLED Lighting Technology Expo Date: January 15-17, 2014 Main exhibition machine type Clean robot & Aligner for handling wafer: STCR4160SN-300-PM (New model)/SAL3481HV (New model) Table-top loader system: SSY-10000 Clean robot for handling wafer & Bernoulli type aligner: STCR4160SN-300-PM (New model)/SAL3481 Bernoulli type end-effector and Bernoulli type wafer handling tool for thin or warped wafer: Bernoulli Hand: BRP-01 Click here for details.   Event Listings News Top 
../products/MCR3160C.html	und	1710468957	16119	https://www.jel-robot.com/products/MCR3160C.html	Products | MCR3160C | Wafer Transfer Atmospheric Robot	Products | MCR3160C | Wafer Transfer Atmospheric Robot Home 縲� Products 縲� 縲� Robot for Semiconductor MCR3160C 3-Axis Cylindrical Coordinate Clean Robot Usage Environment/Specifications Product Profile Model Name MCR3160C Environment Clean room atmosphere Arm Single arm Operating Range 400mm (3rd joint center) Vertical Stroke 300mm / 400mm / 500mm Payload Capacity 4kg (calculated for the arm 3rd joint) List of Product Model Product Model Vertical Stroke Standard MCR3160C-300-AM 300mm   MCR3160C-400-AM 400mm   MCR3160C-500-AM 500mm The image above is of MCR3160C-300-AM. Characteristics Designed for handling 300mm wafers in a production line or inspection line of semiconductor. High-speed handling by AC servo motor and superior cost performance compared to MHR type. Execution of origin search is not required by using the servo motors with absolute encoders. Base or flange mounting type is selectable. Motion monitoring is available. RS232C and parallel photo I/O are standard for control. AC servo motors with absolute encoders installed in all axes. High-speed, high-accuracy wafer handlingby S-curved speed control. Wafer holding: end-effector with vacuum suction, passive edge, edge grip, or Bernoulli type End-effector. End-effector material: CFRP, Al, ceramic, or others. Optimal end-effector is selectable according to the carrying object and line layout. Standard Specifications Example of standard specifications with JEL standard end-effector (vacuum type) Specifications of Robot Robot Model MCR3160C-300-AM Carrying Object Wafer up to 300mm Wafer Holding Method By vacuum suction Robot Model Type Cylindrical coordinate type Control Axis 3-axis Motor Type AC servo motor Operating Range From the robot center to the wafer center Rotation Angle (Theta-axis) Vertical Stroke (Z-axis) 567.7mm 340deg 300mm Carrying Speed(Ave.) Arm (R-axis) Rotation Angle (Theta-axis) Vertical Stroke (Z-axis) 1000mm/sec 360deg/sec 350mm/sec Carrying Speed (Max.) Arm (R-axis) Rotation Angle (Theta-axis) Vertical Stroke (Z-axis) 1800mm/sec 580deg/sec 530mm/sec Resolution Arm (R-axis) Rotation Angle (Theta-axis) Vertical Stroke (Z-axis) Below 9.82µm 0.0015deg 1.96µm Handling level 639mm (Base mounting level to end-effector level) Repeatability Within ±0.1mm Cleanliness ISO Class 2 (at wafer transfer level when exhausting driving part) Utility Power: AC200V single phase ±10% 3kVA; Vacuum: -53kPa or more Specifications of Controller Controller Model C5000S series Interface RS232C and parallel photo I/O Outline Drawing (Standard) Option End-Effector *Click the items below to review the end-effectors other than JEL standard types. Other Option Product Lineup Menu Prev Next Icon guide ...Atmosphere ...Vacuum ...Waterproof ...Single arm ...Twin arm ...Thin wafer ...CE marking ...JEL's standard spec. ...KCs marking MCR3160C-300-AM MCR3160C-300-AM
../news/event2013_01.html	und	1710468637	8060	https://www.jel-robot.com/news/event2013_01.html	News | The 5th LED/OLED Lighting Technology Expo: Lighting Japan	News | The 5th LED/OLED Lighting Technology Expo: Lighting Japan Home  >  News  >  Event News  >  The 5th LED/OLED Lighting Technology Expo: Lighting Japan The 5th LED/OLED Lighting Technology Expo: Lighting Japan Thank you for coming to the 5th LED/OLED Lighting Technology Expo: Lighting Japan. For more product information, please go to the products page or contact us. Date : Wed., January 16 - Fri., January 18, 2013 Venue : Tokyo Big Sight, Japan Booth : No. West Hall 3-2 Products for Exhibition Loader/Unloader System for Batch Processing of Trays or Susceptors :SSY-10020 We present new automatic transfer system for handling LED sapphire wafer. Accurate and speedy automatic loader/unloader for susceptor (tray) is aivailable. We propose the most suitable system according to your concept and layout. Bernoulli type end-effector for thin or warped wafersanufactured by JEL� We have developed the low-cost Bernoulli type end-effector. As an ideal end-effector for thin and warped wafers, we provide the Bernoulli type end-effector at its most suitable design according to the customers窶� system layout. In the exhibition customers had a chance to test it using 300mm wafers or 150mm-300mm wafers they brought for the test. Clean robot & Aligner for handling thin, 150mm-200mm wafers :STCR4160S-300-PM/SAL3682 We introduce you to transfer for thin wafers and small size glass substrates by using our Bernoulli type end-effector. We demonstrate transfer for thin, 150mm and 200mm wafers. Aligner for thin wafers, which can handle 150mm and 200mm wafers alike, will also be introduced. Compact clean robot & Aligner for handling 2-3-inch, 100-150mm wafers :SCR3100S-200-PM/SAL3261GR We present the robot for safety and high-accuracy handling of 2, 3inch, and 100 to 150mm LED sapphire wafer, and the aligner for high-accuracy centering for wafer. We offer the compact system with flexibility. Event Listings News Top The 5th LED/OLED Lighting Technology Expo: Lighting Japan Loader/Unloader System for Batch Processing of Trays or Susceptors:SSY-10020 Bernoulli type end-effector for thin or warped wafers Clean robot & Aligner for handling thin, 150mm-200mm wafers:STCR4160S-300-PM/SAL3682 Compact clean robot & Aligner for handling 2-3-inch, 100-150mm wafers:SCR3100S-200-PM/SAL3261GR
../products/scr.html	und	1710468966	6619	https://www.jel-robot.com/products/scr.html	Products | Small Wafer Handling Robots for MEMS Device and LED Wafer	Products | Small Wafer Handling Robots for MEMS Device and LED Wafer Home  >  Products  >  Product News  >  Small Wafer Handling Robots for MEMS Device and LED Wafer Small Wafer Handling Robots for MEMS Device and LED Wafer LED market is expected to grow in demand for public facilities and general illumination. Small wafers (2 to 6 inch) are used for handling such as LED or compound semiconductor. JEL provides a lineup of various products suited for handling small wafers with a concept of space saving and low cost. Please contact us for a demonstration or document request. Products for handling small wafer 
../products/SSY-10020_s.html	und	1710468970	10960	https://www.jel-robot.com/products/SSY-10020_s.html	Products | SSY-10020 (Loader/Unloader System)	Products | SSY-10020 (Loader/Unloader System) Home 〉 Products 〉 〉 System SSY-10020 (Loader/Unloader System) Wafer transfer system Product Video Usage Environment/Specifications Product Profile Product Model SSY-10020 Environment Clean room atmosphere Wafer Size 100mm wafer, 330mm susceptor/tray Carrying Object Wafer, susceptor, tray Contact us for the detailed specifications. The image above and the video are of SSY-10020. Characteristics New type of wafer handling system for wafers including LED. Automatic loader/unloader for batch processing such as susceptors or trays is achieved. Aligner is installed both for wafers and susceptors, which provides the centering and indexing of wafer notch and susceptors. Standard Specifications Contact us for the detailed specifications. Outline Drawing (Standard) Option Other Option *The teaching box appeared in the table may be unavailable depending on the specifications. Product Lineup Menu Prev Next Icon guide ...Atmosphere ...Vacuum ...Waterproof ...Thin wafer ...CE marking ...JEL's standard spec. ...KCs marking SSY-10020 SSY-10020
../news/event2011_04.html	und	1710468634	4875	https://www.jel-robot.com/news/event2011_04.html	News | SEMICON Taiwan 2011	News | SEMICON Taiwan 2011 Home  >  News  >  Event News  >  SEMICON Taiwan 2011 SEMICON Taiwan 2011 Thank you for coming SEMICON Taiwan 2011 . We exhibited our new products. For more product information, please go to the products page or contact us. Date: SEP. 7, 2011 (WED) - SEP. 9, 2011 (FRI) Venue: TWTC Products for Exhibition Robot & aligner for 2 to 4 inch wafers for LED : SSCR3115N-150-PM & SSCR2090S-PM & SAL3241GR This robot & aligner is especially designed for handling small wafers and has small footprint. There are armless type and link-arm type. 4-Axis Cylindrical Coordinate Type Twin-arm Clean Robot : MTCR4160-300-AM Designed for handling 300mm wafer in a production or inspection line of semiconductor. High-speed handling by AC servo motor and better cost performance compared to MTHR type. Please visit our booth to check the actual operation. Event Listings News Top Robot & aligner for 2 to 4 inch wafers for LED : SSCR3115N-150-PM & SSCR2090S-PM & SAL3241GR 4-Axis Cylindrical Coordinate Type Twin-arm Clean Robot : MTCR4160-300-AM
../news/topics2014.html	und	1710468669	11789	https://www.jel-robot.com/news/topics2014.html	News | Topics 2014	News | Topics 2014 Home  >  News  >  2014 News 2014 December 18, 2014 Company Added a robot to Fukuyama factory showroom. December 16, 2014 New Products SSY-10010 (Automatic wafer transfer system for wafer container) Logger system MTCR4160L (Clean robot with batch end-effector for 5 pieces of wafer) TSCR3060N (Atmosphere robot for 2 inch wafer) TSVCR3060N (Vacuum robot for 2 inch wafer) SAL1021 (Atmosphere aligner for 2 inch wafer) Robot for handling petri dish December 15, 2014 Products Updated the page of Introduction Video of Handling to include the 450mm wafer handling. November 11, 2014 Products Updated the page of Introduction Video of Handling to include the Bernoulli type handling. October 24, 2014 Products Updated the page of Introduction Video of Handling to include the microplate/petri dish handling. October 15, 2014 Company Added a robot to Fukuyama factory showroom. August 6, 2014 Company Updated the Results for year 2014. May 29, 2014 New Products SAL3261HV(Multi work aligner) SAL38C2HV(Multi work aligner) May 21, 2014 Official YouTube channel for JEL Check and see the videos of JEL products uploaded to the official YouTube channel. April 10, 2014 New products release SAL3481HV(Multi work aligner) SCR3160CSN(Closed-loop control) STCR4160SN(Closed-loop control) February 4, 2014 Company Added new robots to J-tech Center. Come and see our new robot display. January 29, 2014 Company Added new robots to Fukuyama factory showroom. Come and see our new robot display. Topic Listings News Top Fukuyama factory showroom New Products Introduction Video of Handling Introduction Video of Handling Introduction Video of Handling Fukuyama factory showroom New Products YouTube New products release J-tech Center Fukuyama factory showroom
../support/qanda/qanda2.html	und	1710469144	7131	https://www.jel-robot.com/support/qanda/qanda2.html	Online Support | Vacuum Troubles	Online Support | Vacuum Troubles Home 縲� Online Support  >  Wafer-Search Operation Procedure and Troubleshooting  >  Vacuum Troubles Troubleshooting Vacuum Troubles Q1. Solenoid valve does not work. A1-1 Check if the connecting part is not loosened or disconnected. Check if VAC and LEAK, AIR and EXH are connected correctly. If the connection is wrong or loosened, connect them properly, and check again. A1-2 Check if the robot power is turned ON. Check if the communication with robot is available. If the power is OFF, supply the power properly, and check again. A1-3 Check if the operation command is correct. Check if the robot can be operated via teaching box. If the command is wrong, check the command with the operation manual. A1-4 Check the pressure display on the pressure switch. If pressure value changes for ON/OFF, solenoid valve is operating. Check the supply lines to the end-effector. If pressure value is not changed regardless of ON/OFF of the solenoid valve, operate the solenoid valve manually. (Refer to the procedures below.) *If vacuum line is connected to the vacuum break port (LEAK), not to the vacuum side (VAC), ON/OFF operation becomes reverse. *It is the same to the positive pressure specs. If positive pressure line is connected to the break port (EXH), not to the positive pressure port (AIR), ON/OFF operation becomes reverse. Procedures for manual operation of solenoid valve 1. Turn the controller power OFF and disconnect the robot cables. 2. Remove the cover of the robot driving area (cable connection side). The solenoid valve is installed around the upper part of the cable connection. 3. Small switches are attached on the top and front side of the solenoid valve (See the figure below). You can turn ON/OFF the solenoid valve manually with these switches. After connecting the cables, turn the power ON and press these switches alternately. Q2. Pressure switch does not work. A2-1 Check if the specified pressure is supplied to the robot. If not, connect them properly, and check again. (Refer to the spec book.) A2-2 Check if the pressure supply part is not loosened or disconnected. Check if VAC and LEAK, AIR and EXH are connected correctly. If the connection is wrong or loosened, connect them properly, and check again. A2-3 Check if the solenoid valve is operating. If not, check the operation according to the procedure窶弉1. Solenoid valve is not operating窶�. A2-4 Check the pressure switch display. If it is not displayed, replace the pressure switch. A2-5 Check if the setting of the pressure switch is correct. If the setting is wrong, readjust the pressure switch correctly. (Refer to the operation manual.) A2-6 Check if cables between the robot and the controller are not loosened or disconnected. If loosened or disconnected, connect them properly and tighten the screw or lock. If the connection is correct, replace the pressure switch.  Technical Information 
../news/event2019_05.html	und	1710468648	9634	https://www.jel-robot.com/news/event2019_05.html	News | SEMICON JAPAN 2019	News | SEMICON JAPAN 2019 Home  >  News  >  Event News  >  SEMICON JAPAN 2019 SEMICON JAPAN 2019 Thank you very much for coming to our exhibition booth. For more information on our products as well as the exhibited products below, please go to the product page or contact us . Date   Wed., December 11 - Fri., December 13, 2019 Venue Tokyo Big Sight, Japan Booth South Exhibition Hall 1 7421 (Located near the entrance of South Hall 1.) Access Map & Floor Plan  Products for Exhibition  JEL booth in Semicon Japan 2019 Access Map & Floor Plan Products for Exhibition ■Automatic 300mm Wafer Transfer System for Wafer Container ■Warped Wafer Aligner with Auto warp measurement And more latest models will be exhibited. Event Listings News Top SEMICON JAPAN 2019 logo JEL booth at the exhibition SEMICON JAPAN 2019 booth map
../products/jelalign.html	und	1710468956	8302	https://www.jel-robot.com/products/jelalign.html	Products | New Aligner "SAL3000HV Series" (Full auto-adjustment version)	Products | New Aligner "SAL3000HV Series" (Full auto-adjustment version) Home  >  Products  >  Product News  >  New Aligner "SAL3000HV Series" (Full auto-adjustment version) New Aligner "SAL3000HV Series" (Full auto-adjustment version) JEL developed new aligner "SAL3000HV Series" (Full auto-adjustment version) that allows alignment for various kinds of wafers. Self-adjustment aligner will save the labor and time of making inquiries or sending the actual aligner to the manufacturer. JEL ALIGN TOOL comes with Aligner SAL3000HV series that have been released on December 14, 2016. Modification of the shipped product will be available on request. Please contact our sales representatives for the product details. Applicable Model SAL3000HV Series          SAL3262HV (For 2 inch to 150mm wafer)          SAL3482HV (For 100mm to 200mm wafer)          SAL38C3HV (For 200mm to 300mm wafer) Three features of  "JEL ALIGN TOOL" 1. Software does all Adjustment windows (image) No adjustment of threshold or LED illumination is required. Full auto software does all the adjustment and setting. 2. Just a single click operation Adjust Start button (image) Just click Adjust Start button! ALIGN TOOL speeds up alignment on site. 3. Adjust any wafer materials Wafer Type Auto-adjustment to match any wafer materials Use Conditions Supported OS ○: Supported, ×: Not supported OS 32/64 bit Japanese/English Windows 7 32 ○ 64 Windows 8 32 × 64 Windows 8.1 32 × 64 ○ Windows 10 32 ○ 64 ○ Windows Embedded 32 ○ 64 × Connection: USB (B type) *Please note that this tool (software) is not for guaranteeing the positioning accuracy after adjustment. Make sure to check the positioning accuracy by using the customer’s inspection device at customer’s side. Adjustment windows (image) Adjust Start button (image) wafer types
../products/SCR3160CSN.html	und	1710468967	25128	https://www.jel-robot.com/products/SCR3160CSN.html	Products | SCR3160CSN (Closed-loop control)	Products | SCR3160CSN (Closed-loop control) Home 〉 Products 〉 〉 Robot for Semiconductor SCR3160CSN (Closed-loop control) 3-Axis Cylindrical Coordinate Clean Robot Product Video Usage Environment/Specifications Product Profile Model Name SCR3160CSN Environment Clean room atmosphere Arm Single arm Operating Range 340mm (3rd joint center) Vertical Stroke 200mm / 300mm / 400mm / 450mm / 500mm Payload Capacity 3kg (calculated for the arm 3rd joint) List of Product Model Product Model Vertical Stroke SCR3160CSN-200-CM 200mm SCR3160CSN-300-CM 300mm SCR3160CSN-400-CM 400mm SCR3160CSN-450-CM 450mm SCR3160CSN-500-CM 500mm The image above is of SCR3160CSN-300-CM and the video shows SCR3160CS-300-PM . Characteristics Path planning handling has joined the lineup of clean robot with the closed-loop control. Access to the chamber stage arranged in parallel without a track improves the flexibility in the layout design and the cost-performance. * Click to go to the page of the path planning handling video. New type of 3-axis cylindrical coordinate type single-arm clean robot For handling wafers from 2 inch to 300mm with low-cost, high-speed handling, and no step-out error High reliability: Closed-loop control achieves no step-out error under rapid load change or acceleration. Reduced origin search time: By absolute encoder Equipped with the batteryless multi-rotation absolute sensor Robot replacement is available: Compatible with conventional model (installation/performance) High rigidity: Payload capacity of 3kg (calculated for the arm 3rd joint/including wrist-block, end-effector, and wafer) Arm lineup: 100mm, 130mm, 160mm, 200mm Base or flange mounting type is selectable according to the customer’s system layout. Bernoulli end-effector is available (option) Standard Specifications Example of specifications with JEL standard end-effector (vacuum type) Specifications of Robot Robot Model SCR3160CSN-300-CM Carrying Object Wafer up to 300mm (Available for various types of wafers) Wafer Holding Method By vacuum suction Robot Model Type Cylindrical coordinate type Control Axis 3-axis Motor Type Stepping motor (Closed-loop) Operating Range From the robot center to the wafer center Rotation Angle (Theta-axis) Vertical Stroke (Z-axis) 552.7mm 340deg 300mm Carrying Speed (Ave.) Arm (R-axis) Rotation Angle (Theta-axis) Vertical Stroke (Z-axis) 610mm/sec 340deg/sec 250mm/sec Carrying Speed (Max.) Arm (R-axis) Rotation Angle (Theta-axis) Vertical Stroke (Z-axis) 1220mm/sec 500deg/sec 320mm/sec Resolution Arm (R-axis) Rotation Angle (Theta-axis) Vertical Stroke (Z-axis) Below 10.0µm 0.0015deg 2.0µm Repeatability Within ±0.1mm Cleanliness ISO Class 2 (at wafer transfer level when exhausting driving part) Utility Power: DC24V±10% 10A    Vacuum: -53kPa or more Specifications of Controller Controller Model C4000B series Interface RS232C and parallel photo I/O Outline Drawing (Standard) Option Wrist-Block Unit Model Name Total Length Mapping Sensor Thickness of Attaching End-Effector SARS00169 38mm None 2mm SARS00958 38mm None 3mm SARS02659 75mm None 2mm SARS02967 75mm None 3mm SARS08603 80mm Transmissive sensor/Reflective sensor 2mm *The table above shows the specifications of JEL standard wrist-block units. The other specifications are available. *Click the items below to review the wrist-block units other than JEL standard types. End-Effector Model Name Size of Carrying Object End-effector Type (Thickness) Wafer Holding Method SC-IW-200 3 inch, 100mm to 200mm I-shape (2mm) Vacuum suction SC-IW-240 3 inch, 100mm to 300mm I-shape (2mm) Vacuum suction SC-YW-200 100mm to 200mm Y-shape (2mm) Vacuum suction SC-YW-227 100mm to 300mm Y-shape (2mm) Vacuum suction SC-YW-240 100mm to 300mm Y-shape (2mm) Vacuum suction 3D-02229 150mm to 300mm Y-shape (2mm) Vacuum suction SC3-YW-240 300mm Y-shape (3mm) Vacuum suction 3D-01661 300mm Y-shape (3mm) Vacuum suction SC3-IW-240 300mm I-shape (3mm) Vacuum suction *The table above shows the specifications of JEL standard end-effectors. The other specifications are available. *Click the items below to review the end-effectors other than JEL standard types. Operating Range End-Effector/Wrist-Block Unit SARS00169 SARS02659 SARS08603 SARS00958 SARS02967 SC-IW-200 502.7mm 565mm 570mm - - SC-IW-240 542.7mm 605mm 610mm - - SC-YW-200 512.7mm 575mm 580mm - - SC-YW-227 539.7mm 602mm 607mm - - SC-YW-240 552.7mm 615mm 620mm - - 3D-02229 552.7mm 615mm 620mm - - SC3-YW-240 - - - 552.7mm 615mm 3D-01661 - - - 552.7mm 615mm SC3-IW-240 - - - 542.7mm 605mm *The operating range in the table that is specified by the combination of the wrist-block unit and end-effector is an example only. The other combinations are available. Other Option Product Lineup Menu Prev Next Icon guide ...Atmosphere ...Vacuum ...Waterproof ...Single arm ...Twin arm ...Thin wafer ...CE marking ...JEL's standard spec. ...KCs marking SCR3160CSN SCR3160CSN
../support/man002/m005-5.html	und	1710469129	6146	https://www.jel-robot.com/support/man002/m005-5.html	Online Support | Standard Data Copy Manual | Menu	Online Support | Standard Data Copy Manual | Menu Home  >  Online Support  >  Wafer-Search Operation Procedure and Troubleshooting  >  Standard Data Copy Manual 縲� 5. Menu Standard Data Copy Manual Data Copy Manual 5. Menu (1) File Following is type of files that JELDATA3 supports. ! Caution: Make sure to use JELDATA3 to edit the following files. Do not use other application software (such as the text-editor). It is the same for the files made by the old-version application. File type Extension 窶廣 Data窶� file (point data) adt 窶廬 Data窶� file (compound command) idt 窶廛 Data窶� file (speed data) ddt Parameter file pdt (2) List of the robot series 繝サFor the controller setup, robot type needs to be selected. Select from the 窶廰ist of the robot series窶� (listed below). Setup window for the standard robot Select the robot series from the list and click the [Decide] button. * When [Custom] is selected, some robots may not be found in the list depending on the JELDATA3 ver. Motor: XX of the robot type indicates the motor type (********-***-XX) Example) LTHR4400C-500-AM Motor竊� AM Controller: First two letters of the controller type Example)Robot type: LTHR4400C-500-AM Controller: C6551S-00000 Controller竊辰6*** Robot series: Name of the robot type Example)Robot type:LTHR4400C-500-AM Robot series竊鱈THR, MTHR-AM-C6000 * Refer to the Instruction Manual for the customized specification robots. * Refer to the Instruction Manual for the controller setup. * Refer to the Instruction Manual or the Specification Book for the bank function. Contents 竊殖ack  Technical Information controller setup select the robot series select the robot series list of robot type and robot series
../products/SVCR3190_rigid.html	und	1710468974	14832	https://www.jel-robot.com/products/SVCR3190_rigid.html	Products | SVCR3190 (High rigid type) | Wafer Transfer Atmospheric Robot	Products | SVCR3190 (High rigid type) | Wafer Transfer Atmospheric Robot Home 縲� Products 縲� 縲� Robot for Semiconductor SVCR3190 (High rigid type) 3-Axis Cylindrical Coordinate Clean Robot Product Video Usage Environment/Specifications Product Profile Model Name SVCR3190 Environment Vacuum (Temp. 15°C to 50°C) Driving unit咾lean room atmosphere  (Temp. 15°C to 40°C) Arm Single arm Operating Range 380mm (3rd joint center) Vertical Stroke 40mm Payload Capacity 3kg (calculated for the arm 3rd joint) List of Product Model Product Model Vertical Stroke SVCR3190-040-PM 40mm The image above and the video are of SVCR3260-040-PM. Characteristics Designed for handling wafers in the vacuum chamber of production line and inspection line. Triple payload and superior cost performance compared to SVHR series. Compatible with SVHR series and it is possible to replace or upgrade into SVCR series. Magnetic fluid sealing is used for arm joint. Vacuum sealing: Magnetic fluid sealing and bellows are used. For cleanliness: 5µm mesh filter installed for exhaust ventilation in the arm. Motion monitoring is available. RS232C and parallel photo I/O are standard for control. 2-phase stepping motor installed in all axes. Servo motor type is available. High-speed, high-accuracy wafer handlingby S-curved speed control. Wafer holding: end-effector with passive edge or edge grip type End-effector. End-effector material: CFRP, Al, ceramic, or others. Optimal end-effector is selectable according to the carrying object and line layout. Standard Specifications Representative specifications of SVCR3190-040-PM. It can be changed depending on the carrying object and end-effector type. Specifications of Robot Robot Model SVCR3190-040-PM Carrying Object Wafer up to 300mm Wafer Holding Method By end-effector with passive edge or edge grip type end-effector Robot Model Type Cylindrical coordinate type Control Axis 3-axis Motor Type Stepping motor Operating Range 3rd joint center Rotation Angle (Theta-axis) Vertical Stroke (Z-axis) 380mm 330deg 40mm Carrying Speed Arm (R-axis) Rotation Angle (Theta-axis) Vertical Stroke (Z-axis) 300mm/sec 120deg/sec 20mm/sec Repeatability Within ±0.1mm Cleanliness Magnetic fluid sealing and filter Vacuum resistance 1.33×10 -6 Pa Mass Approx. 25kg Utility Power: DC24V Option End-Effector *Click the items below to review the end-effectors other than JEL standard types. Other Option *The teaching box appeared in the table may be unavailable depending on the specifications. Product Lineup Menu Prev Next Icon guide ...Atmosphere ...Vacuum ...Waterproof ...Single arm ...Twin arm ...Thin wafer ...CE marking ...JEL's standard spec. ...KCs marking SVCR3260-040-PM
../news/event2022_03.html	und	1710468653	8496	https://www.jel-robot.com/news/event2022_03.html	News | SEMICON TAIWAN 2022	News | SEMICON TAIWAN 2022 Home  >  News  >  Event News  >  SEMICON TAIWAN 2022 SEMICON TAIWAN 2022 Thank you very much for coming to our exhibition booth. For more information on our products as well as the exhibited products below, please go to the product page or contact us . Date   September 14 to 16, 2022 Venue Taipei Nangang Exhibition Center, Taiwan Booth K3060 JEL booth in SEMICON TAIWAN 2022 Products for Exhibition ■GTFR for 300 mm wafers ■Low head SAL-HV for 300 mm wafers ■STCR for 150 or 200 mm chemical compound wafer ■SAL for 150 or 200 mm chemical compound wafer Event Listings News Top SEMICON TAIWAN 2022 banner Our booth at SEMICON TAIWAN 2022
../products/SORTERSYSTEM_400_1_s.html	und	1710468968	11977	https://www.jel-robot.com/products/SORTERSYSTEM_400_1_s.html	Products | SORTER SYSTEM (4-port inline type with 300 wafers/h throughput)	Products | SORTER SYSTEM (4-port inline type with 300 wafers/h throughput) Home 縲� Products 縲� 縲� System SORTER SYSTEM (4-port inline type with 300 wafers/h throughput) Product Video Usage Environment/Specifications Product Profile Product Model SORTER SYSTEM Environment Clean room atmosphere Wafer Size 300mm Carrying Object Silicon wafer Contact us for the detailed specifications. Throughput 300 wafers/h The image above and the video are of SORTER SYSTEM (4-port inline type with 300 wafers/h throughput). Characteristics Compliance : SEMI Standard (E15.1-0600, E57-0600, E62-0999, E63-0600, E64-0600) Aligner with buffer function is available for high-throughput. Wafer ID reader is available. (Reading both sides of wafer is an option) Standard Specifications Standard specifications for 4-port inline type (Robot 1 set, Track 1 set) Carrier 300mm FOUP (for 25 wafers)   Compliance: SEMI E47.1, E62 Carrying Object 300mm Silicon wafer   (Thickness: 775µm) Throughput 300 wafers/h Cleanliness ISO Class 2 (when equipped with FFU) Dimension W 1250mm x D 2500mm x H 1900mm Mass Approx. 800kg Utility Power: AC200V Single phase ±10% 2kVA Dry air: 0.5MPa±10% Vacuum: -53kPa or more Option Other Option *The teaching box appeared in the table may be unavailable depending on the specifications. Product Lineup Menu Prev Next Icon guide ...Atmosphere ...Vacuum ...Waterproof ...Thin wafer ...CE marking ...JEL's standard spec. ...KCs marking SORTER SYSTEM(300 wafers/h)
../news/news20160418.html	und	1710468660	3561	https://www.jel-robot.com/news/news20160418.html	News | 2016 Japanese Holiday Week Information	News | 2016 Japanese Holiday Week Information Home  >  News  >  Japanese Holiday Week Information Japanese Holiday Week Information JEL will be closed for Japanese holiday week, "Golden Week" Holidays; April 29th to May 1st (Japan Time), May 3rd to 8th (Japan Time) In case of emergency, please contact us at the following e-mail address: 
../support/migration.html	und	1710469074	6610	https://www.jel-robot.com/support/migration.html	Online Support | Standard Data Copy Manual	Online Support | Standard Data Copy Manual Home  >  Online Support  >  Manuals/Troubleshooting 縲� Standard Data Copy Manual Standard Data Copy Manual This manual describes the procedures to copy data inside a controller to another controller by JELDATA3. Standard data is default setting including following 4 data. Teaching data Speed data Compound command data Parameter data (*� �*) may not be registered depending on the robot model. JEL is not liable for any robot damage or other defects occurring from the work conducted by a customer. JELDATA3 Standard Data Copy Manual 1. Setting of the controller for communication 2. Checking of communication 3. Saving controller data into PC 4. Sending data in PC to another controller and storing (data copy) 5. Menu JELDATA3 Operation Manual Operation Manual 1. Software Outline 2. Operating Environment 3. Precautions 4. Before Communication 5. Functions 6. File 7. Edit 8. Setup Error Messages 1. Communication Errors 2. Errors Related to Files 3. Other Errors  Technical Information Notice
../news/event2018_02.html	und	1710468646	8810	https://www.jel-robot.com/news/event2018_02.html	News | SEMICON CHINA 2018	News | SEMICON CHINA 2018 Home  >  News  >  Event News  >  SEMICON CHINA 2018 SEMICON CHINA 2018 Thank you very much for coming to our exhibition booth at SEMICON CHINA 2018. For more information on our products as well as the exhibited products below, please go to the product page or contact us . Date   March 14-16, 2018 Venue Shanghai New International Expo Centre (SNIEC), Shanghai Booth No. 5111  Products for Exhibition ReJe booth in SEMICON CHINA 2018 Products for Exhibition Twin arm robot with path planning handling Access to the inline 2 port layout cassettes without a track. Simultaneous movement of both theta-axis and arm (R-axis) allows horizontal movement. Horizontal and multi-joint type single arm robot Access to the inline 2 port layout cassettes without a track. By moving the direction of end-effector straightly to the horizontal cassettes, edge-grip type end-effector or square substrates can be applied. New Aligner SAL3000HV Series (full auto-adjustment version) Full auto-adjustment software "JEL ALIGN TOOL" allows automatic alignment for various kinds of wafers. Event Listings News Top SEMICON CHINA 2018 banner Our booth at SEMICON CHINA 2018 Twin arm robot with path planning handling Horizontal and multi-joint type single arm robot New Aligner SAL3000HV Series (full auto-adjustment version)
../support/man001/w013.html	und	1710469107	5084	https://www.jel-robot.com/support/man001/w013.html	Online Support |13唹utput the results of wafer-search to I/O	Online Support |13唹utput the results of wafer-search to I/O Home  >  Online Support  >  Manuals/Troubleshooting  >  Wafer-Search Operation Procedure and Troubleshooting  >  13唹utput the results of wafer-search to I/O Wafer-Search Operation Procedure 13唹utput the results of wafer-search to I/O After executing wafer-search ( 10: Execution of wafer search ), output the results of wafer-search to I/O. Output the results of wafer-search via serial communication. Input the following commands for configuration: Select: Designate the number of slots to be output When executing the commands, the data whether there are wafers or not in the slots which correspond to the output data is output to I/O. "ON" : Wafer is detected. "OFF": Wafer is not detected. Contents Back Next  Technical Information 
../products/handling_6.html	und	1710468952	6824	https://www.jel-robot.com/products/handling_6.html	Products | Introduction Video of Handling (Closed-loop Control)	Products | Introduction Video of Handling (Closed-loop Control) Home  >  Products  >  Introduction Video of Handling  >  Closed-loop Control Introduction Video of Handling Closed-loop Control Clean room robot for handling wafers from 2 inch to 300mm with low-cost, high-speed handling, and no step-out error. High reliability: Closed-loop control achieves no step-out error under rapid load change or acceleration. STCR4160SN (Closed-loop control) (Cylindrical coordinate type twin-arm clean robot) *Also available for Cylindrical coordinate type single-arm clean robot: SCR3160CSN (Closed-loop control)  Click here to find out what is closed-loop control. Video List Previous Video YouTube Official Channel
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../products/JCT3B-0500_tb.html	und	1710468954	15983	https://www.jel-robot.com/products/JCT3B-0500_tb.html	Products | JCT3B-0500 (Teaching Box)	Products | JCT3B-0500 (Teaching Box) Home  >  Products  >  〉 Others JCT3B-0500 Teaching Box Usage Environment/Specifications Product Profile Model Name JCT3B-0500 Communication RS232C Applicable Robot Type Cylindrical coordinate type Characteristics Used for teaching operation of robot. Reading error codes is also available. Equipped with 3-position dead-man switch Easy to operate, one-handed type, weighing only 500g (cable excluded) Max. 2 of normally closed contact is available for emergency stop push-button switch Equipped with push-button self-diagnosis function by internal software Standard Specifications Specifications Input Voltage DC5V (±5%) Communication RS232C Environment 0 to 40℃ (No condensation) Attached Cable Up to 5 meters Emergency Stop Contact Normally closed contact External Dimensions W118×H225×D33(w/contrast adjustment hole attached/Emergency stop button excluded) Mass 500g(Cable excluded) Display Screen LCD monochrome graphic display (66.6×33.3mm, 20×8 characters, 128×64 dots) Connector HDEB-9P(05)(HIROSE ELECTRIC CO., LTD.) Emergency Stop Button A165E-S-03U (Red) (OMRON) Output for emergency stop switch: Normally closed dry contact (UL508 and EN418 standard compliant) Deadman Switch A4E-B200HS (OMRON) 3-position enabling switch (UL508 and ANSI/RIA R15.06-1999 standard compliant) Key Sheet Thin dome array sheets: 9 columns x 5 rows (45 pcs) Applicable Robot Type Cylindrical coordinate type Connector Specifications Pin No. Signal Contents Assignment of Connector Pin 1 FG Frame ground View from Teaching box 2 TXD RS232C transmitted data 3 RXD RS232C received data 4 DSW Deadman switch output 5 GND Ground for power supply 6 DSW-COM Deadman switch (common) 7 EMG Emergency stop button output 8 EMG-COM Emergency stop button output (common) 9 +5V Power: DC+5V Outline Drawing (Standard) Product Lineup Menu Prev Next Icon guide ...Atmosphere ...Vacuum ...Waterproof ...Single arm ...Twin arm ...Thin wafer ...CE marking ...JEL's standard spec. ...KCs marking Teaching Box 9 pin JCT3B-0500
../products/JCT4BX-0500_tb.html	und	1710468955	13514	https://www.jel-robot.com/products/JCT4BX-0500_tb.html	Products | JCT4BX-0500 (Teaching Box)	Products | JCT4BX-0500 (Teaching Box) Home  >  Products  >  〉 Others JCT4BX-0500 Teaching Box Usage Environment/Specifications Product Profile Model Name JCT4BX-0500 Communication RS422 Applicable Robot Type Cylindrical coordinate type with X-axis Characteristics Used for teaching operation of robot. Reading error codes is also available. Equipped with 3-position dead-man switch Easy to operate, one-handed type, weighing only 500g (cable excluded) Max. 2 of normally closed contact is available for emergency stop push-button switch Equipped with push-button self-diagnosis function by internal software Standard Specifications Contact us for connector type. Specifications Input Voltage DC24V (±5%) Communication RS422 Environment 0 to 40℃ (No condensation) Attached Cable Up to 10 meters Emergency Stop Contact Normally closed contact External Dimensions W118×H225×D33(w/contrast adjustment hole attached/Emergency stop button excluded) Mass 500g(Cable excluded) Display Screen LCD monochrome graphic display (66.6×33.3mm, 20×8 characters, 128×64 dots) Connector DA-15PF-N (Japan Aviation Electronics Industry, Ltd.) Emergency Stop Button A165E-S-03U (Red) (OMRON) Output for emergency stop switch: Normally closed dry contact (UL508 and EN418 standard compliant) Deadman Switch A4E-B200HS (OMRON) 3-position enabling switch (UL508 and ANSI/RIA R15.06-1999 standard compliant) Key Sheet Thin dome array sheets: 9 columns x 5 rows (45 pcs) Applicable Robot Type Cylindrical coordinate type with X-axis Product Lineup Menu Prev Next Icon guide ...Atmosphere ...Vacuum ...Waterproof ...Single arm ...Twin arm ...Thin wafer ...CE marking ...JEL's standard spec. ...KCs marking Teaching Box
../support/mailformpro/data/PayPal/index.html	und	1480331393	0	https://www.jel-robot.com/support/mailformpro/data/PayPal/index.html		
../products/SCR3100S.html	und	1710468966	22943	https://www.jel-robot.com/products/SCR3100S.html	Products | SCR3100S (For small wafer) | Wafer Transfer Atmospheric Robot	Products | SCR3100S (For small wafer) | Wafer Transfer Atmospheric Robot Home 縲� Products 縲� 縲� Robot for Semiconductor SCR3100S (For small wafer) 3-Axis Cylindrical Coordinate Clean Robot Product Video Usage Environment/Specifications Product Profile Model Name SCR3100S Environment Clean room atmosphere Arm Single arm Operating Range 195mm (3rd joint center) Vertical Stroke 200mm / 300mm Payload Capacity Below 0.5kg (calculated for the arm 3rd joint) List of Product Model Product Model Vertical Stroke Standard SCR3100S-200-PM 200mm Standard SCR3100S-300-PM 300mm The image above and the video are of SCR3100S-200-PM. Characteristics Designed for handling small wafers in a production line or inspection line of semiconductor. Minimized footprint compactifies the system layout. Base or flange mounting type is selectable. Motion monitoring is available. RS232C and parallel photo I/O are standard for control. 2-phase stepping motor installed in all axes. High-speed, high-accuracy wafer handlingby S-curved speed control. Wafer holding: end-effector with vacuum suction, passive edge, edge grip type End-effector. End-effector material: CFRP, Al, ceramic, or others. Optimal end-effector is selectable according to the carrying object and line layout. Standard Specifications Example of standard specifications with JEL standard end-effector (vacuum type) Specifications of Robot Robot Model SCR3100S-200-PM Carrying Object Up to 150mm wafer Wafer Holding Method By vacuum suction Robot Model Type Cylindrical coordinate type Control Axis 3-axis Motor Type Stepping motor Operating Range (Ave.) From the robot center to the wafer center Rotation Angle (Theta-axis) Vertical Stroke (Z-axis) 397.7mm 340deg 200mm Carrying Speed (Ave.) Arm (R-axis) Rotation Angle (Theta-axis) Vertical Stroke (Z-axis) 330mm/sec 280deg/sec 130mm/sec Carrying Speed (Max.) Arm (R-axis) Rotation Angle (Theta-axis) Vertical Stroke (Z-axis) 500mm/sec 480deg/sec 170mm/sec Repeatability Within ±0.1mm Cleanliness ISO Class 2 (at wafer transfer level when exhausting driving part) Utility Power: DC24V±10% 8A; Vacuum: -53kPa or more Specifications of Controller Controller Model C4000 series Interface RS232C and parallel photo I/O Outline Drawing (Standard) Option Wrist-Block Unit Model Name Total Length Mapping Sensor Thickness of Attaching End-Effector SARS00169 38mm None 2mm SARS00958 38mm None 3mm SARS02659 75mm None 2mm SARS02967 75mm None 3mm SARS08603 80mm Transmissive sensor/Reflective sensor 2mm *The table above shows the specifications of JEL standard wrist-block units. The other specifications are available. *Click the items below to review the wrist-block units other than JEL standard types. End-Effector Model Name Size of Carrying Object End-effector Type (Thickness) Wafer Holding Method SC-IW-200 3 inch, 100mm to 200mm I-shape (2mm) Vacuum suction SC-IW-240 3 inch, 100mm to 300mm I-shape (2mm) Vacuum suction SC-YW-200 100mm to 200mm Y-shape (2mm) Vacuum suction SC-YW-227 100mm to 300mm Y-shape (2mm) Vacuum suction SC-YW-240 100mm to 300mm Y-shape (2mm) Vacuum suction 3D-02229 150mm to 300mm Y-shape (2mm) Vacuum suction SC3-YW-240 300mm Y-shape (3mm) Vacuum suction 3D-01661 300mm Y-shape (3mm) Vacuum suction *The table above shows the specifications of JEL standard end-effectors. The other specifications are available. *Click the items below to review the end-effectors other than JEL standard types. Operating Range End-Effector/Wrist-Block Unit SARS00169 SARS02659 SARS08603 SARS00958 SARS02967 SC-IW-200 357.7mm 420mm 425mm - - SC-IW-240 397.7mm 460mm 465mm - - SC-YW-200 367.7mm 430mm 435mm - - SC-YW-227 394.7mm 457mm 462mm - - SC-YW-240 407.7mm 470mm 475mm - - 3D-02229 407.7mm 470mm 475mm - - SC3-YW-240 - - - 407.7mm 470mm 3D-01661 - - - 407.7mm 470mm *The operating range in the table that is specified by the combination of the wrist-block unit and end-effector is an example only. The other combinations are available. Other Option *The teaching box appeared in the table may be unavailable depending on the specifications. Product Lineup Menu Prev Next Icon guide ...Atmosphere ...Vacuum ...Waterproof ...Single arm ...Twin arm ...Thin wafer ...CE marking ...JEL's standard spec. ...KCs marking SCR3100S-PM SCR3100S-200-PM
../products/FTVHR4750.html	und	1710468948	15515	https://www.jel-robot.com/products/FTVHR4750.html	Products | FTVHR4750 (FPD glass substrate) | FPD glass substrate transfer robot	Products | FTVHR4750 (FPD glass substrate) | FPD glass substrate transfer robot Home 縲� Products 縲� 縲� Robot for FPD FTVHR4750 (FPD glass substrate) 4-Axis Vacuum Link Type Clean Robot Usage Environment/Specifications Product Profile Model Name FTVHR4750 Environment Clean room atmosphere (Temp. 15°C to 40°C) *Vacuum robot:vacuum chamber temp. 15°C to 50°C or less Arm Twin arm Operating Range 942mm (3rd joint center) Vertical Stroke 95mm / 105mm / 335mm Payload Capacity Below 30kg (calculated for the arm 3rd joint) List of Product Model Product Model Vertical Stroke FTVHR4750-095-AM 95mm FTVHR4750-105-AM 105mm FTVHR4750-335-AM 335mm The image above is of FTVHR4750-095-AM. Characteristics Designed for handling Mask or FPD substrate in a PFD production line or inspection line. Execution of origin search is not required by using the servo motors with absolute encoders. Arm lineup: 550mm, 750mm, 800mm, 820mm Superior straightness accuracy and low-particle due to the link arm system. Twin-arm reduces the tact time. Motion monitoring is available. RS232C and parallel photo I/O are standard for control. AC servo motors with absolute encoders installed in all axes. High-speed, high-accuracy wafer handling by S-curved speed control. End-effector material: CFRP, Al, ceramic, or others. Optimal end-effector is selectable according to the carrying object and line layout. Standard Specifications Representative specifications of FTVHR4750-095-AM. It can be changed depending on the carrying object and end-effector type. Specifications of Robot Robot Model FTVHR4750-095-AM Carrying Object 1100mm×1250mm FPD glass substrate(representative example) Robot Model Type Cylindrical coordinate type Control Axis 4-axis Motor Type AC servo motor Operating Range Arm (3rd joint center) Rotation Angle (Theta-axis) Vertical Stroke (Z-axis) 942mm 330deg 95mm Carrying Speed (Ave.) Arm (R-axis) Rotation Angle (Theta-axis) Vertical Stroke (Z-axis) 1924mm/2.6sec 180deg/3.5sec 95mm/2.8sec Resolution Arm (R-axis) Rotation Angle (Theta-axis) Vertical Stroke (Z-axis) Below 4.8µm 0.00018deg 0.12µm Handling level 583.5mm (Mounting level to upper end-effector level Repeatability R.θ-axis: Within ±0.3mm, Z-axis: Within ±0.1mm Vacuum resistance 1.33×10 -6 Pa Utility Power: AC200V 3 phase ±10% 4kVA Outline Drawing (Standard) Option End-Effector *Click the items below to review the end-effectors other than JEL standard types. Other Option Product Lineup Menu Prev Next Icon guide ...Atmosphere ...Vacuum ...Waterproof ...Single arm ...Twin arm ...Thin wafer ...CE marking ...JEL's standard spec. ...KCs marking FTVHR4750-095-AM FTVHR4750-095-AM
../news/event2016_02.html	und	1710468642	6002	https://www.jel-robot.com/news/event2016_02.html	News | SEMICON Korea 2016	News | SEMICON Korea 2016 Home  >  News  >  Event News  >  SEMICON Korea 2016 SEMICON Korea 2016 Thank you very much for coming to our exhibition booth at SEMICON Korea 2016. For more information on our products as well as the exhibited products below, please go to the product page or contact us. Date   January 27-29, 2016 Venue Convention and Exhibition Centre (COEX), Seoul Booth No. 2372 (Hall A, 1F) Products for Exhibition Horizontal and multi-joint type robot with vertical strokes (DGCR) (Exhibited as reference) Individual two vertical strokes provide high throughput for the system using separate loader/unloader. Tape frame handling robot Safe and secure handling of tape frame. Available for tape frames of 150mm, 200mm, and 300mm. Bernoulli type end-effector and Bernoulli hand for thin or warped wafer Low-cost Bernoulli type end-effector available for customization. Visitors experienced the Bernoulli type wafer holding at the exhibition. Event Listings News Top SEMICON Korea 2016 Our booth at SEMICON Korea 2016 Horizontal and multi-joint type robot with vertical strokes (DGCR) Tape frame handling robot Bernoulli type end-effector and Bernoulli hand for thin or warped wafer
../news/event2016_08.html	und	1710468643	7221	https://www.jel-robot.com/news/event2016_08.html	News | SEMICON JAPAN 2016	News | SEMICON JAPAN 2016 Home  >  News  >  Event News  >  SEMICON JAPAN 2016 Thanks for coming to the exhibition Thank you very much for coming to our exhibition booth. For more information on our products as well as the exhibited products below, please go to the product page or contact us . Date   Wed., December 14 - Fri., December 16, 2016 Venue Tokyo Big Sight, Japan Booth East Exhibition Hall 5508 (Near the entrance of Hall 5) Products for Exhibition ■Robot with alignment function of mold (PLP) substrate ■Automatic wafer transfer system for wafer container ■New aligner SAL3000HV Series (full auto adjustment version) We have exhibited many other models at the show. Event Listings News Top SEMICON JAPAN 2016 banner JEL booth at the exhibition
../news/event2020_01.html	und	1710468649	8627	https://www.jel-robot.com/news/event2020_01.html	News | SEMICON KOREA 2020	News | SEMICON KOREA 2020 Home  >  News  >  Event News  >  SEMICON KOREA 2020 SEMICON KOREA 2020 We are exhibiting our robots with INA CORP., LTD., a sales agency in Korea. We will exhibit various actual robots, including the latest models. Please visit us and experience our new products. Date   February 05 to 07, 2020 Venue COEX (Convention and Exhibition Center), Seoul, Korea Booth No. A254 LINK  Click here to see the official site  Products for Exhibition INA booth in SEMICON KOREA 2019 Products for Exhibition Warped Wafer Aligner with Auto warp measurement "SAL3000HV" Auto-adjustment software JEL ALIGN TOOL allows optimized alignment for various types of wafers. Suitable for large warped wafers. Event Listings News Top SEMICON KOREA 2020 banner Our booth at SEMICON KOREA 2019 Warped Wafer Aligner with Auto warp measurement SAL3000HV
../news/event2014_01.html	und	1710468638	7409	https://www.jel-robot.com/news/event2014_01.html	News | 6th LED/OLED Lighting Technology Expo	News | 6th LED/OLED Lighting Technology Expo Home  >  News  >  Event News  >  6th LED/OLED Lighting Technology Expo 6th LED/OLED Lighting Technology Expo Thank you for coming to the 6th LED/OLED Lighting Technology Expo: Lighting Japan. For more product information, please go to the products page or contact us. Date : January 15-17, 2014 Venue : Tokyo Big Sight, Japan Booth : No. East 46-4 Date: Jan. 16, 2014 Products for Exhibition Clean robot & Aligner for handling wafer: STCR4160SN-300-PM (New model)/SAL3481HV (New model) 繝サNew twin-arm robot with low-cost, high-speed handling, and no step-out     error 繝サNew aligner available for any material of wafer Table-top loader system: SSY-10000 繝サAvailable for various types of wafers; 2, 3 inch, 100mm glass, sapphire, SiC,     or GaN or others Clean robot for handling wafer & Bernoulli type aligner: STCR4160SN-300-PM (New model)/SAL3481 New twin-arm robot with low-cost, high-speed handling, and no step-out error 繝サVacuum suction type end-effector to hold wafer edge (5mm from the edge):     Random access is available 繝サThin Bernoulli type end-effector (Patent pending):     For warped or thin wafer, and random access to cassette slot is available Bernoulli type end-effector and Bernoulli hand for thin or warped wafer: Bernoulli Hand: BRP-01 繝サLow-cost Bernoulli type end-effector available for customization     Visitors experienced the Bernoulli type wafer holding at the exhibition. Event Listings News Top 6th LED/OLED Lighting Technology Expo 6th LED/OLED Lighting Technology Expo 
../news/news20160311.html	und	1710468660	6294	https://www.jel-robot.com/news/news20160311.html	News | Clean Booth installed in Fukuyama Factory	News | Clean Booth installed in Fukuyama Factory Home  >  News  >  Clean booth installation in Fukuyama Factory Clean booth installation in a clean room in Fukuyama Factory Clean booth with a cleanliness of class 1 was installed in a clean room in Fukuyama Factory in March 2016. The area and volume are increased by 1.8 times and 2.6 times compared with the existing clean booth, which is capable of measuring for large systems. Also, conventional ULPA filter (99.999% (particle diameter of 0.1 to 0.2 µm)) is improved to ULPA+PTFE filter (99.9999% (particle diameter of 0.1 µm)), providing a cleaner atmosphere. JEL aims to provide more quality clean robot by acquiring accurate data to meet cleanliness requirements. Particle measurement for robots or large systems is performed. Outline of Clean Booth Cleanliness Class 1 Area About 11.6m 2 (Outside Dimension: W2895 x L4020 x H3525) Characteristics ULPA+PTFE filter (99.9999% (particle diameter of 0.1 µm)) is adopted. Air circulation type. Clean booth
../products/SC-YW-200_end.html	und	1710468964	10662	https://www.jel-robot.com/products/SC-YW-200_end.html	Products | SC-YW-200 (Vacuum Type End-Effector)	Products | SC-YW-200 (Vacuum Type End-Effector) Home  >  Products  >  縲� SC-YW-200 Vacuum Type End-Effector Others Usage Environment/Specifications Product Profile Model Name SC-YW-200 Carrying Size 100 to 200mm Carrying Object Mainly silicon wafer Characteristics Y-shaped vacuum suction type end-effector, suitable for handling wafer from 100 to 200mm (Random access is available). Used extensively for atmospheric robot, the end-effector holds the backside of wafer by vacuum suction (negative pressure). Conductive Teflon coating on the surface of end-effector protects against damage from charging. Standard Specifications Carrying Object SEMI standard 100 to 200mm (Mainly silicon wafer) Material High purity alumina ceramic sintered body Surface Treatment Conductive Teflon coating Wafer Holding Method Vacuum suction Total Length 200mm Thickness 2mm Please contact us for the detailed specifications. Outline Drawing (Standard) Product Lineup Menu Prev Next Icon guide ...Atmosphere ...Vacuum ...Waterproof ...Single arm ...Twin arm ...Thin wafer ...CE marking ...JEL's standard spec. ...KCs marking SC-YW-200 SC-YW-200
../news/event2020.html	und	1710468649	5525	https://www.jel-robot.com/news/event2020.html	News | Event News 2020	News | Event News 2020 Home  >  News  >  Event News  >  2020 Event News 2020 SEMICON JAPAN VIRTUAL Virtual Exhibition Date: DEC. 14, 2020 (MON) 窶� DEC. 17, 2020 (THU) On-demand exhibition Date: DEC. 11, 2020 (FRI) 窶� JAN. 15, 2021 (FRI)  Click here for details.   SEMICON TAIWAN 2020 Date: September 23-25, 2020  Click here for details.   SEMICON CHINA 2020 Date: June 27 to 29, 2020  Click here for details.   SEMICON KOREA 2020 Date: February 5 to 7, 2020  SEMICON KOREA was canceled   Event Listings News Top 
../news/news20240408.html	und	1712560352	3792	https://www.jel-robot.com/news/news20240408.html	News | Holiday Notice: Japanese Holiday Week, Golden Week Holidays of 2024	News | Holiday Notice: Japanese Holiday Week, Golden Week Holidays of 2024 Home  >  News  >  Holiday Notice Holiday Notice JEL will be closed for the following for a Japanese holiday week, Golden Week Holidays: April 27th to 29th; May 3rd to 6th. In case of emergency, please contact us at the following e-mail address: 
../company/shanghai.html	und	1710468474	5472	https://www.jel-robot.com/company/shanghai.html	Company | JEL (Shanghai) Robotics Co., Ltd.	Company | JEL (Shanghai) Robotics Co., Ltd. Home  >  Company  >  JEL (Shanghai) Robotics Co., Ltd. JEL (Shanghai) Robotics Co., Ltd. Opened a new office, 窶廱ELhanghai嘘obotics窶� on JUN. 1st, 2021 for quick and reliable response to customers in the Chinese market. We aim to improve the quality of service for Chinese customers as a wholly subsidiary of JEL Corporation. Address 625 6F, CHAMTIME Tower C, No.3, Lane 2889 JinkeRoad, Pudong New District, Shanghai 201203, P.R., China Tel +86-21-2050-1625 (Landline) +86-13021105268 (Mobile) E-mail General manager Chuanyilang Sun Company TOP JEL (Shanghai) Robotics Co., Ltd. JEL (Shanghai) Robotics Co., Ltd. JEL (Shanghai) Robotics Co., Ltd. email address
../support/man002/s003.html	und	1710469130	4810	https://www.jel-robot.com/support/man002/s003.html	Online Support | JELDATA3 Operation Manual | 7. Edit	Online Support | JELDATA3 Operation Manual | 7. Edit Home  >  Online Support  >  Wafer-Search Operation Procedure and Troubleshooting  >  JELDATA3 Operation Manual 縲� 7. Edit JELDATA3 Operation Manual 7. Edit 7.1 Cut The data in the cell or the text can be cut by this function. The cut data can be pasted with the [Paste] function. (Cell range may be specified.) 7.2 Copy The data in the cell or the text can be copied. The copied data can be pasted with the [Paste] function. (Cell range may be specified.) 7.3 Paste The cut or copied data can be pasted in the cell or the text. (Cell range may be specified.) 7.4 Clear Delete data in the cell or text. (Cell range may be specified.) Contents 竊殖ack Next竊�  Technical Information cut the data copy the data paste the data clear the data
../products/SC3-IW-240_end.html	und	1710468965	10643	https://www.jel-robot.com/products/SC3-IW-240_end.html	Products | SC3-IW-240 (Vacuum Type End-Effector)	Products | SC3-IW-240 (Vacuum Type End-Effector) Home  >  Products  >  縲� Others SC3-IW-240 Vacuum Type End-Effector Usage Environment/Specifications Product Profile Model Name SC3-IW-240 Carrying Size 300mm Carrying Object Mainly silicon wafer Characteristics I-shaped vacuum suction type end-effector, suitable for handling 300mm wafer (Random access is available). Used extensively for atmospheric robot, the end-effector holds the backside of wafer by vacuum suction (negative pressure). Conductive Teflon coating on the surface of end-effector protects against damage from charging. Standard Specifications Carrying Object SEMI standard 300mm (Mainly silicon wafer) Material High purity alumina ceramic sintered body Surface Treatment Conductive Teflon coating Wafer Holding Method Vacuum suction Total Length 240mm Thickness 3mm Please contact us for the detailed specifications. Outline Drawing (Standard) Product Lineup Menu Prev Next Icon guide ...Atmosphere ...Vacuum ...Waterproof ...Single arm ...Twin arm ...Thin wafer ...CE marking ...JEL's standard spec. ...KCs marking SC3-IW-240 SC3-IW-240
../news/event2017_03.html	und	1710468645	5021	https://www.jel-robot.com/news/event2017_03.html	News | Automation World 2017 (AIMEX)	News | Automation World 2017 (AIMEX) Home  >  News  >  Event News  >  Automation World 2017 (AIMEX) Automation World 2017 (AIMEX) Thank you very much for coming to our exhibition booth at Automation World 2017. For more information on our products as well as the exhibited products below, please go to the product page or contact us . Date   March 29-31, 2017 Venue Coex, Seoul, Korea Booth Hall A 1-I124 Products for Exhibition Robot with alignment function of molded (PLP) substrate Alignment and high accuracy handling of square substrate. Event Listings News Top Automation World 2017 (AIMEX) banner Our booth at Automation World 2017 (AIMEX) Robot with alignment function of molded (PLP) substrate
../news/event2016_04.html	und	1710468642	6467	https://www.jel-robot.com/news/event2016_04.html	News | SEMICON China 2016	News | SEMICON China 2016 Home  >  News  >  Event News  >  SEMICON China 2016 SEMICON China 2016 Thank you for coming to SEMICON China 2016. For more product information, please go to the products page or contact us. Date   March 15-17, 2016 Venue Shanghai New International Expo Centre (SNIEC), Shanghai Booth 1505 (Hall N1) Products for Exhibition Automatic wafer transfer system for wafer container High accuracy handling of thin wafer inside the wafer container (coin stack type container). Horizontal and multi-joint type robot with vertical strokes (DGCR) (Exhibited as reference) Individual two vertical strokes provide high throughput for the system using separate loader/unloader. Tape frame handling robot Safe and secure handling of tape frame. Available for tape frames of 150mm, 200mm, and 300mm. Robot for handling 300mm wafer Wafer handling to the 2 FOUP cassettes placed side by side is available without track axis. Suited for the high-speed handling of 300mm-wafer in the semiconductor manufacturing equipment and inspection equipment. JEL ALIGN TOOL (Software for alignment adjustment) Easy-to-use and self-adjustment wafer alignment tool. Downtime can be reduced significantly. Event Listings News Top SEMICON China 2016 Our booth at SEMICON China 2016 Automatic wafer transfer system for wafer container Horizontal and multi-joint type robot with vertical strokes (DGCR) Tape frame handling robot GCR4210-300-AM JEL ALIGN TOOL
../support/man001/t006.html	und	1710469102	4799	https://www.jel-robot.com/support/man001/t006.html	Online Support |6: Search failure occurs when wafer-search using thin wafers is started. 	Online Support |6: Search failure occurs when wafer-search using thin wafers is started. Home  >  Online Support  >  Manuals/Troubleshooting  >  Wafer-Search Operation Procedure and Troubleshooting  >  6: Search failure occurs when wafer-search using thin wafers is started. Troubleshooting of Wafer Search Operation 6: Search failure occurs when wafer-search using thin wafers is started. The minimum detection width of wafer is not correct. As specified in 窶�4: Setting of the minimum detection width of wafer (WWN setting)窶� of Wafer-Search Operation Procedure, set it again. When the speed of wafer-search becomes faster, the detection width tends to become smaller. As specified in 窶�8: Setting of the speed of wafer-search (WSP setting)窶� of Wafer-Search Operation Procedure, set it smaller than the current setting. Contents Back Next  Technical Information 
../products/event2021_04c.html	und	1710468946	17322	https://www.jel-robot.com/products/event2021_04c.html	Products | New low head SAL-HV (Multi work aligner)	Products | New low head SAL-HV (Multi work aligner) Home 〉 Products 〉 〉 JEL dedicated website for SEMICON exhibition robots New Aligner "SAL3000HV Series"  (Full auto-adjustment version) New low head SAL-HV (Multi work aligner) Wafer Aligner Product Video Usage Environment/Specifications Product Profile Product Model SAL38C3HV Environment Clean room atmosphere Wafer Size 200 to 300 mm Carrying Object Transparent, translucent, or silicon wafer The image is of New low head SAL-HV. The video is of full auto-adjustment software " JEL ALIGN TOOL ". Characteristics Full auto-adjustment software  JEL ALIGN TOOL  comes with Aligner SAL3000HV series that have been released on December 14, 2016. Downtime can be reduced significantly. *Click to go to the page of New Aligner "SAL3000HV Series" (Full auto-adjustment version) (*). (*) Please note that this tool (software) is not for guaranteeing the positioning accuracy after adjustment. Make sure to check the positioning accuracy by using the customer’s inspection device at customer’s side. Aligner available for any material of wafer for 200 to 300 mm wafer High-speed, high-accuracy centering and flat/notch locating are available for silicon wafer with BG tape as well as silicon, transparent, or translucent wafer. Equipped with JEL-developed image sensor, and internal motor driver and controller. ウェーハサイズ、材質にあわせて保持方法の変更可能 Available for non-SEMI standard notch or flat ウェーハ持ち直し動作が可能な昇降ユニットをオプションで取付可能 多種多様なウェーハのアライメントが可能 Standard Specifications Carrying Object SEMI standard 200 to 300 mm wafer (Transparent, translucent, silicon) Positioning Time Centering : 1.5 sec (Wafer pick-up/placing time excluded) Positioning Accuracy Centering: Within ±0.1 mm Flat locating/Notch locating: Within ±0.1 deg Sensor LED light + wafer edge detection with image sensor unit Wafer Size Change By command control or switch Cleanliness ISO Class 2 (at wafer transfer level when exhausting driving part) Driving Method 2-phase stepping motor (for 3 axes) Internal motor driver, controller Utility Power: DC24V±10% 3A Vacuum: -53 kPa or more Outline Drawing Product Lineup Menu Prev Next Icon guide ...Atmosphere ...Vacuum ...Waterproof ...Thin wafer ...CE marking ...JEL's standard spec. ...KCs marking SEMICON JAPAN 2021 HYBRID title click here for GTFR details page click here for SAL-HV details page. click here for KHR details page. click here for STCR details page. click here for SAL details page. click here for MTCR details page. New low head SAL-HV SAL38C3HV click here for GTFR details page click here for SAL-HV details page. click here for KHR details page. click here for STCR details page. click here for SAL details page. click here for MTCR details page. SEMICON JAPAN 2021 HYBRID title
../news/event2019_01.html	und	1710468647	9111	https://www.jel-robot.com/news/event2019_01.html	News | SEMICON KOREA 2019	News | SEMICON KOREA 2019 Home  >  News  >  Event News  >  SEMICON KOREA 2019 SEMICON KOREA 2019 Thank you very much for coming to our exhibition booth at SEMICON KOREA 2019. For more information on our products as well as the exhibited products below, please go to the product page or contact us . Date   January 23 to 25, 2019 Venue COEX (Convention and Exhibition Center), Seoul, Korea Booth No. A254  Products for Exhibition INA booth in SEMICON KOREA 2019 Products for Exhibition New Wafer Transfer Robot "MTCR" (Reference Exhibit) Low vibration with the miniaturization of semiconductor devices. Two variations of the arms with the payload capacity of 3 kg and 5 kg allow more customization. Warped Wafer Aligner with Auto-Adjustment Software "SAL3000HV" (Reference Exhibit) Auto-adjustment software JEL ALIGN TOOL allows optimized alignment for various types of wafers. Suitable for large warped wafers. Event Listings News Top SEMICON KOREA 2019 banner Our booth at SEMICON KOREA 2019 New Wafer Transfer Robot "MTCR" (Reference Exhibit) Warped Wafer Aligner with Auto-Adjustment Software "SAL3000HV" (Reference Exhibit)
../news/event2016_03.html	und	1710468642	5662	https://www.jel-robot.com/news/event2016_03.html	News | AUTOMATION WORLD 2016 (AIMEX)	News | AUTOMATION WORLD 2016 (AIMEX) Home  >  News  >  Event News  >  AUTOMATION WORLD 2016 (AIMEX) AUTOMATION WORLD 2016 (AIMEX) Thank you very much for coming to our exhibition booth at AUTOMATION WORLD 2016 (AIMEX). For more information on our products as well as the exhibited products below, please go to the product page or contact us. Date   March 9-11, 2016 Venue Convention and Exhibition Centre (COEX), Seoul Booth H108 Products for Exhibition Twin arm robot with path planning handling Access to the inline layout cassettes without a track. Simultaneous movement of both theta-axis and arm (R-axis) allows horizontal movement. Horizontal and multi-joint type single arm robot Access to the inline layout cassettes without a track. By moving the direction of end-effector straightly to the horizontal cassettes, edge-grip type end-effector or square substrates can be applied. Event Listings News Top AUTOMATION WORLD 2016 Our booth at AUTOMATION WORLD 2016 Twin arm robot with path planning handling Horizontal and multi-joint type single arm robot
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../news/news20210716.html	und	1710468666	3500	https://www.jel-robot.com/news/news20210716.html	News | Summer Holiday Information 2021	News | Summer Holiday Information 2021 Home  >  News  >  Summer Holiday Information Summer Holiday Information JEL will be closed for summer holiday from August 13th to August 15th, 2021 (Japan Time). In case of emergency, please contact us at the following e-mail address: 
../news/event2025.html	und	1742949193	4682	https://www.jel-robot.com/news/event2025.html	News | Event News 2025	News | Event News 2025 Home  >  News  >  Event News  >  2025 Event News 2025 SEMICON CHINA 2025 Date: March 26 to 28, 2025 Major exhibits REJE booth: JFR -PLP Transfer Robot- SINTAIKE booth: EFEM with φ300 mm  Click here for details.   SEMICON KOREA 2025 Date: February 19 to 21, 2025 Major exhibits GTFR for 300 mm wafers SAL-HV for 300 mm wafers STCR for 300 mm wafers (flip unit, vacuum, edge-grip)  Click here for details.   Event Listings News Top 
../news/news20230407.html	und	1710468668	3772	https://www.jel-robot.com/news/news20230407.html	News | Holiday Notice: Japanese Holiday Week, Golden Week Holidays of 2022	News | Holiday Notice: Japanese Holiday Week, Golden Week Holidays of 2022 Home  >  News  >  Holiday Notice Holiday Notice JEL will be closed for the following for a Japanese holiday week, Golden Week Holidays: May 3rd to 7th. In case of emergency, please contact us at the following e-mail address: 
../news/event2012.html	und	1710468635	6276	https://www.jel-robot.com/news/event2012.html	News | Event News 2012	News | Event News 2012 Home  >  News  >  Event News  >  2012 Event News 2012 SEMICON Japan 2012 Date: Wed., December 5 - Fri., December 7, 2012 Main exhibition machine type Clean robot & Aligner for handling 450mm wafers Bernoulli type end-effector for thin or warped wafersanufactured by JEL� Clean robot & Aligner for handling thin, 150mm and 200mm wafers Compact clean robot & Aligner for handling 2-3-inch, 100-150mm wafers Click here for details.   SEMICON Taiwan 2012 Date: September 5, 2012 - September 7, 2012 Main exhibition machine type Bernoulli Type End-effector for 6-12 inches SCR3100S-200-PM (Bernoulli Type) SCR + SAL3261GR Loader/Unloader System for Batch Processing of Trays or Susceptors : SSY-10020 Click here for details.   OPTO Taiwan 2012 Date : Tue., Jun. 19, 2012-Thu., Jun. 21, 2012 Main exhibition machine type SCR3100S-200-PM(Bernoulli Type) SCR + SAL3261GR Loader/Unloader System for Batch Processing of Trays or Susceptors : SSY-10020 Click here for details.   SEMICON China 2012 Date:MAR.20,2012(Tue) - MAR.22,2012(Thu) Main exhibition machine type SCR3100S-200-PM(Bernoulli Type) SCR + SAL3261GR GCR4210-300-AM Click here for details.   4th LED/OLED Lighting Technology Expo Date:JAN.18,2012(Wed) - JAN.20,2012(Fri) Main exhibition machine type Loader/Unloader System for Batch Processing of Susceptors or Trays : SSY-10020 End-Effector for Thin or Warped Wafer Super Compact Clean Robot & Aligner for Handling 2 inch-Wafer : SSCR3090S-150-PM/SAL2241 Table-top Loader System : SSY-10000 Click here for details.   Event Listings News Top 
../support/oh.html	und	1710469079	6832	https://www.jel-robot.com/support/oh.html	Online Support | Overhaul and Repair	Online Support | Overhaul and Repair Home  >  Online Support  >  Overhaul and Repair Overhaul and Repair For after-sales service request such as repair or overhaul, please download the request form below, fill out and fax or e-mail us. Before contact us, please refer to the serial number first. If any errors occur, please find the error codes or error contents. (see  Frequently Asked Question ). Service Request FormDF�20KB� Overhaul JEL recommends robot overhaul for customers to use our robots longer and to maintain functions. For overhaul request we mention below, please feel free to contact us. Also we have training programs for customers who want to understand our robots better or do basic maintenance work on their own. Purpose of Overhaul Replace consumables, slide parts, and damaged parts, etc. that have been used for a long time in order to maintain operating time afterward. Recommended Overhaul Periods Five years from JEL ex-work date (period varies depending on the installing environment and operating condition) *For some robots used in particular environment, we recommend overhaul every year to every 2 years. Contact us if you have any questions. Replacement parts Electric components (motors, encoders, sensors, or wires, etc.) Slide parts (bearings, timing belts, ball screws, etc.) Consumables (o-rings, seals, moving part cables, etc.) Damaged parts (If there is no functional problem, we will explain damaged condition. In this case, we leave the decision about the replacement up to customers.) Overhaul Main work Condition confirmation Disassemble/ assemble and adjustment Functional inspection Warranty In case the replaced parts get damaged due to defects of the product itself within 6 months from JEL ex-work date we will replace them free. Delivery Date (regular period from when robots are returned to us to when we deliver the robots) Robot for semiconductor: about 1.5 months Robot for FPD: about 2 months Contact us if you are in hurry. We will deal with quick delivery with part procurement and adjustment of production process in advance. Also the adoption of standard robots can provide a delivery within 2 weeks (ex-works delivery). Prices Contact us with the serial number of your robot (6 to 8-figure numbers inscribed on robot). We can provide overhaul plans according to your budget (such as reduction of replacement parts). Please consult with us at the following address for an overhaul or training request or any questions. Contact information JEL Corporation 2-8-20, Kusado-cho, Fukuyama-city, Hiroshima, 720-0831 Japan Tel: +81-84-932-6500 FAX: +81-84-932-6501 E-mail: Contact sales representative or Service Engineering Section.  Technical Information 
../products/BERNOULLI_2_end.html	und	1710468943	9769	https://www.jel-robot.com/products/BERNOULLI_2_end.html	Products | BERNOULLI Bernoulli Type End-Effectoron-contact type�	Products | BERNOULLI Bernoulli Type End-Effectoron-contact type� Home  >  Products  >  縲� Others Bernoulli Type End-Effectoron-contact type� Product Video Usage Environment/Specifications Product Profile Model Name Bernoulli End-Effectoron-contact type� Mechanism of Bernoulli End-Effector (Non-contact type) Click to go to the page of Mechanism of Bernoulli End-Effector. Characteristics Low cost end-effector for thin or warped wafers using the Bernoulli principle Available for any types of JEL atmospheric robots Suitable design solutions with evaluation using sample wafers based on customer's request about the wafer conditions Avoid displacement by the guide at the edges during operation Wafers are lifted without contacting end-effector except the edges One size of wafer per one end-effector Suitable for thin wafers as the Bernoulli end-effector applies pressure to wider area of wafer compared to the vacuum suction type end-effector Useful for the wafers which cannot be contacted for both sides Standard Specifications Material Aluminum Surface treatment Black alumite Wafer holding By the Bernoulli窶冱 principle using Cyclone pad and guide (PEEK) Various materials available for the contact area Utility 30 to 80 L/min (Varies depending on the wafer condition) Please contact us for the detailed specifications. Product Lineup Menu Prev Next Bernoulli End-Effectoron-contact type�
../news/event2023_05.html	und	1710468654	9721	https://www.jel-robot.com/news/event2023_05.html	News | SEMICON JAPAN 2023	News | SEMICON JAPAN 2023 Home  >  News  >  Event News  >  SEMICON JAPAN 2023 SEMICON JAPAN 2023 Thank you very much for coming to our exhibition booth. For more information on our products as well as the exhibited products below, please go to the product page or contact us . Date   Wed., December 13 - Fri., December 15, 2023 Venue Tokyo Big Sight, Japan Booth East Exhibition Hall 5 5537 Access Map & Floor Plan  Products for Exhibition  JEL booth in SEMICON JAPAN 2023 Access Map & Floor Plan Products for Exhibition ■SSY -System with φ200㎜ SMIF POD- ■SAL-HV -High accuracy pre-aligner- ■STVCR -Vacuum robot with wafer alignment function- ■STCR -TAIKO™ and thin wafer handling robot- "TAIKO™" is a trademark or registered trademark of DISCO Corporation. Event Listings News Top SEMICON JAPAN 2023 logo JEL booth at the exhibition SEMICON JAPAN 2023 booth map
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../news/event2015_05.html	und	1710468640	5104	https://www.jel-robot.com/news/event2015_05.html	News | OPTO Taiwan 2015	News | OPTO Taiwan 2015 Home  >  News  >  Event News  >  OPTO Taiwan 2015 OPTO Taiwan 2015 Thank you very much for coming to our agent's booth, Challentech International Corporation, during the exhibition. For more information on our products as well as the exhibited products below, please go to the product page or contact us. https://www.optotaiwan.com/Photonics/?lang=eng --> Date: Jun. 16, 2015 Event Listings News Top OPTO Taiwan 2015 OPTO Taiwan 2015 booth
../products/handling_2.html	und	1710468952	5906	https://www.jel-robot.com/products/handling_2.html	Products | Introduction Video of Handling (Bernoulli Type Handling)	Products | Introduction Video of Handling (Bernoulli Type Handling) Home  >  Products  >  Introduction Video of Handling  >  Bernoulli Type Handling Introduction Video of Handling Bernoulli Type Handling Low cost end-effector for thin or warped wafers using the Bernoulli principle. Available for any types of JEL atmospheric robots. Suitable design solutions with evaluation using sample wafers based on customer's request about the wafer conditions. Bernoulli type end-effector has contact type (top video餌nd non-contact type (second video). * Click to go to the page of Mechanism of Bernoulli End-Effector. Video List Previous Video Next Video YouTube Official Channel
../news/news20181120.html	und	1710468663	4772	https://www.jel-robot.com/news/news20181120.html	News | Relocation of the registered head office	News | Relocation of the registered head office Home >  News >  Relocation of the registered head office Relocation of the registered head office Thank you very much for your continued support. To increase production capacity in manufacturing, JEL will build a new factory in Saba-cho, Fukuyama by demolishing the head office building. Along with that, the location of the registered head office was moved to Fukuyama factory in Kusado-cho, Fukuyama. As the head office functions have been centralized in Fukuyama factory since 2008, there will be no major changes. We would appreciate your understanding. New Fukuyama factory will be completed in May 2020. New Head Office Address 2-8-20, Kusado-cho, Fukuyama-city, Hiroshima, 720-0831 Japan Tel +81-84-932-6500 Fax +81-84-932-6501 Registration date of relocation December 1, 2018 The address, phone and fax numbers of the head office are same as the former Fukuyama factory. 
../inquiry/thanks.html	und	1735261500	4014	https://www.jel-robot.com/inquiry/thanks.html	Contact Us | Confirmation page of inquiry form	Contact Us | Confirmation page of inquiry form Home  >  Contact Us  >  Confirmation page of inquiry form Confirmation of Inquiry Thank you very much for your inquiry. The confirmation email is sent to the email address you entered on the form. We will email you the information you are interested in as soon as possible. Thank your for your patience. Technical Information 
../inquiry/service.html	und	1735261500	4602	https://www.jel-robot.com/inquiry/service.html	Contact Us | Service Request Form	Contact Us | Service Request Form Home  >  Contact Us  >  Service Request Form Service Request Form For after-sales service request such as repair or overhaul, please download the request form below, fill out and fax or e-mail us. If you understand and agree to our privacy policy , please contact us by fax or email. Service Request FormDF�20KB� Before contact us, please refer to the serial number first. If any errors occur, please find the error codes or error contents. (see  Frequently Asked Question ). Contact information JEL Corporation 2-8-20, Kusado-cho, Fukuyama-city, Hiroshima, 720-0831 Japan Tel: +81-84-932-6500 FAX: +81-84-932-6501 E-mail: Contact sales representative or Service Engineering Section. Technical Information 
../products/search2.html	und	1378700946	17487	https://www.jel-robot.com/products/search2.html	Products | Search	Products | Search Products Support Company Employment Contact Us Home  >  Products  >  Product Search 
../products/3D-01661_end.html	und	1710468942	10610	https://www.jel-robot.com/products/3D-01661_end.html	Products | 3D-01661 (Vacuum Type End-Effector)	Products | 3D-01661 (Vacuum Type End-Effector) Home  >  Products  >  縲� Others 3D-01661 Vacuum Type End-Effector Usage Environment/Specifications Product Profile Model Name 3D-01661 Carrying Size 300mm Carrying Object Mainly silicon wafer Characteristics Y-shaped vacuum suction type end-effector, suitable for handling 300mm wafer (Random access is available). Used extensively for atmospheric robot, the end-effector holds the backside of wafer by vacuum suction (negative pressure). Conductive Teflon coating on the surface of end-effector protects against damage from charging. Standard Specifications Carrying Object SEMI standard 300mm (Mainly silicon wafer) Material High purity alumina ceramic sintered body Surface Treatment Conductive Teflon coating Wafer Holding Method Vacuum suction Total Length 242mm Thickness 3mm Please contact us for the detailed specifications. Outline Drawing (Standard) Product Lineup Menu Prev Next Icon guide ...Atmosphere ...Vacuum ...Waterproof ...Single arm ...Twin arm ...Thin wafer ...CE marking ...JEL's standard spec. ...KCs marking 3D-01661 3D-01661
../news/event2014_03.html	und	1710468638	6593	https://www.jel-robot.com/news/event2014_03.html	News | SEMICON Taiwan 2014	News | SEMICON Taiwan 2014 Home  >  News  >  Event News  >  SEMICON Taiwan 2014 SEMICON Taiwan 2014 Thank you very much for coming to our exhibition booth at SEMICON Taiwan 2014 during September 3-5. For more information on our products as well as the exhibited products below, please go to the product page or contact us. Date: September 3-5, 2014 Venue: TWTC Nangang Exhibition Hall, Taiwan Booth: No. 829 Date: Sep. 3, 2014 Products for Exhibition Clean robot for handling wafer: STCR4160SN-300-CM (New model) New twin-arm robot with low-cost, high-speed handling, and no step-out error ・Vacuum suction type end-effector to hold wafer edge (5mm from the edge):     Random access is available ・Thin Bernoulli type end-effector:     For warped or thin wafer, and random access to cassette slot is available Table-top loader system: SSY-10000 ・Available for various types of wafers; 2, 3 inch, 100mm glass, sapphire, SiC,     or GaN or others Bernoulli type end-effector and Bernoulli hand for thin or warped wafer: Bernoulli Hand: BRP-02 ・Low-cost Bernoulli type end-effector available for customization     Visitors experienced the Bernoulli type wafer holding at the exhibition. Event Listings News Top SEMICON Taiwan 2014 SEMICON Taiwan 2014 STCR4160SN-300-CM (New model) SSY-10000 Bernoulli type end-effector and Bernoulli hand for thin or warped wafer
../support/often-10.html	und	1710469074	4542	https://www.jel-robot.com/support/often-10.html	Online Support | Frequently Asked Question: The teaching box is connected, but nothing is displayed on the teaching box display. Why?	Online Support | Frequently Asked Question: The teaching box is connected, but nothing is displayed on the teaching box display. Why? Home  >  Online Support  >  Frequently Asked Question  >  Error codes or operations Error codes or operations Q: The teaching box is connected, but nothing is displayed on the teaching box display. Why? A: Check the setting and condition of the controller. Ensure that the changeover switch (R/T) of the controller is set to the T side. Remove the RS232C cable. Ensure that the teaching box connector is securely connected. Note that the interlock may be provided depending on the specifications.  Click to see JELDATA3 Operation Manual .  List of FQA  Contact Us 
../news/event2020_02_1.html	und	1710468650	6725	https://www.jel-robot.com/news/event2020_02_1.html	News | SEMICON CHINA 2020 will be delayed	News | SEMICON CHINA 2020 will be delayed Home  >  News  >  Event News  >  SEMICON CHINA 2020 will be delayed SEMICON CHINA 2020 will be delayed SEMI China announced that SEMICON CHINA 2020, scheduled to be held in Shanghai from March 18 to 20, will be delayed due to the outbreak of the new coronavirus.  Click to see the official page. Event Listings News Top SEMICON CHINA 2020 banner
../news/event2018_01.html	und	1710468646	8227	https://www.jel-robot.com/news/event2018_01.html	News | SEMICON KOREA 2018	News | SEMICON KOREA 2018 Home  >  News  >  Event News  >  SEMICON KOREA 2018 SEMICON KOREA 2018 Thank you very much for coming to our exhibition booth at SEMICON KOREA 2018. For more information on our products as well as the exhibited products below, please go to the product page or contact us . Date   January 31 to February 2, 2018 Venue COEX (Convention and Exhibition Center), Seoul, Korea Booth No. A254  Products for Exhibition INA booth in SEMICON KOREA 2018 Products for Exhibition Horizontal and multi-joint type single-arm robot: GTCR5280 Twin end-effector mounted on the single-arm has the same function as a twin-arm robot. Origin-search is unnecessary by using AC servo motors with absolute encoders. New Aligner SAL3000HV Series (full auto-adjustment version) Full auto-adjustment software "JEL ALIGN TOOL" allows automatic alignment for various kinds of wafers. Event Listings News Top SEMICON KOREA 2018 banner Our booth at SEMICON KOREA 2018 Horizontal and multi-joint type single-arm robot New Aligner SAL3000HV Series (full auto-adjustment version)
../products/JCT1-0500_tb.html	und	1710468954	15344	https://www.jel-robot.com/products/JCT1-0500_tb.html	Products | JCT1-0500 (Teaching Box)	Products | JCT1-0500 (Teaching Box) Home  >  Products  >  〉 Others JCT1-0500 Teaching Box Usage Environment/Specifications Product Profile Model Name JCT1-0500 Communication RS232C Applicable Robot Type Cylindrical coordinate type Characteristics Used for teaching operation of robot. Reading error codes is also available. Equipped with 3-position dead-man switch Easy to operate, one-handed type, weighing only 500g (cable excluded) Equipped with push-button self-diagnosis function by internal software Standard Specifications Specifications Input Voltage DC5V (±5%) Communication RS232C Environment 0 to 40℃ (No condensation) Attached Cable Up to 5 meters Emergency Stop Contact Normally open contact External Dimensions W118×H225×D33(w/contrast adjustment hole attached/Emergency stop button excluded) Mass 500g(Cable excluded) Display Screen LCD monochrome graphic display (66.6×33.3mm, 20×8 characters, 128×64 dots) Connector HR10-7P-6P(73)(HIROSE ELECTRIC CO., LTD.) Emergency Stop Button A165E-S-03U (Red) (OMRON) Output for emergency stop switch: Photo coupler output (UL508 and EN418 standard compliant) Deadman Switch A4E-B200HS (OMRON) 3-position enabling switch (UL508 and ANSI/RIA R15.06-1999 standard compliant) Key Sheet Thin dome array sheets: 9 columns x 5 rows (45 pcs) Applicable Robot Type Cylindrical coordinate type Connector Specifications Pin No. Signal Contents Assignment of Connector Pin 1 GND Ground for power supply View from Teaching box 2 TXD RS232C transmitted data 3 RXD RS232C received data 4 EMG Emergency stop button output 5 DSW Deadman switch output 6 +5V Power: DC+5V Outline Drawing (Standard) Product Lineup Menu Prev Next Icon guide ...Atmosphere ...Vacuum ...Waterproof ...Single arm ...Twin arm ...Thin wafer ...CE marking ...JEL's standard spec. ...KCs marking Teaching Box Hirose round type JCT1-0500
../company/saba1.html	und	1710468473	4633	https://www.jel-robot.com/company/saba1.html	Company | Building of New Factory	Company | Building of New Factory Home  >  Company  >  Building of New Factory Building of New Factory Completed image of Saba factory With the expected further growth in semiconductor market, JEL will increase mass production capacity. We are currently building a new factory in Saba-cho in Fukuyama city, Hiroshima, which is scheduled to be completed in June 2020, intending to meet various demands of our customers. Address 245-1 Saba-cho, Fukuyama-city, Hiroshima, 720-0835 Japan Company TOP Building of New Factory
../support/qanda/qanda3.html	und	1710469145	7328	https://www.jel-robot.com/support/qanda/qanda3.html	Online Support | Operation/Control Troubles	Online Support | Operation/Control Troubles Home 縲� Online Support  >  Wafer-Search Operation Procedure and Troubleshooting  >  Operation/Control Troubles Troubleshooting Operation/Control Troubles Q1. Unable to operate the teaching box A1-1 Check the connection of the teaching box. Is the teaching box connected properly? Check the screws. If they are not connected properly, connect and tighten the screws properly. A1-2 Check if the select switch (R/T) of the controller is set to 窶弋窶� (*Some controllers do not have the select switch. /*Some robots are terminal connection type). If not, select 窶弋" and operate. Is RS232C cable connected? If so, disconnect the RS232C cable and operate. A1-3 Is the controller select switch set to other than窶�0"? Is it set to the sequencer mode? If the select switch is set to other than "0", set to 窶�0窶� and check again. A1-4 Check if the cursor on the controller display is blinking. If not, contact JEL service section. If blinking, check if the robot is in operation. Please check the signals from the system. Q2. Unable to control via sequencer A2-1 Is the I/O cable connected properly? Check the connection of the I/O cable. If the cable is not connected, connect the cable properly and check again. A2-2 Check if the I/O voltage and capacity are not over 24V. Or short? If it is not 24V, input properly and check again. A2-3 Check if the compound command has been input (written to the controller)? If not, write the compound command data via software JEL DATA3 and check again. A2-4 Check the controller select switch. Is 窶廝窶� or 窶廚窶� selected? If not, select 窶廝窶� or 窶廚窶� and check again. A2-5 Check if both 窶彝EADY窶� and 窶廝USY窶� signals are properly output. Turn the select switch to 窶廚窶� and check the dot display. If "READY" is not displayed and 窶廝USY窶� signal has been output, check if the robot is in operation. Check the robot again. A2-6 If "READY" is displayed, check if the alarm stop signal is not input. Check I/O, teaching box and external input. Q3. Unable to communicate via RS232C A3-1 Check if the RS232C communication cable is connected properly, not connected to RS485 port. If the cable is not connected to RS232C, connect properly and check again. A3-2 Check if the controller select switch is set to 窶�0窶�. If not, set to 窶�0窶� and check again. (This may differ depending on the customer specs.) A3-3 Check if teaching box is not connected, or it is not turned ON. If it is connected, or turned ON, disconnect and check again. A3-4 Check if teaching box select switch is set to 窶彝窶�. If窶弋窶� is selected, select 窶彝窶�. (This may differ depending on the customer specs.) A3-5 Check the COM port and baud rate (9600dps). If the setting is wrong, set it correctly. A3-6 Check the robot body No. Communicate by the correct setting. If body No. is correct, turn the power OFF once, and check again.  Technical Information 
../products/semicon2022.html	und	1710468968	5602	https://www.jel-robot.com/products/semicon2022.html	Products | Introduction of product videos exhibited at Semicon Japan 2022	Products | Introduction of product videos exhibited at Semicon Japan 2022 Home  >  Products  >  Product News  >  Introduction of product videos exhibited at Semicon Japan 2022 Introduction of product videos exhibited at Semicon Japan 2022 Please take a look at the lineup of our exhibition robots for Semicon Japan 2022. Please feel free to contact us for more information about exhibition robots and our products. MTCR for φ300 mm TAIKO™ wafer SAL forφ300 mm TAIKO™ wafer "TAIKO™" is a trademark or registered trademark of DISCO Corporation. For SEMICON JAPAN 2022 page. 
../err500.html	und	1710469266	3107	https://www.jel-robot.com/err500.html	JEL Corporation | Under Maintenance	JEL Corporation | Under Maintenance Home  >  Message Under Maintenance Sorry, this page is currently undergoing maintenance. If you are in hurry, please feel free to contact us. 
../support/man001/w001.html	und	1710469104	5880	https://www.jel-robot.com/support/man001/w001.html	Online Support | 1: Setting of the lowest slot of the cassette (WLO setting)	Online Support | 1: Setting of the lowest slot of the cassette (WLO setting) Home  >  Online Support  >  Manuals/Troubleshooting  >  Wafer-Search Operation Procedure and Troubleshooting  >  1: Setting of the lowest slot of the cassette (WLO setting) Wafer-Search Operation Procedure 1: Setting of the lowest slot of the cassette (WLO setting) 縲�1縲� Teach the robot the position where a wafer in the first slot (lowest slot) is detected. 縲�2縲� After moving the robot, press the dot button on the teaching box to turn on the light source of a wafer-search sensor. *The procedure varies depending on specifications. For details, please refer to the instruction manual. 縲�3縲� With the teaching box, check the Z-axis value of the center of wafer thickness in the first slot (lowest slot) (see Figure 1) and set the value (see Figure 2). 縲�4縲� Set the point data via serial communication. Input the following commands for configuration: (When the robot is $1, the commands are: $1WLO ****)  Input the Z-axis value displayed in the teaching box in "DEC". Obtain the current designated data Data to be set Figure 1 Figure 2 Contents Back Next  Technical Information teaching position display of teaching box
../products/SC-IW-200_end.html	und	1710468964	10672	https://www.jel-robot.com/products/SC-IW-200_end.html	Products | SC-IW-200 (Vacuum Type End-Effector)	Products | SC-IW-200 (Vacuum Type End-Effector) Home  >  Products  >  縲� Others SC-IW-200 Vacuum Type End-Effector Usage Environment/Specifications Product Profile Model Name SC-IW-200 Carrying Size 3 inch, 100 to 200mm Carrying Object Mainly silicon wafer Characteristics I-shaped vacuum suction type end-effector, suitable for handling wafer up to 200mm (Random access is available). Used extensively for atmospheric robot, the end-effector holds the backside of wafer by vacuum suction (negative pressure). Conductive Teflon coating on the surface of end-effector protects against damage from charging. Standard Specifications Carrying Object SEMI standard 3 inch, 100 to 200mm (Mainly silicon wafer) Material High purity alumina ceramic sintered body Surface Treatment Conductive Teflon coating Wafer Holding Method Vacuum suction Total Length 200mm Thickness 2mm Please contact us for the detailed specifications. Outline Drawing (Standard) Product Lineup Menu Prev Next Icon guide ...Atmosphere ...Vacuum ...Waterproof ...Single arm ...Twin arm ...Thin wafer ...CE marking ...JEL's standard spec. ...KCs marking SC-IW-200 SC-IW-200
../news/topics2016.html	und	1710468670	10480	https://www.jel-robot.com/news/topics2016.html	News | Topics 2016	News | Topics 2016 Home  >  News  >  2016 News 2016 December 22, 2016 New Products SSY-11010 (Automatic wafer transfer system for wafer container) GCR4210 (Robot with end-effectors with rotation function) MTCR4160 (Tape frame handling robot) JCR4400 (Robot with alignment function of molded (PLP) substrate) New Aligner SAL3000HV Series (full auto-adjustment version) November 24, 2016 3D CAD drawings are available on website. We have updated the 3D CAD drawings�   ·  MTCR4280 (Robot for 450mm wafer)   ·  MTCR4160 (Tape frame for 100 to 200mm wafer)   ·  GCR4280obot for 450mm wafer)   ·  GTVCR5330 (Vacuum robot for 300mm wafer)   ·  LVHR3440Sobot for FPD glass substrate�   ·  C4451 (Controller) August 10, 2016 Company Added robots to J-tech Center. Operation check using customers' wafer is available. June 2, 2016 Change of JEL窶冱 Warranty Period JEL窶冱 warranty period was changed from 1 year to 2 years from JEL ex-work date. Applicable Products: All JEL products that we order from June 1, 2016 May 30, 2016 3D CAD drawings are available on website. We have updated the 3D CAD drawings�   ·  SCR3100CS (Atmospher robot for 300mm wafer)   ·  SVCR3260 (Vacuum robot for 300mm wafer�   ·  SAL38C2HV (Multi work aligner)   · SAL30J1   ·  SAL46C6 (Optical aligner)   ·  SAL3261GR (Optical aligner)   ·  C5000S (Controller) May 16, 2015 Company Added robots to Fukuyama factory showroom. April 27, 2016 Company Clean booth with a cleanliness of class 1 is installed in a clean room in Fukuyama Factory. (The area and volume are increased by 1.8 times and 2.6 times compared with the existing clean booth.) March 10, 2016 Products Software for alignment adjustment  "JEL ALIGN TOOL" will come with Aligner SAL-HV series. Topic Listings News Top New products lineup 3D CAD drawings J-tech Center 2-year warranty 3D CAD drawings Fukuyama factory showroom JEL ALIGN TOOL
../news/topics2015.html	und	1710468669	12368	https://www.jel-robot.com/news/topics2015.html	News | Topics 2015	News | Topics 2015 Home  >  News  >  2015 News 2015 September 2, 2015 New Products SSY-11010 (Automatic wafer transfer system for wafer container) August 7, 2015 Products Updated the page of Introduction Video of Handling to include the waterproof robot. July 24, 2015 Products Updated the page of Introduction Video of Handling to include the mapping operation (through-beam mapping). June 12, 2015 Products Updated the page of Introduction Video of Handling to include the tape frame handling. June 3, 2015 Products Updated the page of Introduction Video of Handling to include the path planning handling. June 1, 2015 Company Expansion of Fukuyama Factory was completed. June 1, 2015 Company Announcement of new President April 16, 2015 Technical Information Updated the page of Technical Information to include the Closed-loop Control. April 14, 2015 Products Updated the page of Introduction Video of Handling to include the susceptor/tray handling. April 3, 2015 New Products GTVCR5330 (Vacuum robot for handling 300mm wafer) March 20, 2015 Products Updated the page of Introduction Video of Handling to include the closed-loop control. February 13, 2015 Products Updated the page of Introduction Video of Handling to include the multi work aligner. February 3, 2015 Company Added robots to Fukuyama factory showroom. January 20, 2015 Company Added robots to J-tech Center. Operation check using customers' wafer is available. January 19, 2015 Products Updated the page of Introduction Video of Handling to include the 450mm wafer handling with flip function. Topic Listings News Top New Products Waterproof robot Mapping operation Tape frame handling Introduction Video of Handling Closed-loop control Introduction Video of Handling New Products Introduction Video of Handling Introduction Video of Handling Fukuyama factory showroom J-tech Center Introduction Video of Handling
../inquiry/index.html	und	1735261501	4807	https://www.jel-robot.com/inquiry/index.html	Contact Us | Contact Us TOP	Contact Us | Contact Us TOP Home  >  Contact Us Contact Us JEL Contact Information (Head Office) Overseas Agencies (Sales) Technical Information 
../news/topics2021.html	und	1710468671	11748	https://www.jel-robot.com/news/topics2021.html	News | Topics 2021	News | Topics 2021 Home  >  News  >  2021 News 2021 December 30, 2021 SEMICON TAIWAN 2021 Thanks for coming to the exhibition. December 28, 2021 JEL dedicated website is available now. Website display period�2021/12/28�2022/1/31 December 17, 2021 SEMICON JAPAN 2021 HYBRID Thanks for coming to the exhibition. December 15, 2021 JEL dedicated website is available now. Website display period�2021/12/15�2022/1/31 November 22 2021 New Year's Holiday Information July 16, 2021 Summer Holiday Information June 1, 2021 Opened of JELhanghai嘘obotics Co., Ltd. JEL established a subsidiary in China (Shanghai). March 29, 2021 Updated product page March 19, 2021 SEMICON CHINA 2021 Thanks for coming to the exhibition. January 15, 2021 SEMICON JAPAN VIRTUAL Thanks for coming to the exhibition. News List News Top SEMICON TAIWAN 2021 JEL dedicated website for SEMICON exhibition robots SEMICON JAPAN 2021 HYBRID JEL dedicated website for SEMICON exhibition robots JELhanghai嘘obotics Co., Ltd. SEMICON CHINA 2021 SEMICON JAPAN VIRTUAL
../news/event2013_04.html	und	1710468637	7571	https://www.jel-robot.com/news/event2013_04.html	News | SEMICON Japan 2013	News | SEMICON Japan 2013 Home  >  News  >  Event News  >  SEMICON Japan 2013 SEMICON Japan 2013: Thanks for coming to the exhibition Date : December 4,2013 Thank you very much for coming to our exhibition booth. For more information on our products as well as the exhibited products below, please go to the product page or contact us. Date: Wed., December 4 - Fri., December 6, 2013 Venue: Makuhari Messe, Chiba Japan JEL booth: No. 4A-501 Products for Exhibition Clean robot & Aligner for handling 450mm wafer: GCR4280-420-AM/SAL30J1HV (New model) 繝サRobot with edge grip end-effector and flip function     We demonstrated high-speed handling of 450mm wafer. 繝サNew aligner for notchless wafer Clean robot & Aligner for handling wafer: STCR4160SN-300-PM (New model)/SAL3481HV (New model) 繝サNew twin-arm robot with low-cost, high-speed handling, and no step-out     error 繝サNew aligner available for any material of wafer Table-top loader system: SSY-10000 繝サAvailable for various types of wafers; 2, 3 inch, 100mm glass, sapphire, SiC,     or GaN or others Clean robot for handling wafer & Bernoulli type aligner: STCR4160SN-300-PM (New model)/SAL3481 New twin-arm robot with low-cost, high-speed handling, and no step-out error 繝サVacuum suction type end-effector to hold wafer edge (5mm from the edge):     Random access is available 繝サThin Bernoulli type end-effector (Patent pending):     For warped or thin wafer, and random access to cassette slot is available Bernoulli type end-effector and Bernoulli hand for thin or warped wafer: Bernoulli Hand: BRP-01 繝サLow-cost Bernoulli type end-effector available for customization Event Listings News Top SEMICON Japan2013 
../inquiry/abroad.html	und	1741825873	22623	https://www.jel-robot.com/inquiry/abroad.html	Contact Us | Customer Support Contact (Overseas)	Contact Us | Customer Support Contact (Overseas) Home  >  Contact Us  >  Customer Support (Overseas) Customer Support Contact (Overseas) JEL provides total support for your maintenance management by our service engineering staff. Overseas agencies and partners KOREA JELK CO., LTD. Address 75, Seokmun-gil, Seonggeo-eup, Seobuk-gu, Cheonan-si, Chungnam-do 31053, Korea Tel Service : +82-41-583-6360 Sales : +82-10-7420-6360 FAX +82-41-583-6469 E-mail URL https://www.jelk.co.kr Inatech & CORP Inc. Address #C-812，168，Gasan digital 1-ro，Geumcheon-gu，Seoul 08507，Korea TEL +82-2-2026-0660 FAX +82-2-2026-0661 E-mail URL http://www.inatechncorp.com Business Offices Dae Jeon Office Address #402, Daewoong B/D, 331, Dongdaejeon-ro, Gayang-dong, Dong-gu, Daejeon 34574, Korea TEL +82-42-626-5588 FAX +82-42-626-3067 E-mail (Dong-Su, Kang) Bu San Office Address #1106, Rowin B/D, 12, Beobwon-ro, Geoje-dong, Yeonje-gu, Busan 47511, Korea TEL +82-51-505-8615 FAX +82-51-557-5213 E-mail (Dong-Hyeon, Shin) TAIWAN Challentech International Corporation Address No.21, Taihe Rd., Zhubei City, Hsinchu County 30267, Taiwan (R.O.C.) TEL Service/Sales Contact: Lobo Shen +886-3-5536525 ext.2201 FAX +886-3-5531908 E-mail URL https://www.challentech.com.tw JEL Automation Co., Ltd. Address 1F., No. 29, Jiazheng 9th St., Zhubei City, Hsinchu County 302053, Taiwan (R.O.C.) TEL +886-3-6583741 E-mail URL https://www.jel-automation.com CHINA Beijing REJE Automation Co., Ltd. Address Building 3, No.10, Kechuang 10th Street, BDA, Beijing 101111, China TEL +86-10-5382-2087 +86-133-2115-2839 E-mail URL https://www.reje.com.cn Business Offices Shanghai Office Shanghai REJE Robotics Co., Ltd. Address Room 306-11, Building T4, Libao Plaza, 36 Shenbin Road, Minhang District, Shanghai 201106, China TEL +86-178-1202-2295 E-mail Sintaike Semiconductor Equipment (Shanghai) Co., Ltd. Address Building 6, Nanfang Urban Park, Lane 1165, Jindu Road, Minhang District, Shanghai 201108, China TEL +86-021-6088-8500 +86-135-6466-5802 E-mail URL http://www.sintaike.com U.S.A Hine Automation, LLC Address 12495 34th St. North, Suite B St. Petersburg, FL 33716, U.S.A. TEL +1-813-749-7519 E-mail URL https://hineautomation.com AES motomation Inc. Address 4041 Clipper Court Fremont, CA 94538, U.S.A. TEL +1-510-490-9400 E-mail URL http://www.motomation.com GERMANY AES motomation GmbH Address Duesselstrasse 8a D-41564 Kaarst, Germany TEL +49-0-2131-7768-10 E-mail URL http://www.motomation.com JEL overseas contact CHINA JEL (Shanghai) Robotics Co., Ltd. Address 625 6F, CHAMTIME Tower C, No.3, Lane 2889 JinkeRoad, Pudong New District, Shanghai 201203, P.R., China TEL Denichiro Son +86-21-2050-1625 (Landline) +86-13021105268 (Mobile) E-mail URL https://www.jel-robot.com.cn JEL (Changzhou) Robotics Technology Co., Ltd. Address Building 5, Changzhou Oriental Automotive Electronics Industrial Park, No. 1668, Dongguan Road, Lucheng Street, Wujin District, Changzhou City, Jiangsu Province 213025, China TEL Denichiro Son +86-13021105268 (Mobile) URL https://www.jel-robot.com.cn KOREA JEL Corporation Korea Branch Address F20Ho, 4F 401,402Ho, 526, Maesonggosaek-ro, Gwonseon-gu, Suwon-si, Gyeonggi-do 16634, Korea TEL Korea: +82-10-3481-6360 Japan: +81-80-6340-9905 (080-6340-9905) E-mail URL https://www.jel-robot.co.kr JELK Inatech & CORP Inc. Dae Jeon Office Email Bu San Office Email Challentech International Corporation JEL Automation Co., Ltd. Beijing REJE Automation Co., Ltd. Shanghai Office Email Sintaike Hine Automation, LLC AES motomation Inc. AES motomation GmbH JEL logo E-mail JELC logo JEL logo E-mail
../news/news20150530.html	und	1710468659	5059	https://www.jel-robot.com/news/news20150530.html	News | Completed the expansion of Fukuyama Factory	News | Completed the expansion of Fukuyama Factory Home  >  News  >  Completed the expansion of Fukuyama Factory Completed the expansion of Fukuyama Factory The expansion of Fukuyama Factory was completed in May 2015. Two clean rooms are located in the new building to improve the manufacturing efficiency and to meet a wide variety of customers' needs. Outline of Fukuyama Factory New Building Total floor area 1,177 m 2 Main facilities Two clean rooms, Development section Production model System, Wafer transfer robot for semiconductors, or others Completed the expansion of Fukuyama Factory
../products/STVCR4160.html	und	1710468973	15228	https://www.jel-robot.com/products/STVCR4160.html	Products | STVCR4160 (Servo motor type) | Wafer Transfer Atmospheric Robot	Products | STVCR4160 (Servo motor type) | Wafer Transfer Atmospheric Robot Home 縲� Products 縲� 縲� Robot for Semiconductor STVCR4160 (Servo motor type) 4-Axis Cylindrical Coordinate Clean Robot Usage Environment/Specifications Product Profile Model Name STVCR4160 Environment Vacuum (Temp. 15°C to 50°C) Driving unit咾lean room atmosphere  (Temp. 15°C to 40°C) Arm Twin arm Operating Range 315mm (3rd joint center) Vertical Stroke 50mm Payload Capacity Below 2kg (calculated for the arm 3rd joint) List of Product Model Product Model Vertical Stroke STVCR4160-050-AM 50mm The image above is of STVCR4190-050-SM. Characteristics Designed for handling wafers in the vacuum chamber of production line and inspection line. Double payload and superior cost performance compared to STVHR series. Compatible with STVHR series and it is possible to replace or upgrade into STVCR series. Execution of origin search is not required by using the servo motors with absolute encoders. Magnetic fluid sealing is used for arm joint. Vacuum sealing: Magnetic fluid sealing and bellows are used. For cleanliness: 5µm mesh filter installed for exhaust ventilation in the arm. Twin-arm reduces the wafer swap time. Motion monitoring is available. RS232C and parallel photo I/O are standard for control. AC servo motors with absolute encoders installed in all axes. High-speed, high-accuracy wafer handlingby S-curved speed control. AC servo motor or 2-phase pulse motor type is selectable. Wafer holding: end-effector with passive edge or edge grip type End-effector. End-effector material: CFRP, Al, ceramic, or others. Optimal end-effector is selectable according to the carrying object and line layout. Standard Specifications Representative specifications of STVCR4160-050-AM. It can be changed depending on the carrying object and end-effector type. Specifications of Robot Robot Model STVCR4160-050-AM Carrying Object Wafer up to 300mm Wafer Holding Method By end-effector with passive edge or edge grip type end-effector Robot Model Type Cylindrical coordinate type Control Axis 4-axis Motor Type AC servo motor Operating Range 3rd joint center Rotation Angle (Theta-axis) Vertical Stroke (Z-axis) 600mm 330deg 50mm Carrying Speed Arm (R-axis) Rotation Angle (Theta-axis) Vertical Stroke (Z-axis) 520mm/2.0sec 330deg/2.7sec 50mm/1.5sec Resolution Arm (R-axis) Rotation Angle (Theta-axis) Vertical Stroke (Z-axis) Below 4.91µm 0.00088deg 0.488µm Repeatability Within ±0.1mm Cleanliness Magnetic fluid sealing and filter Vacuum resistance 1.33×10 -6 Pa Utility Power: AC200V single phase ±10% 1kVA Option End-Effector *Click the items below to review the end-effectors other than JEL standard types. Other Option Product Lineup Menu Prev Next Icon guide ...Atmosphere ...Vacuum ...Waterproof ...Single arm ...Twin arm ...Thin wafer ...CE marking ...JEL's standard spec. ...KCs marking STVCR4190_SM
../support/man002/s006.html	und	1710469131	4981	https://www.jel-robot.com/support/man002/s006.html	Online Support | JELDATA3 Operation Manual | Baud rate	Online Support | JELDATA3 Operation Manual | Baud rate Home  >  Online Support  >  Wafer-Search Operation Procedure and Troubleshooting  >  JELDATA3 Operation Manual 縲� 8. Setup JELDATA3 Operation Manual 8. Setup 8.3 Baud rate (Figure: 8-5) It is for setting a communication baud rate. ( Figure: 8-5 ) The baud rate (selectable): 4800 bps, 9600 bps (standard), 19200 bps, 38400 bps, and 57600 bps Make sure to close the port before changing the setting. ( Figure: 8-6 ) (Figure: 8-6) ! Caution It is not necessary to change the communication baud rate. Only if the baud rate on the controller is changed, it is necessary to change this setting. ! Caution The communication cannot be executed if the baud rate setting is different from the setting on the controller. Contents 竊殖ack Next竊�  Technical Information baud rate select the baud rate
../products/C4451_cont.html	und	1710468945	10184	https://www.jel-robot.com/products/C4451_cont.html	Products | C4451 | Controller	Products | C4451 | Controller Home  >  Products  >  縲� Others C4451 Controller Usage Environment/Specifications Product Profile Model Name C4451 Interface RS232C and parallel photo I/O The image above is of C4451. Characteristics JEL has accumulated know-how on methods of the controller development of our robots for semiconductors or FPD. Customization is available. Contact us for the detailed specifications. Compact and lightweight design Stepping motor: Unipolar/bipolar Controller interface: RS232C and parallel photo I/O (8 bit IN and OUT, I/O extension available) are standard. High-speed and smooth operation by S-curved speed control Easy teaching with the teaching box Flexible combined operations by compound commands Standard Specifications Outline Drawing (Standard) Product Lineup Menu Prev Next Icon guide ...Atmosphere ...Vacuum ...Waterproof ...Single arm ...Twin arm ...Thin wafer ...CE marking ...JEL's standard spec. ...KCs marking C4451 C4451
../news/topics2025.html	und	1744094845	7385	https://www.jel-robot.com/news/topics2025.html	News | Topics 2025	News | Topics 2025 Home  >  News  >  2025 News 2025 April 08, 2025 Holiday Notice JEL will be closed for a Japanese holiday week: April 26th, 27th, 29th; May 3rd to 6th. March 28, 2025 SEMICON CHINA 2025 Thanks for coming to the exhibition. February 21, 2025 SEMICON KOREA 2025 Thanks for coming to the exhibition. News List News Top SEMICON CHINA 2025 SEMICON KOREA 2025
../products/SSCR3090S-PM.html	und	1710468969	15282	https://www.jel-robot.com/products/SSCR3090S-PM.html	Products | SSCR3090S (For small wafer) | Wafer Transfer Atmospheric Robot	Products | SSCR3090S (For small wafer) | Wafer Transfer Atmospheric Robot Home 縲� Products 縲� 縲� Robot for Semiconductor SSCR3090S (For small wafer) 3-Axis Cylindrical Coordinate Clean Robot Product Video Usage Environment/Specifications Product Profile Model Name SSCR3090S Environment Clean room atmosphere Arm Single arm Operating Range 175mm (3rd joint center) Vertical Stroke 150mm Payload Capacity Below 0.1kg (wafer only, calculated for the arm 3rd joint) List of Product Model Product Model Vertical Stroke SSCR3090S-150-PM 150mm The video is of SSCR3090S and SAL2241 . Characteristics Designed for handling small wafers in a production line or inspection line of semiconductor or LED production. Minimized footprint and lightened weight compactify the system layout. Arm lineup: 90mm It has compatible unit with SSCR2090S-PM and can be changed into link arm type and Z-axis less type. Motion monitoring is available. RS232C and parallel photo I/O are standard for control. 2-phase stepping motor installed in all axes. High-speed, high-accuracy wafer handlingby S-curved speed control. Wafer holding: end-effector with vacuum suction, passive edge type End-effector. End-effector material: CFRP, Al, ceramic, or others. Optimal end-effector is selectable according to the carrying object and line layout. Standard Specifications Example of standard specifications with JEL standard end-effector (vacuum type) Specifications of Robot Robot Model SSCR3090S-PM Carrying Object Up to 100mm wafer Wafer Holding Method By vacuum suction Robot Model Type Cylindrical coordinate type Control Axis 3-axis Motor Type Stepping motor Operating Range From the robot center to the wafer center Rotation Angle (Theta-axis) Vertical Stroke (Z-axis) 300mm (Link arm type) 370deg 150mm Carrying Speed (Ave.) Arm (R-axis) Rotation Angle (Theta-axis) Vertical Stroke (Z-axis) 220mm/sec 180deg/sec 120mm/sec Carrying Speed (Max.) Arm (R-axis) Rotation Angle (Theta-axis) Vertical Stroke (Z-axis) 330mm/sec 280deg/sec 160mm/sec Repeatability Within ±0.1mm Cleanliness ISO Class 2 (at wafer transfer level when exhausting driving part) Utility Power: DC24V±10% 4A; Vacuum: -53kPa or more Specifications of Controller Controller Model C4301 series Interface RS232C and parallel photo I/O Outline Drawing (Standard) Option End-Effector *Click the items below to review the end-effectors other than JEL standard types. Other Option Product Lineup Menu Prev Next Icon guide ...Atmosphere ...Vacuum ...Waterproof ...Single arm ...Twin arm ...Thin wafer ...CE marking ...JEL's standard spec. ...KCs marking SSCR3090S-PM SSCR3090S-PM
../news/news20120713.html	und	1710468656	4116	https://www.jel-robot.com/news/news20120713.html	News | Summer Holiday Information	News | Summer Holiday Information Home  >  News  >  Summer Holiday Information Summer Holiday Information JEL will be closed for summer holiday from August 11th to August 15th, 2012 (Japan Time). In case of emergency, please contact us at the following e-mail address: News Topics 2014 2013 2012 2011 Event News 2014 2013 2012 2011 2010 2009 2008 
../products/SC-IW-240_end.html	und	1710468964	10672	https://www.jel-robot.com/products/SC-IW-240_end.html	Products | SC-IW-240 (Vacuum Type End-Effector)	Products | SC-IW-240 (Vacuum Type End-Effector) Home  >  Products  >  縲� Others SC-IW-240 Vacuum Type End-Effector Usage Environment/Specifications Product Profile Model Name SC-IW-240 Carrying Size 3 inch, 100 to 300mm Carrying Object Mainly silicon wafer Characteristics I-shaped vacuum suction type end-effector, suitable for handling wafer up to 300mm (Random access is available). Used extensively for atmospheric robot, the end-effector holds the backside of wafer by vacuum suction (negative pressure). Conductive Teflon coating on the surface of end-effector protects against damage from charging. Standard Specifications Carrying Object SEMI standard 3 inch, 100 to 300mm (Mainly silicon wafer) Material High purity alumina ceramic sintered body Surface Treatment Conductive Teflon coating Wafer Holding Method Vacuum suction Total Length 240mm Thickness 2mm Please contact us for the detailed specifications. Outline Drawing (Standard) Product Lineup Menu Prev Next Icon guide ...Atmosphere ...Vacuum ...Waterproof ...Single arm ...Twin arm ...Thin wafer ...CE marking ...JEL's standard spec. ...KCs marking SC-IW-240 SC-IW-240
../support/man001/w008.html	und	1710469106	5690	https://www.jel-robot.com/support/man001/w008.html	Online Support | 8: Setting of the speed of wafer-search (WSP setting)	Online Support | 8: Setting of the speed of wafer-search (WSP setting) Home  >  Online Support  >  Manuals/Troubleshooting  >  Wafer-Search Operation Procedure and Troubleshooting  >  8: Setting of the speed of wafer-search (WSP setting) Wafer-Search Operation Procedure 8: Setting of the speed of wafer-search (WSP setting) *WSP command may not be used depending on specifications. Set the speed of wafer-search. Setting unit is 4-digit decimal number, same as 窶廾H窶� described in the explanation of each parameter/speed settings. Set the speed of wafer-search via serial communication. Input the following commands for configuration: Input the speed of wafer search in "DEC". Obtain the current designated data Data to be set *When the speed of wafer-search is fast, the results of wafer-search may not be detected correctly. *When the speed of wafer-search becomes faster, the detection width tends to be smaller than the actual wafer width. This completes the procedures for the parameter settings required for wafer-search. All the designated data is to be memorized in EEPROM with the commands 窶廣W窶� and 窶廛W窶�. Proceed to the actual execution of wafer-search. Contents Back Next  Technical Information 
../news/event2017_05.html	und	1710468645	5038	https://www.jel-robot.com/news/event2017_05.html	News | SEMICON TAIWAN 2017	News | SEMICON TAIWAN 2017 Home  >  News  >  Event News  >  SEMICON TAIWAN 2017 SEMICON TAIWAN 2017 Thank you very much for coming to our agent's booth, Challentech International Corporation during the exhibition. For more information on our products, please go to the product page or contact us. Date   Sept 13-15, 2017 Venue TWTC Nangang Exhibition Hall, Taiwan Booth 516 (4F) (Challentech booth) Products for Exhibition Tape frame handling robot Accessible to all slots in the cassette by random access with clip-type end-effector. Event Listings News Top SEMICON TAIWAN 2017 Our booth at SEMICON TAIWAN 2017 Tape frame handling robot
../support/warranty.html	und	1710469081	4574	https://www.jel-robot.com/support/warranty.html	Online Support | Change of JEL窶冱 Warranty Period	Online Support | Change of JEL窶冱 Warranty Period Home  >  Online Support  >  Notification  >  Change of JEL窶冱 Warranty Period Change of JEL窶冱 Warranty Period As of June 1, 2016, JEL窶冱 warranty period was changed from 1 year to 2 years from JEL ex-work date. By extending the warranty period, we will provide the more satisfactory after-sales support service. We guarantee against any defects incurred by our responsibility during the warranty period. Such defective products under the warranty will be repaired or replaced for free. Applicable Products All JEL products that we order from June 1, 2016 (*) *Please refer to the Mechanical/Control Specifications for the details of the warranty coverage. Please contact our sales or service representatives for any inquiries on the warranties or the applicable products.  Technical Information Change of JEL窶冱 Warranty Period
../products/GCR4280_300mm.html	und	1710468949	22736	https://www.jel-robot.com/products/GCR4280_300mm.html	Products | GCR4280 (For 300mm wafer) | Wafer Transfer Atmospheric Robot	Products | GCR4280 (For 300mm wafer) | Wafer Transfer Atmospheric Robot Home 縲� Products 縲� 縲� Robot for Semiconductor GCR4280 (For 300mm wafer) 4-Axis Horizontal and Multi-Joint Type Clean Robot Product Video Usage Environment/Specifications Product Profile Model Name GCR4280 Environment Clean room atmosphere Arm Single arm Operating Range 553mm (3rd joint center) Vertical Stroke 300mm Payload Capacity Below 4kg (calculated for the arm 3rd joint) List of Product Model Product Model Vertical Stroke GCR4280-300-AM 300mm The image above and the video are of GCR4210-300-AM. Characteristics Designed for handling 300mm wafers in a production line or inspection line of semiconductor. Execution of origin search is not required by using the servo motors with absolute encoders. 3 FOUP access is available without a track. Base or flange mounting type is selectable. Motion monitoring is available. AC servo motors with absolute encoders installed in all axes. High-speed, high-accuracy wafer handling by S-curved speed control and optimizing pass control. Wafer holding: end-effector with vacuum suction, passive edge, or edge grip. End-effector material: CFRP, Al, ceramic, or others. Optimal end-effector is selectable according to the carrying object and line layout. Standard Specifications Example of standard specifications with JEL standard end-effector (vacuum type) Specifications of Robot Robot Model GCR4280-300-AM Carrying Object SEMI standard up to 300mm silicon wafer Wafer Holding Method By vacuum suction Robot Model Type Horizontal and multi-joint type Control Axis 4-axis Motor Type AC servo motor Operating Range From the robot center to the wafer center Rotation Angle (Theta-axis) Vertical Stroke (Z-axis) 953mm 335deg 300mm Carrying Speed Arm (R-axis) Rotation Angle (Theta-axis) Vertical Stroke (Z-axis) 833mm/1.3sec 335deg/1.2sec 300mm/1.0sec Repeatability Within ±0.1mm Cleanliness ISO Class 2 (at wafer transfer level when exhausting driving part) Utility Power: AC200V single phase ±10% 2kVA; Vacuum: -53kPa or more Specifications of Controller Controller Model C5000S series Interface RS232C and parallel photo I/O Outline Drawing (Standard) Option Wrist-Block Unit Model Name Total Length Mapping Sensor Thickness of Attaching End-Effector SARS00169 38mm None 2mm SARS00958 38mm None 3mm SARS02659 75mm None 2mm SARS02967 75mm None 3mm SARS08603 80mm Transmissive sensor/Reflective sensor 2mm *The table above shows the specifications of JEL standard wrist-block units. The other specifications are available. *Click the items below to review the wrist-block units other than JEL standard types. End-Effector Model Name Size of Carrying Object End-effector Type (Thickness) Wafer Holding Method SC-IW-200 3 inch, 100mm to 200mm I-shape (2mm) Vacuum suction SC-IW-240 3 inch, 100mm to 300mm I-shape (2mm) Vacuum suction SC-YW-200 100mm to 200mm Y-shape (2mm) Vacuum suction SC-YW-227 100mm to 300mm Y-shape (2mm) Vacuum suction SC-YW-240 100mm to 300mm Y-shape (2mm) Vacuum suction 3D-02229 150mm�300mm Y-shape (2mm) Vacuum suction SC3-YW-240 300mm Y-shape (3mm) Vacuum suction 3D-01661 300mm Y-shape (3mm) Vacuum suction SC3-IW-240 300mm I-shape (3mm) Vacuum suction *The table above shows the specifications of JEL standard end-effectors. The other specifications are available. *Click the items below to review the end-effectors other than JEL standard types. Operating Range End-Effector/Wrist-Block Unit SARS00169 SARS02659 SARS08603 SARS00958 SARS02967 SC-IW-200 562.7mm 625mm 630mm - - SC-IW-240 602.7mm 665mm 670mm - - SC-YW-200 572.7mm 635mm 640mm - - SC-YW-227 599.7mm 662mm 667mm - - SC-YW-240 612.7mm 675mm 680mm - - 3D-02229 612.7mm 675mm 680mm - - SC3-YW-240 - - - 612.7mm 675mm 3D-01661 - - - 612.7mm 675mm SC3-IW-240 - - - 602.7mm 665mm *The operating range in the table that is specified by the combination of the wrist-block unit and end-effector is an example only. The other combinations are available. Other Option Product Lineup Menu Prev Next Icon guide ...Atmosphere ...Vacuum ...Waterproof ...Single arm ...Twin arm ...Thin wafer ...CE marking ...JEL's standard spec. ...KCs marking GCR4210-300-AM GCR4280-300-AM
../products/handling_10.html	und	1710468950	6630	https://www.jel-robot.com/products/handling_10.html	Products | Introduction Video of Handling (Through-beam mapping operation)	Products | Introduction Video of Handling (Through-beam mapping operation) Home  >  Products  >  Introduction Video of Handling  >  Mapping operation (Through-beam mapping) Introduction Video of Handling Mapping operation (Through-beam mapping) Featured mapping operation (through-beam mapping) of some of JEL's transfer robot. Available for various types of wafers and wafer sizes. *Mapping operation is a function that detects the wafer placement in each slot in cassette. To remove useless processing and shorten tact time by detecting empty wafer. To prevent the wafer breakage by detecting a cross-slotted wafer or double wafer in cassette. Robots featured in the video: Handling 150mm thin silicon wafer or spacer( Automatic wafer transfer system for wafer container ) Handling 3 inch LED wafer( SSY-10000: Table-top loader system) Handling 100-200mm tape frame( MTCR4160: Tape frame handling) Handling 300mm silicon wafer( SORTER SYSTEM with 4-port inline type ) Video List Previous Video Next Video YouTube Official Channel
../news/event2021_04.html	und	1710468652	8645	https://www.jel-robot.com/news/event2021_04.html	News | SEMICON TAIWAN 2021	News | SEMICON TAIWAN 2021 Home  >  News  >  Event News  >  SEMICON TAIWAN 2021 SEMICON TAIWAN 2021 Thank you very much for coming to our exhibition booth. For more information on our products as well as the exhibited products below, please go to the product page or contact us . Date   December 28 to 30, 2021 Venue Taipei Nangang Exhibition Center, Taiwan Booth J2440 - 1st Floor JEL booth in SEMICON TAIWAN 2021 Products for Exhibition ■GTFR for 300 mm wafers ■Low head SAL-HV for 300 mm wafers ■KHR for 25 wafers batch transfer (300 mm wafers) ■STCR for 150 or 200 mm chemical compound wafer ■SAL for 150 or 200 mm chemical compound wafer ■MTCR for tape frame for 300 mm wafers Event Listings News Top SEMICON TAIWAN 2021 banner Our booth at SEMICON TAIWAN 2021
../products/SVAL3001_a.html	und	1710468974	11471	https://www.jel-robot.com/products/SVAL3001_a.html	Products | SVAL3001 (Vacuum Aligner)	Products | SVAL3001 (Vacuum Aligner) Home 〉 Products 〉 〉 Aligner SVAL3001 (Vacuum Aligner) Wafer Aligner Product Video Usage Environment/Specifications Product Profile Product Model SVAL3001 Environment Vacuum area (Temp. 15°C to 50°C) Wafer Size 100 to 300mm, others Carrying Object silicon wafer, susceptor The image above and the video are of SVAL3001. Characteristics Edge-grip vacuum aligner for susceptor tray (compound semiconductors and Si wafers). High-speed and high-accuracy alignment is available. Payload capacity: Below 4kg Stand-alone aligner using vacuum resistance sensor (Set the controller in the atmospheric environment.) Vacuum sealing: Magnetic fluid sealing and bellows are used. Motion monitoring is available. RS232C and parallel photo I/O are standard for control. Index function: Rotate according to the wafer position in the tray. Standard Specifications Carrying Object SEMI standard 100 to 300mm silicon wafer, various types of susceptors Positioning Accuracy Centering: Within ±0.3 mm Notch locating: Within ±0.3 deg Positioning Time Notch search : Within 4 sec Sensor Vacuum resistance definite-reflective sensor Vacuum sealing Magnetic fluid sealing Welded metal bellows (stroke: 40 mm) Driving method 2-phase stepping motor (for 3 axes) Separate controller Vacuum resistance 1.33×10 -6 Pa Utility Power: DC24V±10% 8A Outline Drawing Product Lineup Menu Prev Next Icon guide ...Atmosphere ...Vacuum ...Waterproof ...Thin wafer ...CE marking ...JEL's standard spec. ...KCs marking SVAL3001 SVAL3001
../products/STVCR4190_AM.html	und	1710468973	15010	https://www.jel-robot.com/products/STVCR4190_AM.html	Products | STVCR4190 (Servo motor with absolute encoder) | Wafer Transfer Atmospheric Robot	Products | STVCR4190 (Servo motor with absolute encoder) | Wafer Transfer Atmospheric Robot Home 縲� Products 縲� 縲� Robot for Semiconductor STVCR4190 (Servo motor with absolute encoder) 4-Axis Cylindrical Coordinate Clean Robot Usage Environment/Specifications Product Profile Model Name STVCR4190 Environment Vacuum (Temp. 15°C to 50°C) Driving unit咾lean room atmosphere  (Temp. 15°C to 40°C) Arm Twin arm Operating Range 380mm (3rd joint center) Vertical Stroke 50mm Payload Capacity 3kg (calculated for the arm 3rd joint) List of Product Model Product Model Vertical Stroke STVCR4190-050-AM 50mm The image above is of STVCR4190-050-SM. Characteristics Designed for handling wafers in the vacuum chamber of production line and inspection line. Double payload and superior cost performance compared to STVHR series. Compatible with STVHR series and it is possible to replace or upgrade into STVCR series. Execution of origin search is not required by using the servo motors with absolute encoders. Magnetic fluid sealing is used for arm joint. Vacuum sealing: Magnetic fluid sealing and bellows are used. For cleanliness: 5µm mesh filter installed for exhaust ventilation in the arm. Twin-arm reduces the wafer swap time. Motion monitoring is available. RS232C and parallel photo I/O are standard for control. AC servo motors with absolute encoders installed in all axes. High-speed, high-accuracy wafer handlingby S-curved speed control. AC servo motor or 2-phase pulse motor type is selectable. Wafer holding: end-effector with passive edge or edge grip type End-effector. End-effector material: CFRP, Al, ceramic, or others. Optimal end-effector is selectable according to the carrying object and line layout. Standard Specifications Representative specifications of STVCR4190-050-AM. It can be changed depending on the carrying object and end-effector type. Specifications of Robot Robot Model STVCR4190-050-AM Carrying Object Wafer up to 300mm Wafer Holding Method By end-effector with passive edge or edge grip type end-effector Robot Model Type Cylindrical coordinate type Control Axis 4-axis Motor Type AC servo motor Operating Range 3rd joint center Rotation Angle (Theta-axis) Vertical Stroke (Z-axis) 380mm 330deg 50mm Carrying Speed Arm (R-axis) Rotation Angle (Theta-axis) Vertical Stroke (Z-axis) 340mm/sec 120deg/sec 50mm/sec Repeatability Within ±0.1mm Cleanliness Magnetic fluid sealing and filter Vacuum resistance 1.33×10 -6 Pa Mass Approx.80kg Utility Power: AC200V Single phase ±10% 1kVA Option End-Effector *Click the items below to review the end-effectors other than JEL standard types. Other Option Product Lineup Menu Prev Next Icon guide ...Atmosphere ...Vacuum ...Waterproof ...Single arm ...Twin arm ...Thin wafer ...CE marking ...JEL's standard spec. ...KCs marking STVCR4190 (Servo motor with absolute encoder)
../products/MTCR4160.html	und	1710468957	18781	https://www.jel-robot.com/products/MTCR4160.html	Products | MTCR4160 | Wafer Transfer Atmospheric Robot	Products | MTCR4160 | Wafer Transfer Atmospheric Robot Home 縲� Products 縲� 縲� Robot for Semiconductor MTCR4160 4-Axis Cylindrical Coordinate Clean Robot Product Video Usage Environment/Specifications Product Profile Model Name MTCR4160 Environment Clean room atmosphere Arm Twin arm Operating Range 315mm (3rd joint center) Vertical Stroke 300mm / 400mm / 500mm Payload Capacity 4kg (calculated for the arm 3rd joint) List of Product Model Product Model Vertical Stroke Standard MTCR4160-300-AM 300mm   MTCR4160-400-AM 400mm   MTCR4160-400-AM 500mm The image above and the video are of MTCR4160-300-AM. Characteristics Designed for handling 300mm wafers in a production line or inspection line of semiconductor. High-speed handling by AC servo motor and superior cost performance compared to MTHR type. Certified CE marking. Execution of origin search is not required by using the servo motors with absolute encoders. Arm lineup: 160mm, 200mm Twin-arm reduces the wafer swap time. Base or flange mounting type is selectable. Motion monitoring is available. RS232C and parallel photo I/O are standard for control. AC servo motor installed in all axes. High-speed, high-accuracy wafer handlingby S-curved speed control. Wafer holding: end-effector with vacuum suction, passive edge, edge grip, or Bernoulli type End-effector. End-effector material: CFRP, Al, ceramic, or others. Optimal end-effector is selectable according to the carrying object and line layout. Standard Specifications Example of standard specifications with JEL standard end-effector (vacuum type) Specifications of Robot Robot Model MTCR4160-300-AM Carrying Object Wafer up to 300mm Wafer Holding Method By vacuum suction Robot Model Type Cylindrical coordinate type Control Axis 4-axis Motor Type AC servo motor Operating Range From the robot center to the wafer center Rotation Angle (Theta-axis) Vertical Stroke (Z-axis) 575mm 340deg 300mm Carrying Speed(Ave.) Arm (R-axis) Rotation Angle (Theta-axis) Vertical Stroke (Z-axis) 850mm/sec 340deg/sec 330mm/sec Carrying Speed (Max.) Arm (R-axis) Rotation Angle (Theta-axis) Vertical Stroke (Z-axis) 1800mm/sec 550deg/sec 500mm/sec Resolution Arm (R-axis) Rotation Angle (Theta-axis) Vertical Stroke (Z-axis) Below 9.82µm 0.0015deg 1.96µm Handling level 674.5mm (Base mounting level to end-effector level) Repeatability Within ±0.1mm Cleanliness ISO Class 2 (at wafer transfer level when exhausting driving part) Utility Power: AC200V single phase ±10% 3kVA; Vacuum: -53kPa or more Specifications of Controller Controller Model C5000S series Interface RS232C and parallel photo I/O Outline Drawing (Standard) Option End-Effector Model Name Size of Carrying Object End-effector Type (Thickness) Wafer Holding Method SC-IW-200 3 inch, 100mm to 200mm I-shape (2mm) Vacuum suction SC-IW-240 3 inch, 100mm to 300mm I-shape (2mm) Vacuum suction SC-YW-200 100mm to 200mm Y-shape (2mm) Vacuum suction SC-YW-227 100mm to 300mm Y-shape (2mm) Vacuum suction SC-YW-240 100mm to 300mm Y-shape (2mm) Vacuum suction 3D-02229 150mm�300mm Y-shape (2mm) Vacuum suction SC3-YW-240 300mm Y-shape (3mm) Vacuum suction 3D-01661 300mm Y-shape (3mm) Vacuum suction SC3-IW-240 300mm I-shape (3mm) Vacuum suction *The table above shows the specifications of JEL standard end-effectors. The other specifications are available. *Click the items below to review the end-effectors other than JEL standard types. Other Option Product Lineup Menu Prev Next Icon guide ...Atmosphere ...Vacuum ...Waterproof ...Single arm ...Twin arm ...Thin wafer ...CE marking ...JEL's standard spec. ...KCs marking MTCR4160-300-AM MTCR4160-300-AM
../news/topics2011.html	und	1710468668	6743	https://www.jel-robot.com/news/topics2011.html	News | Topics 2011	News | Topics 2011 Home  >  News  >  2011 News 2011 December 15, 2011 Company We have exhibited our new robots for the SEMICON Japan 2011 at our showroom in Fukuyama factory. We're looking forward to seeing you. December 13, 2011 Company We were interviewed about our challenge toward domestic production from NHK, a national broadcast station. August 8, 2011 Products We have opened online 3D CAD drawings for our robots. August 2, 2011 Company We announce that our agency in Taiwan has changed to Challentech. July 13, 2011 Company We have posted our challenge for saving electricity and energy. May 6, 2011 Company Our robot was broadcasted by NHK (broadcasted on May 4th). Topic Listings News Top Fukuyama Factory Showroom Support
../news/event2020_04.html	und	1710468650	11517	https://www.jel-robot.com/news/event2020_04.html	News | SEMICON JAPAN VIRTUAL	News | SEMICON JAPAN VIRTUAL Home  >  News  >  Event News  >  SEMICON JAPAN VIRTUAL SEMICON JAPAN VIRTUAL Thank you very much for coming to our virtual booth. For more information on our products as well as the exhibited products below, please go to the product page or contact us . Date   Virtual exhibition Date: DEC. 14, 2020 (MON) – DEC. 17, 2020 (THU) On-demand exhibition Date: DEC. 11, 2020 (FRI) – JAN. 15, 2021 (FRI) Products for Exhibition  JEL booth in SEMICON JAPAN VIRTUAL Products for Exhibition ■3-Axis Cylindrical Coordinate Clean Robot ( SCR3000CSN Series ) ■4-Axis Horizontal and Multi-Joint Type Clean Robot ( GCR4000 Series ) ■5-Axis Horizontal and Multi-Joint Type Clean Robot ( GTCR5000 Series ) ■3-Axis Cylindrical Coordinate Clean Robot ( SVCR3000 Series ) ■4-Axis Cylindrical Coordinate Clean Robot ( STVCR4000 Series ) ■4-Axis Cylindrical Coordinate Clean Robot ( STWCR4000 Series ) ■Bernoulli Hand ( BRP Series ) ■Wafer Aligner ( SAL38C3HV ) ■4-Axis Cylindrical Coordinate Clean Robot ( STCR4160SN “Closed-loop control” ) ■4-Axis Cylindrical Coordinate Clean Robot (MTCR4160N) ■Automatic wafer transfer system for wafer container ( SSY-20010 ) Event Listings News Top SEMICON JAPAN VIRTUAL logo JEL booth at the exhibition
../news/news20170418-1.html	und	1710468661	3547	https://www.jel-robot.com/news/news20170418-1.html	News | 2017 Japanese Holiday Week Information	News | 2017 Japanese Holiday Week Information Home  >  News  >  Japanese Holiday Week Information Japanese Holiday Week Information JEL will be closed for Japanese holiday week, "Golden Week" Holidays; April 29th to 30th (Japan Time), May 3rd to 7th (Japan Time) In case of emergency, please contact us at the following e-mail address: 
../news/event2021_02.html	und	1710468651	9551	https://www.jel-robot.com/news/event2021_02.html	News | SEMICON CHINA 2021	News | SEMICON CHINA 2021 Home  >  News  >  Event News  >  SEMICON CHINA 2021 SEMICON CHINA 2021 Thank you very much for coming to our exhibition booth at SEMICON CHINA 2021. For more information on our products as well as the exhibited products below, please go to the product page or contact us . Date   March 17 to 19, 2021 Venue Shanghai New International Expo Centre (SNIEC), Shanghai Booth N1 1563 ReJe booth in SEMICON CHINA 2021 Event Listings News Top SEMICON CHINA 2021 banner Our booth at SEMICON CHINA 2021
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../products/prd_result1.html	und	1710468959	11950	https://www.jel-robot.com/products/prd_result1.html	Products | Robot for Semiconductor	Products | Robot for Semiconductor HOME  >  Products  >  Robot for Semiconductor Robot for Semiconductor Search for Environment Atmosphere Vacuum Waterproof Show all Robot Model Type Cylindrical Coordinate Type Horizontal and Multi-Joint Type Show all Arm Single arm Twin arm Show all Motor Stepping Motor Stepping Motor (Closed-loop) Servo Motor Show all Data processing Click the product image or name to go to the product page. Product News 3D CAD Drawings Contact Us Technical Information Products Menu 
../news/event2020_02.html	und	1710468650	9651	https://www.jel-robot.com/news/event2020_02.html	News | SEMICON CHINA 2020	News | SEMICON CHINA 2020 Home  >  News  >  Event News  >  SEMICON CHINA 2020 SEMICON CHINA 2020 Thank you very much for coming to our exhibition booth at SEMICON CHINA 2020. For more information on our products as well as the exhibited products below, please go to the product page or contact us . Date   June 27 to 29, 2020 Venue Shanghai New International Expo Centre (SNIEC), Shanghai Booth Hall E1-E1263 ReJe booth in SEMICON CHINA 2020 Event Listings News Top SEMICON CHINA 2020 banner Our booth at SEMICON CHINA 2020
../products/event2021_04e.html	und	1710468947	27459	https://www.jel-robot.com/products/event2021_04e.html	Products | STCR4160S | Wafer Transfer Atmospheric Robot	Products | STCR4160S | Wafer Transfer Atmospheric Robot Home 縲� Products 縲� 縲� JEL dedicated website for SEMICON exhibition robots STCR4160S 4-Axis Cylindrical Coordinate Clean Robot Product Video Usage Environment/Specifications Product Profile Model Name STCR4160S Environment Clean room atmosphere Arm Twin arm Operating Range 315 mm (3rd joint center) Vertical Stroke 200mm / 300 mm / 400 mm / 450 mm / 500 mm / 550 mm / 600 mm Payload Capacity Below 3kg (calculated for the arm 3rd joint) List of Product Model Product Model Vertical Stroke STCR4160S-200-PM 200 mm STCR4160S-300-PM 300 mm STCR4160S-400-PM 400 mm STCR4160S-450-PM 450 mm STCR4160S-500-PM 500 mm STCR4160S-550-PM 550 mm STCR4160S-600-PM 600 mm The image above and the video are of STCR4160S-300-PM. Characteristics Designed for handling small wafers in a production line or inspection line of semiconductor. Certified CE marking. Arm lineup: 100 mm, 130 mm, 160 mm, 200 mm Twin-arm reduces the wafer swap time. Base or flange mounting type is selectable. Motion monitoring is available. RS232C and parallel photo I/O are standard for control. 2-phase stepping motor installed in all axes. High-speed, high-accuracy wafer handlingby S-curved speed control. Wafer holding: end-effector with vacuum suction, passive edge, edge grip type End-effector. End-effector material: CFRP, Al, ceramic, or others. Optimal end-effector is selectable according to the carrying object and line layout. Standard Specifications Example of standard specifications with JEL standard end-effector (vacuum type) Specifications of Robot Robot Model STCR4160S-300-PM Carrying Object Wafer up to 300 mm Wafer Holding Method By vacuum suction Robot Model Type Cylindrical coordinate type Control Axis 4-axis Motor Type Stepping motor Operating Range From the robot center to the wafer center Rotation Angle (Theta-axis) Vertical Stroke (Z-axis) 575 mm 340 deg 300 mm Carrying Speed (Ave.) Arm (R-axis) Rotation Angle (Theta-axis) Vertical Stroke (Z-axis) 570 mm/sec 220 deg/sec 200 mm/sec Carrying Speed (Max.) Arm (R-axis) Rotation Angle (Theta-axis) Vertical Stroke (Z-axis) 1140 mm/sec 270 deg/sec 250 mm/sec Resolution Arm (R-axis) Rotation Angle (Theta-axis) Vertical Stroke (Z-axis) Below 12.6 µm 0.0045 deg 6.25 µm Handling level 620 mm (Base mounting level to upper end-effector level) Repeatability Within ±0.1mm Cleanliness ISO Class 2 (at wafer transfer level when exhausting driving part) Utility Power: DC24V±10% 16A; Vacuum: -53kPa or more Mass Approx. 30kg Specifications of Controller Controller Model C4000 series Interface RS232C and parallel photo I/O Outline Drawing (Standard) *The outline drawing above does not have the mapping function. Outline Drawing (w/o mapping function) Outline Drawing (w/mapping function) Option Wrist-Block Unit Model Name Total Length Mapping Sensor Thickness of Attaching End-Effector SART08674 60mm   2mm SART08604 60mm   2mm SART08675 155mm   2mm SART08661 155mm Available 2mm SART08676 60mm   2mm SART08668 60mm Available 2mm *The table above shows the specifications of JEL standard wrist-block units. The other specifications are available. *Click the items below to review the wrist-block units other than JEL standard types. End-Effector Model Name Size of Carrying Object End-effector Type (Thickness) Wafer Holding Method SC-IW-200 3 inch, 100mm to 200mm I-shape (2mm) Vacuum suction SC-IW-240 3 inch, 100mm to 300 mm I-shape (2mm) Vacuum suction SC-YW-200 100mm to 200mm Y-shape (2mm) Vacuum suction SC-YW-227 100mm to 300 mm Y-shape (2mm) Vacuum suction SC-YW-240 100mm to 300 mm Y-shape (2mm) Vacuum suction 3D-02229 150mm to 300 mm Y-shape (2mm) Vacuum suction SC3-YW-240 300 mm Y-shape (3mm) Vacuum suction 3D-01661 300 mm Y-shape (3mm) Vacuum suction *The table above shows the specifications of JEL standard end-effectors. The other specifications are available. *Click the items below to review the end-effectors other than JEL standard types. Operating Range End-Effector/Wrist-Block Unit SART08674 SART08604 SART08675 SART08661 SART08676 SART08668 SC-IW-200 405mm 405mm 500mm 500mm 405mm 405mm SC-IW-240 445mm 445mm 540mm 540mm 445mm 445mm SC-YW-200 415mm 415mm 510mm 510mm 415mm 415mm SC-YW-227 442mm 442mm 537mm 537mm 442mm 442mm SC-YW-240 455mm 455mm 550mm 550mm 455mm 455mm 3D-02229 455mm 455mm 550mm 550mm 455mm 455mm SC3-YW-240 455mm 455mm 550mm 550mm 455mm 455mm 3D-01661 455mm 455mm 550mm 550mm 455mm 455mm *The operating range in the table that is specified by the combination of the wrist-block unit and end-effector is an example only. The other combinations are available. Other Option *The teaching box appeared in the table may be unavailable depending on the specifications. Product Lineup Menu Prev Next Icon guide ...Atmosphere ...Vacuum ...Waterproof ...Single arm ...Twin arm ...Thin wafer ...CE marking ...JEL's standard spec. ...KCs marking SEMICON JAPAN 2021 HYBRID title click here for GTFR details page click here for SAL-HV details page. click here for KHR details page. click here for STCR details page. click here for SAL details page. click here for MTCR details page. STCR4160S-300-PM STCR4160S-300-PM click here for GTFR details page click here for SAL-HV details page. click here for KHR details page. click here for STCR details page. click here for SAL details page. click here for MTCR details page. SEMICON JAPAN 2021 HYBRID title
../news/news20181204.html	und	1710468664	3722	https://www.jel-robot.com/news/news20181204.html	News | New Year's Holiday Information 2018	News | New Year's Holiday Information 2018 Home  >  News  >  New Year's Holiday Information New Year's Holiday Information JEL will be closed for New Year's holiday from December 29th, 2018 to January 6th, 2019 (Japan Time). In case of emergency, please contact us at the following e-mail address: 
../news/event2013_02.html	und	1710468637	5992	https://www.jel-robot.com/news/event2013_02.html	News | OPTO Taiwan 2013	News | OPTO Taiwan 2013 Home  >  News  >  Event News  >  OPTO Taiwan 2013 OPTO Taiwan 2013 Thank you very much for coming to our exhibition booth at OPTO Taiwan 2013 during June 18-20. For more information on our products as well as the exhibited products below, please go to the product page or contact us. Date: June 18-20, 2013 Venue: TWTC Nangang Exhibition Hall, Taiwan Products for Exhibition High speed handling MTCR : MTCR4160CS-300 High speed handling and cost performance are achieved by installing AC servo motors in all axes. Bernoulli type end-effector for thin or warped wafersanufactured by JEL� We have developed the low-cost Bernoulli type end-effector. As an ideal end-effector for thin and warped wafers, we provide the Bernoulli type end-effector at its most suitable design according to the customers窶� system layout. Compact clean robot & Aligner for handling 2, 3 inch, 100, 150mm wafers :SCR3100S-200-PM/SAL3261GR We present the robot for safety and high-accuracy handling of 2, 3inch, and 100, 150mm LED sapphire wafer, and the aligner for high-accuracy centering for wafer. We offer the compact system with flexibility. Event Listings News Top OPTO Taiwan 2013 OPTO Taiwan 2013 booth High speed handling MTCR Bernoulli type end-effector for thin or warped wafers Compact clean robot & Aligner for handling 2-3-inch, 100-150mm wafers:SCR3100S-200-PM/SAL3261GR
../news/event2011_03.html	und	1710468634	4626	https://www.jel-robot.com/news/event2011_03.html	News | TIROS(Taipei International Robot Show) Taipei 2011	News | TIROS(Taipei International Robot Show) Taipei 2011 Home  >  News  >  Event News  >  TIROS(Taipei International Robot Show) Taipei 2011 TIROS(Taipei International Robot Show) Taipei 2011 Thank you for coming TIROS Taipei 2011 . We exhibited our new products. For more product information, please go to the products page or contact us. Date: AUG.31,2011(WED) - SEP.3,2011(SAT) Venue: TWTC Nangang Exhibition Hall Products for Exhibition Robot & aligner for 2 to 4 inch wafers for LED : SSCR3115N-150-PM & SSCR2090S-PM & SAL3241GR This robot & aligner is especially designed for handling small wafers and has small footprint. There are armless type and link-arm type. Event Listings News Top Robot & aligner for 2 to 4 inch wafers for LED : SSCR3115N-150-PM & SSCR2090S-PM & SAL3241GR
../support/support01.html	und	1710469079	6412	https://www.jel-robot.com/support/support01.html	Online Support | JEL窶冱 Various Software	Online Support | JEL窶冱 Various Software Home  >  Online Support  >  JEL窶冱 Various Software JEL窶冱 Various Software The following are JEL's various software. The communication software, JELDATA3 can be downloaded from the link below. *Please note: the user registration and login are required. The alignment adjustment software, JEL ALIGN TOOL is attached with the aligners SAL3000HV series. *See the list below for the applicable models and supported OS. Software list Software common for all JEL products: Communication Software JELDATA3 Supported OS Windows XP (32 bit) Windows 7 (32/64 bit) Windows 8.1 (64 bit) Windows 10 (32/64 bit) Windows Embedded (32/64 bit)  Click here for download (*Login is required.  If you are a new user, click here for user registration .) Dedicated software for Aligner: Alignment Adjustment Software JEL ALIGN TOOL Applicable model: SAL3000HV Series SAL3262HV (For 2 inch to 150 mm wafer) SAL3482HV (For 100 mm to 200 mm wafer) SAL38C3HV (For 200 mm to 300 mm wafer) Supported OS Windows 7 (32/64 bit) Windows 8.1 (64 bit) Windows 10 (32/64 bit) Windows Embedded (32 bit)  Click to see the details 
../products/3D-02229_end.html	und	1710468943	10425	https://www.jel-robot.com/products/3D-02229_end.html	Products | 3D-02229 (Vacuum Type End-Effector)	Products | 3D-02229 (Vacuum Type End-Effector) Home  >  Products  >  縲� Others 3D-02229 Vacuum Type End-Effector Usage Environment/Specifications Product Profile Model Name 3D-02229 Carrying Size 150 to 300mm Carrying Object Mainly silicon wafer Characteristics Y-shaped vacuum suction type end-effector, suitable for handling wafer from 150 to 300mm (Random access is available). Used extensively for atmospheric robot, the end-effector holds the backside of wafer by vacuum suction (negative pressure). Conductive Teflon coating on the surface of end-effector protects against damage from charging. Standard Specifications Carrying Object SEMI standard 150 to 300mm (Mainly silicon wafer) Material High purity alumina ceramic sintered body Surface Treatment Conductive Teflon coating Wafer Holding Method Vacuum suction Total Length 242mm Thickness 2mm Please contact us for the detailed specifications. Outline Drawing (Standard) Product Lineup Menu Prev Next Icon guide ...Atmosphere ...Vacuum ...Waterproof ...Single arm ...Twin arm ...Thin wafer ...CE marking ...JEL's standard spec. ...KCs marking 3D-02229 3D-02229
../news/event2016_08_1.html	und	1710468644	4853	https://www.jel-robot.com/news/event2016_08_1.html	News | SEMICON JAPAN 2016: Access	News | SEMICON JAPAN 2016: Access Home  >  News  >  Event News  >  SEMICON JAPAN 2016 縲� Access of SEMICON JAPAN 2016 Access of SEMICON JAPAN 2016 Event Listings News Top Map of Tokyo Big Sight/JEL booth
../support/man002/m005-4.html	und	1710469129	8333	https://www.jel-robot.com/support/man002/m005-4.html	Online Support | Standard Data Copy Manual | Data Copy	Online Support | Standard Data Copy Manual | Data Copy Home  >  Online Support  >  Wafer-Search Operation Procedure and Troubleshooting  >  Standard Data Copy Manual 縲� 4. Sending data in PC to another controller and storing (data copy) Standard Data Copy Manual Data Copy Manual 4. Sending data in PC to another controller and storing (data copy) Example: Send 窶廛 Data窶� that is saved in the PC as the file name 窶徭peed.ddt窶� to the controller and store it. (1) Select [File] -- [Open] to open the 窶廛 Data窶� file. (2) The [Open File] dialog box appears. Select the file location and [speed.ddt] file. (3) Click the [Open] button to open the file. * When communication is not available or error messages appear from the controller, please refer to the " Error Messages ". (4) Click the [D Data] tab in the main window to display the data. Use the scroll bar or the arrow key to check the data. (5) Click [Transceive] on the menu to send the data. (6) Check the controller body number on the [Transceive] dialog box. (7) Select 窶廛 Data窶� from [Select Data Type]. (8) Click the [Send] button to send the data. (9) Click the [Yes] button on the Confirmation dialog box to start sending the data. (10) While sending the data, the progress is shown on the status bar. (11) When the data sending is completed, click the [OK] button on the message. * After sending the data, JELDATA3 Ver.1.3.1 automatically starts comparing the data to check if the send data has any mistakes. * When communication is not available or error messages appear from the controller, please refer to the " Error Messages ". (12) Click the [Compare] button to compare the data in the PC with the one in the controller and check if the data has been sent correctly. (Make sure that 窶廛 Data窶� is selected for the [Select Data Type].) (13) Click the [Yes] button on the confirmation dialog box to start comparing. (14) While data is being compared, the progress is shown on the status bar. * When communication is not available or error messages appear from the controller, please refer to the " Error Messages ". (15) When data comparison is completed, the message [Data Compare Completed.] appears. Click the [OK] button after checking that the number of NG on the dialog box is 0 (all data matched). (16) Click the [Overwrite] button to store data. (Make sure that 窶廛 Data窶� is selected on the [Select Data Type].) ! Caution: Once [Overwrite] is executed, the previous data will be gone. (17) Click the [Yes] button on the confirmation dialog box to start overwriting. (18) While overwriting the data, the progress is shown on the status bar. (19) When overwriting is completed, click the [OK] on the message [Data Overwrite Completed]. * When communication is not available or error messages appear from the controller, please refer to the " Error Messages ". Contents 竊殖ack Next竊�  Technical Information open the file select the file open the file D data tab transceive tab check the body no. select data type send button confirmation window to send data status bar message when the data sending is completed compare button confirmation dialog box status bar when data is being compared message when data compare is completed overwrite button confirmation dialog box status bar whhen data is being overwritten confirmation dialog box
../news/event2019_02.html	und	1710468648	9921	https://www.jel-robot.com/news/event2019_02.html	News | SEMICON CHINA 2019	News | SEMICON CHINA 2019 Home  >  News  >  Event News  >  SEMICON CHINA 2019 SEMICON CHINA 2019 Thank you very much for coming to our exhibition booth at SEMICON CHINA 2019. For more information on our products as well as the exhibited products below, please go to the product page or contact us . Date   March 20 to 22, 2019 Venue Shanghai New International Expo Centre (SNIEC), Shanghai Booth Hall N1 No. 1655 LINK  Click here to see the official site  Products for Exhibition ReJe booth in SEMICON CHINA 2019 Products for Exhibition Automatic wafer transfer system for wafer container "SSY" Automatic wafer transfer between a wafer container and a wafer cassette (package/unpackage) Automatic opening/closing of the lid of a wafer container made by Achilles Corporation The movable wafer container stage simplifies the lid opening/closing mechanism and reduces the contamination generation. Automatic distinction between a wafer and a spacer (interlayer paper) in a wafer container New Wafer Transfer Robot "MTCR" (Reference Exhibit) Low vibration with the miniaturization of semiconductor devices. Two variations of the arms with the payload capacity of 3 kg and 5 kg allow more customization. Warped Wafer Aligner with Auto-Adjustment Software "SAL3000HV" (Reference Exhibit) Auto-adjustment software JEL ALIGN TOOL allows optimized alignment for various types of wafers. Suitable for large warped wafers. Event Listings News Top SEMICON CHINA 2019 banner Our booth at SEMICON CHINA 2019 New Wafer Transfer Robot "MTCR" (Reference Exhibit) New Wafer Transfer Robot "MTCR" (Reference Exhibit) Warped Wafer Aligner with Auto-Adjustment Software "SAL3000HV" (Reference Exhibit)
../products/event2021_04f.html	und	1710468947	12970	https://www.jel-robot.com/products/event2021_04f.html	Products | SAL2681 (Edge-grip type)	Products | SAL2681 (Edge-grip type) Home 〉 Products 〉 〉 JEL dedicated website for SEMICON exhibition robots SAL2681 (Edge-grip type) Wafer Aligner Product Video Usage Environment/Specifications Product Profile Product Model SAL2681 Environment Clean room atmosphere Wafer Size 150 mm, 200 mm Carrying Object Silicon wafer The image above and the video are of SAL2681. Characteristics Designed for aligning wafers in a production line or inspection line of semiconductor. Minimized footprint and designed for aligning small wafer. High-speed, high-accuracy centering and flat/notch locating of small wafer. Standard Specifications Carrying Object SEMI standard 150 mm silicon wafer (Flat), SEMI standard 200 mm silicon wafer (Notch) Positioning Accuracy Centering: Within ±0.2 mm Notch locating: Within ±0.2 deg Positioning Time Notch search : 15 sec (Wafer pick-up/placing time excluded) Sensor Red LED transmissive sensor Wafer Holding Method By edge grip Cleanliness 0.1 µm/cf Class 1 (at wafer transfer level when exhausting driving part) Driving method Small size stepping motors at each axis (internal motor driver) Product Lineup Menu Prev Next Icon guide ...Atmosphere ...Vacuum ...Waterproof ...Thin wafer ...CE marking ...JEL's standard spec. ...KCs marking SEMICON JAPAN 2021 HYBRID title click here for GTFR details page click here for SAL-HV details page. click here for KHR details page. click here for STCR details page. click here for SAL details page. click here for MTCR details page. SAL2681 click here for GTFR details page click here for SAL-HV details page. click here for KHR details page. click here for STCR details page. click here for SAL details page. click here for MTCR details page. SEMICON JAPAN 2021 HYBRID title
../support/often-9.html	und	1710469078	4410	https://www.jel-robot.com/support/often-9.html	Online Support | Frequently Asked Question: The controller does not display anything after the power-on. Why?	Online Support | Frequently Asked Question: The controller does not display anything after the power-on. Why? Home  >  Online Support  >  Frequently Asked Question  >  Error codes or operations Error codes or operations Q: The controller does not display anything after the power-on. Why? A: Ensure that the power supply is as specified in the specification. When the EMG terminal is open, the power will not be turned on. Please check the interlock function and the power up procedure in the specifications.  Click to see JELDATA3 Operation Manual .  List of FQA  Contact Us 
../news/event2019.html	und	1710468647	6768	https://www.jel-robot.com/news/event2019.html	News | Event News 2019	News | Event News 2019 Home  >  News  >  Event News  >  2019 Event News 2019 SEMICON JAPAN 2019 Date: December 11 to 13, 2019 Major exhibits Automatic 300mm Wafer Transfer System for Wafer Container Warped Wafer Aligner with Auto warp measurement  Click here for details.   SEMICON TAIWAN 2019 Date: September 18 to 20, 2019 Major exhibits Automatic wafer transfer system for wafer container "SSY" New Wafer Transfer Robot "MTCR" (Reference Exhibit) Warped Wafer Aligner with Auto-Adjustment Software "SAL3000HV" (Reference Exhibit)  Click here for details.   SEMICON WEST 2019 Date: July 9 to 11, 2019 Exhibition robot model: Wafer Transfer Robot "STCR" Optical Aligner "SAL"  Click here for details.   SEMICON CHINA 2019 Date: March 20 to 22, 2019 Major exhibits Automatic wafer transfer system for wafer container "SSY" New Wafer Transfer Robot "MTCR" (Reference Exhibit) Warped Wafer Aligner with Auto-Adjustment Software "SAL3000HV" (Reference Exhibit)  Click here for details.   SEMICON KOREA 2019 Date: January 23 to 25, 2019 Major exhibits New Wafer Transfer Robot "MTCR" (Reference Exhibit) Warped Wafer Aligner with Auto-Adjustment Software "SAL3000HV" (Reference Exhibit)  Click here for details.   Event Listings News Top 
../products/GTFR5280.html	und	1724391333	17681	https://www.jel-robot.com/products/GTFR5280.html	Products | GTFR5280 (For 300 mm wafer) | Wafer Transfer Atmospheric Robot	Products | GTFR5280 (For 300 mm wafer) | Wafer Transfer Atmospheric Robot Home 〉 Products 〉 〉 Robot for Semiconductor GTFR5280 (For 300 mm wafer) 5-Axis Horizontal and Multi-Joint Type Clean Robot Product Video Usage Environment/Specifications <img src="/products/img/e_marc.jpg?v=20240823" alt="Usage Environment/Specifications" " loading="lazy" style="width:100%;height:auto;" /> Product Profile Model Name GTFR5280 Environment Clean room atmosphere Arm Single arm Operating Range 553 mm (3rd joint center) Vertical Stroke 320 mm Payload Capacity Below 4kg (calculated for the arm 3rd joint) List of Product Model Product Model Vertical Stroke Standard GTFR5280-320-DM 320 mm The image above and the video are of GTFR5280-320-DM. Characteristics 5-Axis horizontal and multi-joint type clean robot for 300 mm wafer. A twin end-effector mounted on its single-arm has the same function as a twin-arm robot. Designed for handling wafers in EFEM. Compared to our conventional GTCR model, the cycle time is improved by reducing the operation prohibited area and the influence of speed limit. 3 FOUP access is available without a track. Twin end-effector reduces the wafer swap time. AC servo motors with absolute encoders installed in all axes. (Batteryless) Wafer holding: end-effector with vacuum suction, passive edge, edge grip. Optimal end-effector is selectable according to the carrying object and line layout. Standard Specifications Example of standard specifications with JEL standard end-effector (vacuum type) Specifications of Robot Robot Model GTFR5280-320-DM Carrying Object Up to 300 mm silicon wafer Wafer Holding Method By vacuum suction Robot Model Type Horizontal and multi-joint type Control Axis 5-axis Motor Type AC servo motor (Batteryless) Operating Range From the robot center to the wafer center Vertical Stroke (Z-axis)   893 mm 320 mm   Carrying Speed (Ave.) Arm (R-axis) Vertical Stroke (Z-axis)   900 mm/sec(when cylindrical operation) 320 mm/sec   Carrying Speed (Max.) Arm (R-axis) Vertical Stroke (Z-axis)   1,500 mm/sec(when cylindrical operation) 540 mm/sec   Repeatability Within ±0.05 mm Cleanliness ISO Class 1 Utility Power: AC200V Single phase ±10% 2 kVA; Vacuum: -75 kPa or more Mass Approx. 80 kg Outline Drawing (Standard) Option Other Option Product Lineup Menu Prev Next Icon guide ...Atmosphere ...Vacuum ...Waterproof ...Single end-effector ...Twin end-effector ...Thin wafer ...CE marking ...JEL's standard spec. ...KCs marking GTFR5280-320-DM Usage Environment/Specifications GTFR5280-320-DM
../company/download2.html	ja	1736401907	7386	https://www.jel-robot.com/company/download2.html	JEL	JEL ▶  Japanese ▶  English ▶  Chinese Webカタログ＆Webサイト ジェーイーエルの会社案内、製品カタログ、ウェブサイトをオンライン上でご覧頂けます。 JEL E-Catalog & Website Click the button to view the company profile, product catalog, and website. JEL电子目录和网站 您可以网站查看JEL的公司简介、产品目录和网站。 ▶  Japanese ▶  English ▶  Chinese JEL J_Company Profile 2023 J_Product Catalog 2023 JEL Website JEL Website E_Company Profile 2023 E_Product Catalog 2023 JEL Website JEL Website C_Company Profile 2024 C_Product Catalog 2024 JEL Website JEL Website
../news/event2009.html	und	1710468631	4416	https://www.jel-robot.com/news/event2009.html	News | Event News 2009	News | Event News 2009 Home  >  News  >  Event News  >  2009 Event News 2009 Semicon Japan 2009 Dates: DEC.2(Wed) - 4(Fri),2009 Main exhibition machine type MTCR4160-300-AM SCR3100S-200-PM & SAL2241 SAL38C2 GCR4280-420-AM Click here for details.   Semicon Korea 2009 Dates: JAN.20(Tue) - 22(Thu),2009 Main exhibition machine type Single-Arm Clean Robot for 2-4inch wafer : New model JEL challenge for 450mm / Single-Arm, 4-Axis Horizontal and Multi-Joint Type Clean Robot : New model Click here for details.   Event Listings News Top 
../news/news20121213.html	und	1710468656	4130	https://www.jel-robot.com/news/news20121213.html	News | New Year's holiday Information	News | New Year's holiday Information Home  >  News  >  New Year's holiday Information New Year's holiday Information JEL will be closed for New Year's holiday from December 29th,2012 to January 6th, 2013 (Japan Time). In case of emergency, please contact us at the following e-mail address: News Topics 2014 2013 2012 2011 Event News 2014 2013 2012 2011 2010 2009 2008 
../news/event2011.html	und	1710468633	6155	https://www.jel-robot.com/news/event2011.html	News | Event News 2011	News | Event News 2011 Home  >  News  >  Event News  >  2011 Event News 2011 Semicon Japan 2011 Date: DEC. 7 (Wed) 窶織EC. 9 (Fri) Click here for details.   PV Taiwan 2011 Date:OCT.5,2011(Wed) - OCT.7,2011(Fri) Main exhibition machine type Robot & aligner for 2 to 4 inch wafers for LED : SSCR3115N-150-PMSCR2090S-PMAL3241GR Click here for details.   SEMICON Taiwan 2011 Date:SEP.7,2011(Wed) - SEP.9,2011(Fri) Main exhibition machine type Robot & aligner for 2 to 4 inch wafers for LED : SSCR3115N-150-PMSCR2090S-PMAL3241GR 4-Axis Cylindrical Coordinate Type Twin-arm Clean Robot : MTCR4160-300-AM Click here for details.   TIROS(Taipei International Robot Show) Taipei 2011 Date:AUG.31,2011(Wed) - SEP.3,2011(Sat) Main exhibition machine type Robot & aligner for 2 to 4 inch wafers for LED : SSCR3115N-150-PMSCR2090S-PMAL3241GR Click here for details.   OPTO Taiwan 2011 Date:JUN.14,2011(Tue) - JUN.16,2011(Thu) Main exhibition machine type Robot & aligner for 2 to 4 inch wafers for LED : SSCR3115N-150-PMSCR2090S-PMAL3241GR Click here for details.   3rd LED/OLED Lighting Technology Expo Date:JAN.19,2011(Wed) - JAN.21,2011(Fri) Main exhibition machine type SORTER SYSTEM (150mm) Vacuum robot & aligner for handling susceptor for LED wafer : SVCR3330S-060-PMVAL30D1 Robot & aligner for 2 to 4 inch wafers for LED : SSCR3115N-150-PMSCR2090S-PMAL3241GR Click here for details.   Event Listings News Top 
../news/news20180528.html	und	1710468663	4358	https://www.jel-robot.com/news/news20180528.html	News | Beware of the products mistaken as JEL products	News | Beware of the products mistaken as JEL products Home  >  News  >  Beware of the products mistaken as JEL products Beware of the products mistaken as JEL products Thank you very much for using JEL products. Recently, we confirmed that other companies' products that are substantially identical in shape and function to our products are sold in Taiwan. Some customers who purchased these products from other manufacturers have mistaken the products as our products or the products we guarantee, and asked us for repair or maintenance for those products. We will pursue legal liability of third parties who have violated our intellectual property rights. Please understand that we cannot assume any responsibility if the customer is using other company's products and a problem occurs in production facilities. If there is some concern, such as whether the product already purchased is our product or whether it is subject to our quality assurance, repair, or maintenance service, please contact our distributors or us to avoid the risk that the customer would violate any laws or regulations. We appreciate your understanding and cooperation. JEL Corporation 
../products/handling_13.html	und	1710468951	6410	https://www.jel-robot.com/products/handling_13.html	Products | Introduction Video of Handling (System for handling 2 inch wafer)	Products | Introduction Video of Handling (System for handling 2 inch wafer) Home  >  Products  >  Introduction Video of Handling  >  System for handling 2 inch wafer Introduction Video of Handling System for handling 2 inch wafer Smallest robot/aligner in the industry for downsizing of system. Help to minimize transferring parts or vacuum transfer chamber. TSCR3060N (Atmosphere robot for 2 inch wafer) Compared to JEL’s standard atmosphere robot: Minimized footprint by 75% (□115x130mm), volume ratio by 80% TSVCR3060N (Vacuum robot for 2 inch wafer) Compared to JEL’s standard vacuum robot: Minimized footprint by 65% (φ95mm), volume ratio of driving unit by 75% SAL1021 (Atmosphere aligner for 2 inch wafer) Compared to JEL’s standard atmosphere aligner: Minimized footprint by 80% (□85x100mm), volume ratio by 80% Video List Previous Video Next Video YouTube Official Channel
../products/STCR4160SN_thin.html	und	1710468972	15582	https://www.jel-robot.com/products/STCR4160SN_thin.html	Products | STCR4160SN (For thin wafer or wafer-edge hold)	Products | STCR4160SN (For thin wafer or wafer-edge hold) Home 縲� Products 縲� 縲� Robot for Semiconductor STCR4160SN (For thin wafer or wafer-edge hold) 4-Axis Cylindrical Coordinate Clean Robot Product Video Usage Environment/Specifications Product Profile Model Name STCR4160SN Environment Clean room atmosphere Arm Twin arm Operating Range 475mm (3rd joint center) Vertical Stroke 200mm / 300mm / 400mm / 450mm / 500mm Payload Capacity 3kg (calculated for the arm 3rd joint) List of Product Model Product Model Vertical Stroke STCR4160SN-200-PM 200mm STCR4160SN-300-PM 300mm STCR4160SN-400-PM 400mm STCR4160SN-450-PM 450mm STCR4160SN-500-PM 500mm The image above and the video are of STCR4160SN-300-PM. Characteristics For handling thin wafer or wafer-edge hold with low-cost, high-speed handling, and no step-out error High reliability: Stepping motor installed, but no step-out by JEL unique control. High rigidity: payload capacity of 3kg (calculated for the arm 3rd joint/including wrist-block, end-effector and wafer) Base or flange mounting type is selectable. Standard Specifications Specifications: upper end-effector with JEL end-effector by vacuum suction (wafer edge); lower end-effector with JEL Bernoulli End-effector for thin wafer Specifications of Robot Robot Model STCR4160SN-300-PM Wrist-Brock SART09362 End-Effector Upper end-effector: 3D-09371 Lower end-effector: 3D-09370 Carrying Object Up to 300mm silicon wafer Wafer Holding Method Upper end-effector: By vacuum suction (wafer edge) Lower end-effector: By Cyclone pad suction and friction generated by friction rubber (Various materials are available for contact parts.) Robot Model Type Cylindrical coordinate type Control Axis 4-axis Motor Type 2-phase pulse motors installed in all axes. Operating Range From the robot center to the wafer center Rotation Angle (Theta-axis) Vertical Stroke (Z-axis) 625mm 340deg 300mm Carrying Speed (Ave.) Arm (R-axis) Rotation Angle (Theta-axis) Vertical Stroke (Z-axis) 400mm/sec 180deg/sec 200mm/sec Carrying Speed (Max.) Arm (R-axis) Rotation Angle (Theta-axis) Vertical Stroke (Z-axis) 800mm/sec 220deg/sec 250mm/sec Repeatability Within ±0.1mm Cleanliness ISO Class 2 (at wafer transfer level when exhausting driving part) Utility Power: DC24V±10% 16A   Clean air: 60 SLM or more, 0.1 to 0.3 MPa  Vacuum: -53kPa or more Mass Approx. 30kg (Robot) Specifications of Controller Controller Model C4000 series Interface RS232C and parallel photo I/O Outline Drawing (Standard) Option Other Option Product Lineup Menu Prev Next Icon guide ...Atmosphere ...Vacuum ...Waterproof ...Single arm ...Twin arm ...Thin wafer ...CE marking ...JEL's standard spec. ...KCs marking STCR4160SN (For thin wafer or wafer-edge hold) STCR4160SN (For thin wafer or wafer-edge hold)
../products/event2021_04d.html	und	1710468946	16308	https://www.jel-robot.com/products/event2021_04d.html	Products | KHR3480 (for 25 wafers batch transfer, 300 mm wafers)	Products | KHR3480 (for 25 wafers batch transfer, 300 mm wafers) Home 〉 Products 〉 〉 JEL dedicated website for SEMICON exhibition robots KHR3480 (for 25 wafers batch transfer, 300 mm wafers)   Product Video Usage Environment/Specifications Product Profile Product Model KHR3480 Environment Clean room atmosphere Stroke 480 mm Vertical Stroke 290 mm Carrying Object 25 pieces of 300 mm silicon wafers List of Product Model Product Model Vertical Stroke KHR3480-290-AM 290 mm The image above and the video are of KHR3480-290-AM (for 25 wafers batch transfer, 300 mm wafers) Characteristics Capable of transferring 25 wafers at once. The transfer time can be significantly reduced by batch transfer. Available for the layout with multiple cassettes by equipping a rotation axis. End-effector material: ceramic Wafer holding: end-effector with passive edge, edge alignment. AC servo motors with absolute encoders installed in all axes (Batteryless) Standard Specifications Specifications of KHR3480-290-AM. Specifications of Robot Robot Model KHR3480-290-AM Carrying Object 300 mm silicon wafer Wafer Holding Method end-effector with passive edge, edge alignment. Robot Model Type Cylindrical coordinate type Control Axis 3-axis Motor Type AC servo motor Operating Range Arm (R-axis) Rotation Angle (Theta-axis) Vertical Stroke (Z-axis) 720 mm ±320 deg 290 mm Carrying Speed (Ave.) Arm (R-axis) Rotation Angle (Theta-axis) Vertical Stroke (Z-axis) 240 mm/sec 72 deg/sec 100 mm/sec Handling Level 650 mm Repeatability ±0.2 mm Cleanliness Equivalent to ISO class 5 (ISO14644) (at wafer transfer level when exhausting driving part) Utility Power: 3-phase 200V ±10% 2kVA; Vacuum: -70kPa 90L/min (suction) Mass Robot main body: Approximately 150 kg Specifications of Controller Controller Model C6000 series Interface RS232C Outline Drawing (Standard) Product Lineup Menu Prev Next Contact Us Click here for general inquiries. Contact Information Icon guide ...Atmosphere ...Vacuum ...Waterproof ...Thin wafer ...CE marking ...JEL's standard spec. ...KCs marking SEMICON JAPAN 2021 HYBRID title click here for GTFR details page click here for SAL-HV details page. click here for KHR details page. click here for STCR details page. click here for SAL details page. click here for MTCR details page. KHR3480-290-AM KHR3480 (for 25 wafers batch transfer, 300 mm wafers) click here for GTFR details page click here for SAL-HV details page. click here for KHR details page. click here for STCR details page. click here for SAL details page. click here for MTCR details page. SEMICON JAPAN 2021 HYBRID title
../news/news20140409.html	und	1710468658	4206	https://www.jel-robot.com/news/news20140409.html	News | Japanese Holiday Week Information	News | Japanese Holiday Week Information Home  >  News  >  Japanese Holiday Week Information Japanese Holiday Week Information JEL will be closed for Japanese holiday week, "Golden Week" Holidays; April 26th, 27th, 29th (Japan Time) May 3rd to May 6th, 2014 (Japan Time) In case of emergency, please contact us at the following e-mail address: News Topics 2014 2013 2012 2011 Event News 2014 2013 2012 2011 2010 2009 2008 
../products/JCT5B-0500_tb.html	und	1710468955	15991	https://www.jel-robot.com/products/JCT5B-0500_tb.html	Products | JCT5B-0500 (Teaching Box)	Products | JCT5B-0500 (Teaching Box) Home  >  Products  >  〉 Others JCT5B-0500 Teaching Box Usage Environment/Specifications Product Profile Model Name JCT5B-0500 Communication RS232C Applicable Robot Type Horizontal and multi-joint type Characteristics Used for teaching operation of robot. Reading error codes is also available. Equipped with 3-position dead-man switch Easy to operate, one-handed type, weighing only 500g (cable excluded) Max. 2 of normally closed contact is available for emergency stop push-button switch Equipped with push-button self-diagnosis function by internal software Standard Specifications Specifications Input Voltage DC5V (±5%) Communication RS232C Environment 0 to 40℃ (No condensation) Attached Cable Up to 5 meters Emergency Stop Contact Normally closed contact External Dimensions W118×H225×D33(w/contrast adjustment hole attached/Emergency stop button excluded) Mass 500g(Cable excluded) Display Screen LCD monochrome graphic display (66.6×33.3mm, 20×8 characters, 128×64 dots) Connector HDEB-9P(05)(HIROSE ELECTRIC CO., LTD.) Emergency Stop Button A165E-S-03U (Red) (OMRON) Output for emergency stop switch: Normally closed dry contact (UL508 and EN418 standard compliant) Deadman Switch A4E-B200HS (OMRON) 3-position enabling switch (UL508 and ANSI/RIA R15.06-1999 standard compliant) Key Sheet Thin dome array sheets: 9 columns x 5 rows (45 pcs) Applicable Robot Type Horizontal and multi-joint type Connector Specifications Pin No. Signal Contents Assignment of Connector Pin 1 FG Frame ground View from Teaching box 2 TXD RS232C transmitted data 3 RXD RS232C received data 4 DSW Deadman switch output 5 GND Ground for power supply 6 DSW-COM Deadman switch (common) 7 EMG Emergency stop button output 8 EMG-COM Emergency stop button output (common) 9 +5V Power: DC+5V Outline Drawing (Standard) Product Lineup Menu Prev Next Icon guide ...Atmosphere ...Vacuum ...Waterproof ...Single arm ...Twin arm ...Thin wafer ...CE marking ...JEL's standard spec. ...KCs marking Teaching Box 9 pin JCT5B-0500
../support/man002/f001.html	und	1710469127	10620	https://www.jel-robot.com/support/man002/f001.html	Online Support | JELDATA3 Operation Manual | 5. Functions	Online Support | JELDATA3 Operation Manual | 5. Functions Home  >  Online Support  >  Wafer-Search Operation Procedure and Troubleshooting  >  JELDATA3 Operation Manual 縲� 5. Functions JELDATA3 Operation Manual 5. Functions 5.1 Main screen When JELDATA3 is started, the main window appears as shown in the figure below. [A Data], [I Data], [D Data], [Parameter] or [Communication] is selectable. (The [Parameter] tab will not appear if the parameter function is not available for this robot.) (1) Communication Click the [Communication] tab for the robot operation by using commands. Just after the start-up, the [Communication] tab is selected and communication with the controller is available. Response Window:       Display the string representation of the response from the controller.       The carriage return is shown as 窶彈窶�. Command Window:       Write commands to send to the controller.       Press [Enter] key to send the command to the controller. (2) A Data Show 窶廣 Data窶� (point data). Command:       They are the commands for the point data. (Not editable)       The displayed commands differ depending on the robot type. Data:       They are the point data.       The displayed data differs depending on the robot type. Current cell:       Input/edit are available in the current cell. (Data/comment)       Use a mouse or an arrow key on the keyboard to move a current cell. ! Caution When changing 窶廣 Data窶� (Point data), proceed with the utmost care. If it is changed, the robot may move in an unexpected direction, which may damage the device or robot. Any damaging from changing 窶廣 Data窶� is the customer窶冱 responsibility. Bank selection:       Select a bank number from the list. This dialog box will not appear if the bank function is not available. ! Caution Select Bank 0 if the robot to execute the communication does not have the bank function even though the default supports the bank function. ! Caution If the number of bank for the robot to execute the communication is less than the default setting, sending/receiving can be executed only for the valid banks. (3) I Data Show 窶廬 Data窶� (compound command). Command:       They are the commands for the compound commands. Data:       They are the data of compound command. Compound command window:       Correction and delete of compound command are available. ! Caution When changing 窶廬 Data窶�, proceed with the utmost care. If it is changed, the robot may move in an unexpected direction, which may damage the device or robot. Any damaging from changing 窶廬 Data窶� is the customer窶冱 responsibility. ! Caution Make a space by the space key or the tab key after inputting the compound command. (4) D Data Show 窶廛 Data窶� (speed data). Command:       They are the commands for the speed data. (Not editable)       The displayed commands differ depending on the robot type. Data:       They are the speed data. Current cell:       Input/edit are available in the current cell. (Data/comment)       Use a mouse or an arrow key on the keyboard to move a current cell. ! Caution When changing 窶廛 Data窶�, proceed with the utmost care. If it is changed, the robot may move in an unexpected direction, which may damage the device or robot. Any damaging from changing 窶廛 Data窶� is the customer窶冱 responsibility. (5) Parameter Show parameters. (This will not appear if the parameter function is not available for this robot.) Command:       They are the command for the parameter. (Not editable) Value (Val):       They are the parameter data. Current cell:       Input/edit are available in the current cell. (Data/comment)       Use a mouse or an arrow key on the keyboard to move a current cell. ! Caution When changing 窶廛 Data窶�, proceed with the utmost care. If it is changed, the robot may move in an unexpected direction, which may damage the device or robot. Any damaging from changing 窶廛 Data窶� is the customer窶冱 responsibility. ! Caution Min. and Max. values are not editable. either Min. nor Max. value will be sent to the controller.� ! Caution The parameter function is required for the robot to execute the communication to send/receive the parameters, even though the default supports parameters. (Command error occurs.) Contents 竊殖ack Next竊�  Technical Information communication tab A Data tab bank selection of A data tab I data tab D data tab parameter tab
../news/event2015_03.html	und	1710468640	6148	https://www.jel-robot.com/news/event2015_03.html	News | SEMICON China 2015	News | SEMICON China 2015 Home  >  News  >  Event News  >  SEMICON China 2015 SEMICON China 2015 Thank you for coming to SEMICON China 2015. For more product information, please go to the products page or contact us. Date: March 17-19, 2015 Venue: Shanghai New International Expo Centre (SNIEC), Shanghai Booth: 5106 Date: Mar. 17, 2015 Products for Exhibition Robot for handling 2 inch wafer Help to minimize transferring parts or vacuum transfer chamber. Logger system Suitable for the verification of an error such as wafer breakage. Automatic wafer transfer system for wafer container High accuracy handling of thin wafer inside the wafer container. Table-top loader system Available for various types of wafers; 2, 3 inch, 100mm glass, sapphire, SiC,or GaN or others. Robot for handling 300mm wafer Wafer handling to the 2 FOUP cassettes placed side by side is available without track axis. Suited for the high-speed handling of 300mm-wafer in the semiconductor manufacturing equipment and inspection equipment. Event Listings News Top SEMICON China 2015 SEMICON China 2015 Smallest clean robot in the industry specialized for handling up to 2 inch wafer Logger system Wafer transfer system for wafer container GCR4210-300-AM
../products/JCT4B-0500_tb.html	und	1710468955	16069	https://www.jel-robot.com/products/JCT4B-0500_tb.html	Products | JCT4B-0500 (Teaching Box)	Products | JCT4B-0500 (Teaching Box) Home  >  Products  >  〉 Others JCT4B-0500 Teaching Box Usage Environment/Specifications Product Profile Model Name JCT4B-0500 Communication RS422 Applicable Robot Type Cylindrical coordinate type Characteristics Used for teaching operation of robot. Reading error codes is also available. Equipped with 3-position dead-man switch Easy to operate, one-handed type, weighing only 500g (cable excluded) Max. 2 of normally closed contact is available for emergency stop push-button switch Equipped with push-button self-diagnosis function by internal software Standard Specifications Contact us for connector type. Specifications Input Voltage DC24V (±5%) Communication RS422 Environment 0 to 40℃ (No condensation) Attached Cable Up to 10 meters Emergency Stop Contact Normally closed contact External Dimensions W118×H225×D33(w/contrast adjustment hole attached/Emergency stop button excluded) Mass 500g(Cable excluded) Display Screen LCD monochrome graphic display (66.6×33.3mm, 20×8 characters, 128×64 dots) Connector DA-15PF-N (Japan Aviation Electronics Industry, Ltd.) Emergency Stop Button A165E-S-03U (Red) (OMRON) Output for emergency stop switch: Normally closed dry contact (UL508 and EN418 standard compliant) Deadman Switch A4E-B200HS (OMRON) 3-position enabling switch (UL508 and ANSI/RIA R15.06-1999 standard compliant) Key Sheet Thin dome array sheets: 9 columns x 5 rows (45 pcs) Applicable Robot Type Cylindrical coordinate type Outline Drawing (Standard) Product Lineup Menu Prev Next Icon guide ...Atmosphere ...Vacuum ...Waterproof ...Single arm ...Twin arm ...Thin wafer ...CE marking ...JEL's standard spec. ...KCs marking Teaching Box JCT4B-0500
../term/term003_1.html	und	1710469241	8738	https://www.jel-robot.com/term/term003_1.html	Technical Information | Stepping Motor and Servo Motor | List of Stepping Motor Products	Technical Information | Stepping Motor and Servo Motor | List of Stepping Motor Products Home 縲� Technical Information 縲� Stepping Motor and Servo Motor 縲� List of Stepping Motor Products List of Stepping Motor Products In our product model name, 窶弃M窶� is added in the end for the robot using the stepping motor . Model Name Arm/End-Effector Robot Model Type Motor Type Carrying Object SCR3100S (For small wafer) Single arm 3-Axis Cylindrical Coordinate Stepping motor Up to 150mm wafer SCR3130CS Single arm 3-Axis Cylindrical Coordinate Stepping motor Wafer up to 300mm SCR3160CS Single arm 3-Axis Cylindrical Coordinate Stepping motor Wafer up to 300mm SSCR3090S (For small wafer) Single arm 3-Axis Cylindrical Coordinate Stepping motor Up to 100mm wafer STCR4130S Twin arm 4-Axis Cylindrical Coordinate Stepping motor Wafer up to 300mm STCR4160S Twin arm 4-Axis Cylindrical Coordinate Stepping motor Wafer up to 300mm STCR4160S (with flip unit) Twin arm 4-Axis Cylindrical Coordinate Stepping motor SEMI standard 150, 200mm silicon wafer STCR4160SN (For thin wafer or wafer-edge hold) Twin arm 4-Axis Cylindrical Coordinate 2-phase pulse motors installed in all axes. Up to 300mm silicon wafer STWCR4160 (Waterproof) Twin arm 4-Axis Cylindrical Coordinate Stepping motor Wafer up to 300mm SVCR3160 Single arm 3-Axis Cylindrical Coordinate Stepping motor Wafer up to 300mm SVCR3190 (High rigid type) Single arm 3-Axis Cylindrical Coordinate Stepping motor Wafer up to 300mm SVCR3260 Single arm 3-Axis Cylindrical Coordinate Stepping motor Wafer up to 300mm SVCR3330S (Handling susceptor/tray) Single arm 3-Axis Cylindrical Coordinate Stepping motor 342mm tray x 2 (Representative example) SWCR3160CS (Waterproof) Single arm 3-Axis Cylindrical Coordinate Stepping motor Wafer up to 300mm  Click here for a list of servo motor products. example of robot name
../news/event2015_01.html	und	1710468639	7951	https://www.jel-robot.com/news/event2015_01.html	News | 7th LED/OLED Lighting Technology Expo	News | 7th LED/OLED Lighting Technology Expo Home  >  News  >  Event News  >  7th LED/OLED Lighting Technology Expo 7th LED/OLED Lighting Technology Expo Thank you for coming to the 7th LED/OLED Lighting Technology Expo: Lighting Japan. For more product information, please go to the products page or contact us. Date : January 14-16, 2015 Venue : Tokyo Big Sight, Japan Booth : East Exhibition Hall, East 47-4 Date: Jan. 15, 2015 Products for Exhibition Automatic wafer transfer system for wafer container High accuracy handling of thin wafer inside the wafer container. Logger system Suitable for the verification of an error such as wafer breakage. Robots for handling 2 inch wafer Help to minimize transferring parts or vacuum transfer chamber. Table-top loader system 繝サAvailable for various types of wafers; 2, 3 inch, 100mm glass, sapphire, SiC,     or GaN or others Bernoulli type end-effector and Bernoulli hand for thin or warped wafer Low-cost Bernoulli type end-effector available for customization. Visitors experienced the Bernoulli type wafer holding at the exhibition. Event Listings News Top 7th LED/OLED Lighting Technology Expo 7th LED/OLED Lighting Technology Expo Wafer transfer system for wafer container Logger system Smallest clean robot in the industry specialized for handling up to 2 inch wafer Bernoulli type end-effector and Bernoulli hand for thin or warped wafer
../products/prd_result4.html	und	1710468960	6838	https://www.jel-robot.com/products/prd_result4.html	Products | System	Products | System HOME  >  Products  >  System System Data processing Click the product image or name to go to the product page. Product News 3D CAD Drawings Contact Us Technical Information Products Menu 
../company/fkcleanroom.html	und	1404283416	3966	https://www.jel-robot.com/company/fkcleanroom.html	Company | Fukuyama Factory Clean Room	Company | Fukuyama Factory Clean Room Home  >  Company  >  Fukuyama Factory  >  Fukuyama Factory Clean Room Fukuyama Factory Clean Room Area: About 526 m 2 (About 772m 2 when combined with a subassembly room) Cleanliness: Class 10000 (Class 1000 when unloaded) After assembling the wafer transfer robot for semiconductors and FPD glass substrate transfer robot and conducting a performance inspection and pre-shipment inspection, we make shipment to each user. The HEPA filter (99.97%) ventilates the clean room 25 times an hour. Also a differential pressure damper keeps the clean room moderate positive pressure and protects dust penetration. Using the subassembly room together, we are capable of manufacturing over 300 robots a month (when robot is converted to our standard robot, SCR series). Company TOP Contact Us Click here for general inquiries. Contact Information 
../news/news20230401.html	und	1710468667	4056	https://www.jel-robot.com/news/news20230401.html	News | 30th Anniversary	News | 30th Anniversary Home  &gt;  News  &gt;  30th Anniversary 30th Anniversary Celebrating JEL Corporation’s 30th Anniversary JEL celebrated its 30th anniversary on April 1, 2023. We are very proud to celebrate the 30th anniversary in the stage of growth. Taking this opportunity, we would like to express our sincere gratitude to the all who have supported us so far, and express our determination to be a company that continues to make great strides toward the future. We will continue to create products that satisfy our customers and contribute to society. Again, we appreciate your continued support and look forward to working with you. 30th key visual
../support/man002/m005-2.html	und	1710469128	6228	https://www.jel-robot.com/support/man002/m005-2.html	Online Support | Standard Data Copy Manual | Checking of communication	Online Support | Standard Data Copy Manual | Checking of communication Home  >  Online Support  >  Wafer-Search Operation Procedure and Troubleshooting  >  Standard Data Copy Manual 縲� 2. Checking of communication Standard Data Copy Manual Data Copy Manual 2. Checking of communication Check the communication condition before sending/receiving data. (1) Click the [Communication] tab in the main window. (2) Click the command window. When a cursor is blinking in the command window, command can be input. (3) Input $1 in the command window and press the [Enter] key. * $1 means the controller body number is set as 1.   If the controller body number is set as 2, input $2 and [Enter]. (4) When 窶徨ecv:>$1**[窶� appears on the last line in the response window, communication check is completed. If it does not appear, there is a possibility that the communication is not ready yet. In this case, refer to 窶� 4. Before Communication 窶彗nd follow the procedures again. Example: Input $1 Response recv:$100[ = It means "00" is returned from the controller. Communication check is OK.   recv:$1[ = It means no response from a controller. Communication check is NG. * $1 means the controller body number is set as 1, and 窶徨ecv:>$1** [窶� is the received data from controller No.1.   If the controller body number is set as 2, the received data will be 窶徨ecv:>$2** [窶�. * When communication is not available or there is no response from a controller, cable connection or setting may not be correct or there may be other reasons.   Please refer to the " Error Messages ". Contents 竊殖ack Next竊�  Technical Information communication tab command window command window check the communication
../products/product_promo.html	und	1710468961	4194	https://www.jel-robot.com/products/product_promo.html	Products | Product News	Products | Product News Home  &gt;  Products  &gt;  Product News Product News  Introduction of product videos exhibited at Semicon Japan 2023  Introduction of product videos exhibited at Semicon Japan 2022  Introduction of product videos exhibited at Semicon Japan 2021  New Aligner "SAL3000HV Series" (Full auto-adjustment version)  Top Three Strengths of JEL  JEL's Approach to Ensure Cleanliness  Online 3D CAD Drawings  Small Wafer Handling Robots for MEMS Device and LED Wafer 
../company/tokyo.html	und	1710468474	6300	https://www.jel-robot.com/company/tokyo.html	Company | Tokyo Branch	Company | Tokyo Branch Home  >  Company  >  Tokyo Branch Tokyo Branch Tokyo Branch was relocated to Kandasakuma-cho in Chiyoda-ku, Tokyo in May 2017 with a convenient access to JR and subway. A showroom for demonstration, J-tech Center is on the first floor and the office is on the second floor. Click to go to the page of showroom, J-tech Center. Address Kanda Bundo Building 2F, 4-18, Kandasakuma-cho, Chiyoda-ku, Tokyo, 101-0025 Japan Tel +81-3-5825-9071 FAX +81-3-5825-9072 E-mail Guidance for Transportation  Tokyo Metro Hibiya line 7-minute walk from "AKIHABARA" station  JR Yamanote line廱R Chuo-Sobu line廱R Keihin Tohoku line弋sukuba Express 7-minute walk from "AKIHABARA" station  JR Chuo-Sobu line 7-minute walk from "ASAKUSABASHI" station  Toei Asakusa line 8-minute walk from "ASAKUSABASHI" station  Toei Shinjyuku line 9-minute walk from "IWAMOTOCHO" station Company TOP Tokyo branch office building Tokyo branch email address map of tokyo branch
../news/news20190718.html	und	1710468664	3500	https://www.jel-robot.com/news/news20190718.html	News | Summer Holiday Information 2019	News | Summer Holiday Information 2019 Home  &gt;  News  &gt;  Summer Holiday Information Summer Holiday Information JEL will be closed for summer holiday from August 10th to August 15th, 2019 (Japan Time). In case of emergency, please contact us at the following e-mail address: 
../inquiry/form-pr.html	und	1735261501	9470	https://www.jel-robot.com/inquiry/form-pr.html	Contact Us | Inquiry Form	Contact Us | Inquiry Form Home  >  Contact Us  >  Inquiry Form Inquiry Form Required Company  *Please provide the full company name. URL of company website Required Name Required TEL OK tel Required Email address Required Re-enter email address Inquiries Questionnaire Which of the following robots are you considering to purchase? (Multiple answers allowed) A-01 Environment of robot Atmosphere Vacuum Waterproof Aligner A-02 Carrying Object Wafer Glass Others A-03 Arm Single Arm Twin Arm Not yet determined How big is the object to be carried? (Multiple answers allowed) B-01 Wafer 300 mm 200 mm 150 mm (6 inch) less than 125 mm (5 inch) B-02 Glass less than 550×650 mm Approx. 600×720 mm-1100×1250 mm Approx. 1300×1500 mm-1500×1800 mm Other carrying objects C-01 Required Confirmation Click here for privacy policy. If you understand the content of the above and agree to it, click the box. Send    Reset Technical Information 
../products/handling_1.html	und	1710468950	5687	https://www.jel-robot.com/products/handling_1.html	Products | Introduction Video of Handling (Microplate/Petri Dish Handling)	Products | Introduction Video of Handling (Microplate/Petri Dish Handling) Home  >  Products  >  Introduction Video of Handling  >  Microplate/Petri Dish Handling Introduction Video of Handling Microplate/Petri Dish Handling Suitable for automated handling of microplates/petri dishes used in biotechnology and medical applications. By handling the edges of microplates, handling with different heights is available. *Available for various types of containers. * Click to go to the page of robot for hanlding petri dish. Video List Next Video YouTube Official Channel
../news/topics2019.html	und	1710468671	12187	https://www.jel-robot.com/news/topics2019.html	News | Topics 2019	News | Topics 2019 Home  &gt;  News  &gt;  2019 News 2019 December 27, 2019 New Products: SSY-20010 (Automatic wafer transfer system for wafer container) JCR4400 (Transfer Robot with Auto alignment for PLP) December 13, 2019 SEMICON JAPAN 2019 Thanks for coming to the exhibition. November 28 2019 New Year's Holiday Information September 20, 2019 SEMICON TAIWAN 2019 Thanks for coming to the exhibition. August 22, 2019 Building of New Factory Saba factory is currently under construction and will be completed in June 2020. July 18, 2019 Summer Holiday Information July 12, 2019 SEMICON WEST 2019 Thanks for coming to the exhibition. March 22, 2019 SEMICON CHINA 2019 Thanks for coming to the exhibition. March 13, 2019 Holiday Notice JEL will be closed from 27th of April to 6th of May for Japanese holiday week. January 25, 2019 SEMICON KOREA 2019 Thanks for coming to the exhibition. January 7, 2019 New Products: SSY-10010 (Automatic wafer transfer system for wafer container) JVCR4330 (Horizontal and Multi-Joint Type Vacuum Robot for Micro LED) News List News Top New products lineup SEMICON JAPAN 2019 SEMICON TAIWAN 2019 SEMICON WEST 2019 SEMICON CHINA 2019 SEMICON KOREA 2019 New products lineup
../news/event2024_01.html	und	1710468655	8292	https://www.jel-robot.com/news/event2024_01.html	News | SEMICON KOREA 2024	News | SEMICON KOREA 2024 Home  &gt;  News  &gt;  Event News  &gt;  SEMICON KOREA 2024 SEMICON KOREA 2024 Thank you very much for coming to our exhibition booth at SEMICON KOREA 2024. For more information on our products as well as the exhibited products below, please go to the product page or contact us . Date   January 31 to February 02, 2024 Venue COEX (Convention and Exhibition Center), Seoul, Korea Booth No. A628 Inatech & CORP booth in SEMICON KOREA 2024 Products for Exhibition ■GTFR for 300 mm wafers ■SAL-HV for 300 mm wafers ■STCR for 300 mm wafers (flip unit, vacuum, edge-grip) Event Listings News Top SEMICON KOREA 2024 banner Our booth at SEMICON KOREA 2024
../company/sabavisit.html	und	1710468474	6926	https://www.jel-robot.com/company/sabavisit.html	Company | Factory Tour 	Company | Factory Tour Home  &gt;  Company  &gt;  Saba Factory  &gt;  Saba Factory Tour Saba Factory Tour Saba Factory Appearance Entrance(2F) Clean Room 1(2F) Clean Room 1 Area: About 765m 2 Cleanliness: Class 10,000 Clean Room 2(3F) Clean Room 2 Area: About 151m 2 Cleanliness: Class 10,000 Acceptance Inspection Room(2F) Parts Storage(2F) Parts Storage(3F) Facility to Make Control Cables(3F) Saba Factory Office Room(3F) Shipping Room / Packing Room(2F) Company TOP Saba Factory Appearance Entrance(2F) Clean Room 1(2F) Clean Room 2(3F) Acceptance Inspection Room(2F) Parts Storage(2F) Parts Storage(3F) Facility to Make Control Cables(3F) Saba Factory Office Room(3F) Shipping Room / Packing Room(2F)
../support/man002/e001.html	und	1710469126	9404	https://www.jel-robot.com/support/man002/e001.html	Online Support | JELDATA3 Operation Manual | Error Messages 	Online Support | JELDATA3 Operation Manual | Error Messages Home  >  Online Support  >  Wafer-Search Operation Procedure and Troubleshooting  >  JELDATA3 Operation Manual 縲� Error Messages Error Messages 1. Communication Errors 1.1 窶廾pen a Port.窶� Cause: Although the communication port is not open, [Receive], [Send], [Compare] or [Overwrite] is executed. Or although the communication port is not open, communication with the controller on the transceive dialog is executed. Solution: Open a Port from the transceive dialog and follow the procedures again. (Refer to 窶�8.4.(4) Port Open" of the JELDATA3 Operation Manual .) 1.2 窶廚annot Open a Port.窶� Cause: The Communication port that is tried to open is invalid. Solution: Select the valid port from the transceive dialog and open the port. (Refer to 窶�8.4.(6) Port Selection" of the JELDATA3 Operation Manual .) 1.3 窶弃ort is already Opened.窶� Cause: The communication port that is tried to open is in use by another application. Solution: Select the other valid port from the transceive dialog and open it. Or close the application that is using the port and reopen the port. (Refer to 窶�8.4.(6) Port Selection" of the JELDATA3 Operation Manual .) 1.4 窶廚ommunication Error窶� Cause: A communication error occurred while [Receive], [Send], [Compare] or [Overwrite] was being executed. Or a communication error occurred while communicating with the controller on the transceive dialog. Solution: After checking the connections, close the port once, and then reopen it on the transceive dialog to restart operation. (Refer to 窶�8.4.(4) Port Open" of the JELDATA3 Operation Manual .) 1.5 窶廚ommunication Timeout窶� Cause: (1) The controller power is not turned ON. (2) Body number is Invalid or wrong. (3) Communication cable is not properly connected or is damaged. (4) Teaching Box is turned ON. Solution: (1) Check if the controller power is ON. (2) Check if the body number is correct on the transceive dialog. (Refer to 窶�8.4.(3) Body Number Selection" of the JELDATA3 Operation Manual .) (3) Check if the communication cable is properly connected or no cable is disconnected. (4) Check if Teaching Box is turned OFF. Confirm above-mentioned items and restart operation. 1.6 窶廡ailed in Overwriting窶� Cause: A failure occurred in [Overwrite] Solution: Apply the same solution as 窶廚ommunication Timeout窶�. 1.7 窶彝obot is in Operation窶� Cause: The robot is now in operation. Solution: Stop the robot and restart operation. 1.8 窶彜ensor Error窶� Cause: A sensor error occurs. Solution: Clear the sensor error and restart operation. Or select the [sensor] on the [Ignore Error] of transceive dialog and restart operation. (Refer to 窶�8.4.(12) Ignore Error窶捐f the JELDATA3 Operation Manual .) 1.9 窶廣larm Stop窶� Cause: The robot is stopped due to an emergency. Solution: Clear the emergency stop and restart operation. Or select the [Alarm Stop] on the [Ignore Error] of transceive dialog to ignore the emergency and restart operation. (Refer to 窶�8.4.(12) Ignore Error窶捐f the JELDATA3 Operation Manual .) 1.10 窶廚ommand Error窶� Cause: (1) The sent data contains faults. (2) The command that was sent to the controller does not exist. Solution: (1) Check the sent data and correct it. (2) There is a possibility that the controller setting is wrong. Confirm the selected robot on the controller setting display. (Refer to 窶�8.1 Controller Setup of the JELDATA3 Operation Manual 窶�.) Or select the [Command] on the [Ignore Error] of transceive dialog and restart operation. * If the data contains faults, the data cannot be sent. (Refer to 窶�8.4.(12) Ignore Error窶捐f the JELDATA3 Operation Manual .) 1.11 窶廢rror can not be Cleared窶� Cause: Error continuously occurs. Solution: Clear the error and restart operation. Contents 竊殖ack Next竊�  Technical Information 
../products/JVCR4330.html	und	1710468956	16688	https://www.jel-robot.com/products/JVCR4330.html	Products | JVCR4330 (Horizontal and Multi-Joint Type Vacuum Robot for Micro LED) | Wafer Transfer Atmospheric Robot	Products | JVCR4330 (Horizontal and Multi-Joint Type Vacuum Robot for Micro LED) | Wafer Transfer Atmospheric Robot Home 縲� Products 縲� 縲� Robot for Semiconductor JVCR4330 (Horizontal and Multi-Joint Type Vacuum Robot for Micro LED) Product Video Usage Environment/Specifications Product Profile Model Name JVCR4330 Environment Clean room atmosphere Arm Single arm Operating Range 1290 mm (robot center to substrate center) Vertical Stroke 60 mm Payload Capacity 10 kg List of Product Model Product Model Vertical Stroke JVCR4330-060-AM 60 mm The image above and the video are of JVCR4330-060-AM. Characteristics Horizontal and Multi-Joint Type Vacuum Robot for Micro LED. Suitable for access to the parallel layout. Maximum payload capacity of 10 kg. Standard Specifications Standard specifications with JVCR4330-060-AM (Horizontal and Multi-Joint Type Vacuum Robot for Micro LED) Specifications of Robot Robot Model JVCR4330-060-AM Carrying Object 700 mm susceptors (10 kg) Substrate Holding Method Friction retaining by O-ring. Robot Model Type Horizontal and multi-joint type Control Axis 4-axis Motor Type AC servo motor Operating Range From robot center to wafer center Rotation Angle (Theta-axis) Vertical Stroke (Z-axis) 1290 mm 360 deg 60 mm Carrying Speed Arm (R-axis) Rotation Angle (Theta-axis) Vertical Stroke (Z-axis) 640 mm/4.0 sec 360 deg/5.0 sec 60 mm/2.0 sec Resolution 1st Joint Axis (J1 axis) 2nd Joint Axis (J2 axis) 3rd Joint Axis (J3 axis) 8.1x10 -4 deg 8.1x10 -4 deg 7.2x10 -4 deg Z-axis (J4 axis)   0.98 µm   Repeatability Within ±0.1 mm Cleanliness Robot main body: 0.1 µm/cf Class 1 Utility Power: AC200V Single phase ±10% 4.0 kVA Mass Robot main body: Approx. 90 kg Specifications of Controller Controller Model C5000S series Interface RS232C and parallel photo I/O Outline Drawing (Standard) Product Lineup Menu Prev Next Icon guide ...Atmosphere ...Vacuum ...Waterproof ...Single arm ...Twin arm ...Thin wafer ...CE marking ...JEL's standard spec. ...KCs marking JVCR4330 (Horizontal and Multi-Joint Type Vacuum Robot for Micro LED) JVCR4330-060-AM
../company/fukuyama.html	und	1710468469	6562	https://www.jel-robot.com/company/fukuyama.html	Company | Head Office	Company | Head Office Home  &gt;  Company  &gt;  Head Office Head Office Address 2-8-20, Kusado-cho, Fukuyama-city, Hiroshima, 720-0831 Japan Tel +81-84-932-6500 FAX +81-84-932-6501 Map of JEL Head Office   Transportation by taxi It takes 7min. from JR Fukuyama station by taxi. When you take a taxi, please tell the driver to go to the JEL in Kusado-cho. Company TOP JEL Head Office entrance and meeting room of JEL Head Office map of JEL Head Office
../news/event2017.html	und	1710468644	6874	https://www.jel-robot.com/news/event2017.html	News | Event News 2017	News | Event News 2017 Home  &gt;  News  &gt;  Event News  &gt;  2017 Event News 2017 SEMICON JAPAN 2017 Date: December 13-15, 2017 Main exhibition machine type Automatic wafer transfer system for wafer container (SSY) Tape frame handling robot (MTCR) Robot with substrate alignment function (JCR) New aligner with full auto-adjustment tool (SAL3000HV Series) Vacuum robot (Reference exhibit)  Click here for details.   SEMICON TAIWAN 2017 Date: Sept 13-15, 2017 Main exhibition machine type Tape frame handling robot  Click here for details.   OPTO Taiwan 2017 Date: June 14-16, 2017  Click here for details.   Automation World 2017 (AIMEX) Date: March 29-31, 2017 Main exhibition machine type Robot with alignment function of molded (PLP) substrate  Click here for details.   SEMICON CHINA 2017 Date: March 14-16, 2017 Main exhibition machine type Automatic wafer transfer system for wafer container GCR-AM with end-effectors with rotation function Tape frame handling robot New Aligner SAL3000HV Series (full auto-adjustment version)  Click here for details.   SEMICON KOREA 2017 Date: February 8-10, 2017 Main exhibition machine type Robot with alignment function of molded (PLP) substrate Automatic wafer transfer system for wafer container Tape frame handling robot  Click here for details.   Event Listings News Top 
../support/man002/e003.html	und	1710469126	6031	https://www.jel-robot.com/support/man002/e003.html	Online Support | JELDATA3 Operation Manual | Error Messages 	Online Support | JELDATA3 Operation Manual | Error Messages Home  >  Online Support  >  Wafer-Search Operation Procedure and Troubleshooting  >  JELDATA3 Operation Manual 縲� Error Messages Error Messages 3. Other errors 3.1 窶廚hoose Date窶� Cause: (1) Although the Send/Receive data is not selected at the transceive dialog, [Send], [Receive], [Overwrite] or [Compare] operation is proceeded. (2)Although the data to save is not selected at the Select File dialog, the [Decide] button is clicked. Solution: (1) After selecting the Send/Receive data, restart operation. (Refer to 窶� 8.4 Transceive" the JELDATA3 Operation Manual .) (2) After selecting the data to save, restart operation. (Refer to 窶� 6.2 Save" of Standard Data Copy Manual .) 3.2 窶廚lose the Working Folder.窶� Cause: The working folder is already opened by Explorer or another application. Solution: Check the path in the message, end Explorer or another application that is using the file, and restart JELDATA3. 3.3 窶廸o Data in I Data.窶� Cause: Although there is no data (command string characters) in 窶廬窶� Data on JELDATA3, the [Compare] of 窶廬 Data窶� was executed. Solution: Receive窶廬 Data窶� File from the controller or write data (command string characters) directly. 3.4 窶彜et I Data within 255 characters.窶� Cause: 窶廬 Data窶拂ontains more than 256 characters (command string characters) at [Send]. Solution: The number of characters for the send data of compound command must be no more than 255 characters including the carriage return. JELDATA3 automatically adds the carriage return at the end of the data (command string characters) when sending 窶廬 Data窶�. Thus edit the data (command string characters) so that the data contains no more than 255 characters. (Refer to the JELDATA3 Operation Manual) Contents 竊殖ack  Technical Information 
../news/event2022_04.html	und	1710468653	9713	https://www.jel-robot.com/news/event2022_04.html	News | SEMICON JAPAN 2022	News | SEMICON JAPAN 2022 Home  &gt;  News  &gt;  Event News  &gt;  SEMICON JAPAN 2022 SEMICON JAPAN 2022 Thank you very much for coming to our exhibition booth. For more information on our products as well as the exhibited products below, please go to the product page or contact us . Date   Wed., December 14 - Fri., December 16, 2022 Venue Tokyo Big Sight, Japan Booth East Exhibition Hall 5 5023 Access Map & Floor Plan  Products for Exhibition  JEL booth in SEMICON JAPAN 2022 Access Map & Floor Plan Products for Exhibition ■GTFR for 300 mm wafers ■SAL-HV for 300 mm wafers ■KHR for 25 wafers batch transfer (300 mm wafers) ■MTCR for φ300 mm TAIKO™ wafer ■SAL forφ300 mm TAIKO™ wafer "TAIKO™" is a trademark or registered trademark of DISCO Corporation. Event Listings News Top SEMICON JAPAN 2022 logo JEL booth at the exhibition SEMICON JAPAN 2022 booth map
../company/kochi.html	und	1710468471	5462	https://www.jel-robot.com/company/kochi.html	Company | JEL Kochi	Company | JEL Kochi Home  >  Company  >  JEL Kochi JEL Kochi Extension Building Tour Solor Power Plant in JEL Kochi Kochi Branch opened on 1, June, 2007 in Techno Park, Kochi. On September 1, 2023, an extension building of JEL Kochi factory was completed, to meet the increasing demand for semiconductors and to further expand and strengthen production. And in the future, the existing building will also be renovated to strengthen and improve production efficiency together with the extension building. Address Techno Park 4, Tosayamada-cho, Kami-city, Kochi, 782-0010 Japan Tel +81-887-53-1181 FAX +81-887-53-1182 Guidance for the traffic 10min. (5km) from the Tosayamada station by taxi. Company TOP JEL Kochi
../support/man002/s007.html	und	1710469131	11248	https://www.jel-robot.com/support/man002/s007.html	Online Support | JELDATA3 Operation Manual | Transceive	Online Support | JELDATA3 Operation Manual | Transceive Home  >  Online Support  >  Wafer-Search Operation Procedure and Troubleshooting  >  JELDATA3 Operation Manual 縲� 8. Setup JELDATA3 Operation Manual 8. Setup 8.4 Transceive It is for transceiving 窶廣 Data窶�, 窶廬 Data", "D Data窶� and Parameter (if it is supported). (1) Transceive data selection Tick the box and select the data to transceive. The [Parameter] will not appear if the parameter function is not available for this robot. (2) Bank selection Select the bank number from the bank list. The bank number will not appear if the bank function is not available for this robot. Selects 窶廣ll Bank窶�  竊�  Sends/Receives all bank. Selects other than 窶廣ll Bank窶�  竊�  Sends/Receives the designated bank only. (3) Body Number Selection Select the body number to communicate from the list. (4) Port Open Click the [Open] button to open the communication port. When the application is started, the communication port that was used in the previous communication automatically opens. While opening the port, this button is invalid. (5) Port Close Click the [Close] button to close the communication port. The port is automatically closed when the application is exited. While closing the port, this button is invalid. (6) Port Selection Select the communication port from the list. To change the port while the port is connected, close the port with the [Close] button. Then select the other port and click the [Open] button to open the new port. (7) Port Status It shows the communication status of the port. The message appears when the port is connected, and no message appears when it is not connected. (8) Receive The confirmation message appears when the [Receive] button is clicked. If it is OK, click the [Yes] button to receive the selected data from the controller. Click the [No] to cancel the operation. While receiving the data, the progress is shown on the status bar. When data receive is completed, the completion message appears. (9) Send The confirmation message appears when the [Send] button is clicked. If it is OK, click the [Yes] button to send the selected data to the controller. Click [No] to cancel the operation. While sending the data, the progress is shown on the status bar. When data sending is completed, the completion message appears. (10) Compare The confirmation message appears when the [Compare] button is clicked. If it is OK, click the [Yes] button to compare the selected data with the data in the controller. The result will be displayed at the comment of each data dialog box. Click [No] to cancel the operation. While comparing the data, the progress is shown on the status bar. When data comparison is completed, the dialog box shows the completion message and the numbers of NG. 繝サExample) When all the data matched (NG is 0): 繝サExample) When there are data mismatched (NG is 4): 繝サResult of 窶廣 Data窶� comparison 繝サResult of 窶廬 Data窶� comparison           Data match 竊� OK           Data mismatch 竊� NG: Contents of the controller data 繝サResult of 窶廛 Data窶� comparison 繝サResult of Parameter comparison           Data match 竊� OK           Data mismatch 竊� NG: Contents of the controller data (11) Overwrite The confirmation message appears when the [Overwrite] button is clicked. If it is OK, click the [Yes] button to store the selected data in the controller. Click [No] to cancel the operation. While writing the data, the progress is shown on the status bar. When data overwrite is completed, the completion message will appear. (12) Ignore Error Tick the box to select error(s) to ignore. This function is not necessary for the standard operation. Use this when data sending/receiving is necessary while the robot is in alarm stop. Sensor error, Alarm error and command error are errors from the controller and they can be ignored. ! Caution Use this function when Sensor error, Alarm error or Command error occurs in the controller. (If the error occurs in the controller, the error message will appear while data sending/receiving.) (13) Close Click the [Close] button and close the 窶弋ransceive窶� dialog box. Contents 竊殖ack Next竊�  Technical Information communication tab transceive tab select the data type select the bank number select the body number open the communication port close the communication port selct the port status bar of port receive message receive data message send message send data message send data message status bar when data is being sent message when sending data is completed compare message compare data message status bar when data is being compared message of data compare is completed message of data compare is completed with NG result of A data result of I data result of D data result of Parameter comparison overwrite message overwrite message status bar when data is being written message when data overwriting is completed window of ignore error close message
../index0101.html	und	1482737635	8429	https://www.jel-robot.com/index0101.html	JEL Corporation | Wafer Transfer Robot for Semiconductor Manufacturing	JEL Corporation | Wafer Transfer Robot for Semiconductor Manufacturing News Topics Event News Company Click here for the company information. Fukuyama Factory Tokyo Branch JEL Kochi Overseas Contact Contact Us Click here for general inquiries. Contact Information Product Search Official YouTube channel FAQ Challenge for 450mm Wafer JEL's approach to cleanliness Digital Signage at Fukuyama Station Digital signage inside JR Fukuyama station (around a waiting area) to promote sightseeing information of Fukuyama city as well as our company SSY-11010 (Automatic wafer transfer system for wafer container) GCR4210 (Robot with end-effectors with rotation function) MTCR4160 (Tape frame handling robot) JCR4400 (Robot with alignment function of molded (PLP) substrate) New Aligner SAL3000HV Series (full auto-adjustment version)
../company/saba.html	und	1710468473	6236	https://www.jel-robot.com/company/saba.html	Company | Saba Factory	Company | Saba Factory Home  &gt;  Company  &gt;  Saba Factory Saba Factory Established in June 2020 in Saba-cho, Fukuyama, our Saba factory with clean rooms will contribute to the speed of research development and mass manufacturing. We will promote greater customer satisfaction and the development of new markets. Address 245-1 Saba-cho, Fukuyama-city, Hiroshima, 720-0835 Japan Tel +81-84-952-5590 FAX +81-84-952-5591 Map of JEL Saba Factory   Transportation by taxi It takes 7min. from JR Fukuyama station by taxi. When you take a taxi, please tell the driver to go to the JEL in Saba-cho. Company TOP JEL Saba Factory entrance and meeting room of JEL Saba Factory map of JEL Saba Factory
../news/event2023_01.html	und	1710468653	8278	https://www.jel-robot.com/news/event2023_01.html	News | SEMICON KOREA 2023	News | SEMICON KOREA 2023 Home  &gt;  News  &gt;  Event News  &gt;  SEMICON KOREA 2023 SEMICON KOREA 2023 Thank you very much for coming to our exhibition booth at SEMICON KOREA 2023. For more information on our products as well as the exhibited products below, please go to the product page or contact us . Date   February 01 to 03, 2023 Venue COEX (Convention and Exhibition Center), Seoul, Korea Booth No. A254 Inatech & CORP booth in SEMICON KOREA 2023 Products for Exhibition ■GTFR for 300 mm wafers ■SAL-HV for 300 mm wafers ■Bernoulli type end-effector for 200 mm, 300 mm wafers Event Listings News Top SEMICON KOREA 2023 banner Our booth at SEMICON KOREA 2023
../support/man001/t011.html	und	1710469103	4593	https://www.jel-robot.com/support/man001/t011.html	Online Support |11: The results of wafer search differ between via Parallel I/O and via serial communication. 	Online Support |11: The results of wafer search differ between via Parallel I/O and via serial communication. Home  >  Online Support  >  Manuals/Troubleshooting  >  Wafer-Search Operation Procedure and Troubleshooting  >  11: The results of wafer-search differ between via Parallel I/O and via serial communication. Troubleshooting of Wafer Search Operation 11: The results of wafer-search differ between via Parallel I/O and via serial communication. The output of the results of wafer-search may not be received in the PLC. Refer to the PLC functions in the instruction manual and change the output pulse width (minimum width) of the busy signal. Contents Back Next  Technical Information 
../products/SAL20C1_a.html	und	1710468962	11050	https://www.jel-robot.com/products/SAL20C1_a.html	Products | SAL20C1 (Edge-grip type)	Products | SAL20C1 (Edge-grip type) Home 〉 Products 〉 〉 Aligner SAL20C1 (Edge-grip type) Wafer Aligner Product Video Usage Environment/Specifications Product Profile Product Model SAL20C1 Environment Clean room atmosphere Wafer Size 300 mm Carrying Object Silicon wafer The image above and the video are of SAL20C1. Characteristics Designed for aligning wafers in a production line or inspection line of semiconductor. Edge grip type aligner minimizes the wafer contact. High-speed, high-accuracy centering and notch locating by the edge-grip function. Designed to reduce the contamination. RS232C and parallel photo I/O are standard for control. Standard Specifications Carrying Object SEMI standard 300 mm silicon wafer Positioning Accuracy Centering: Within ±0.3 mm Notch locating: Within ±0.3 deg Positioning Time Notch search: 2.5 sec (Notch search only) Sensor Transmissive LED sensor Cleanliness 0.1 µm/cf Class 1 (at wafer transfer level when exhausting driving part) Driving method 2-phase stepping motor (for 2 axes)(internal motor driver) Utility Power: DC24V±10% 2A Outline Drawing Product Lineup Menu Prev Next Icon guide ...Atmosphere ...Vacuum ...Waterproof ...Thin wafer ...CE marking ...JEL's standard spec. ...KCs marking SAL20C1 SAL20C1
../support/man001/t004.html	und	1710469101	5087	https://www.jel-robot.com/support/man001/t004.html	Online Support |4: Search failure occurs in the low slot of the cassette when wafer-search is started.	Online Support |4: Search failure occurs in the low slot of the cassette when wafer-search is started. Home  >  Online Support  >  Manuals/Troubleshooting  >  Wafer-Search Operation Procedure and Troubleshooting  >  4: Search failure occurs in the low slot of the cassette when wafer-search is started. Troubleshooting of Wafer Search Operation 4: Search failure occurs in the low slot of the cassette when wafer-search is started. The warming up time from when wafer-search is started is short. After turning ON the sensor light source, set the wakeup time of the sensor before wafer-search is started. (* The procedure varies depending on the specification.) Refer to the functions of wafer-search in the instruction manual. When the start position of wafer-search is too close to the first slot, it falls within the range of 窶�6: Setting of the detection gate width of wafer (WWG setting)窶� and it may cause an error in the wafer detection of the lowest slot. As specified in 窶�9: Teaching and setting of the start position of wafer-search窶� , change the start position of wafer-search. Contents Back Next  Technical Information 
../products/BERNOULLI_1_end.html	und	1710468943	9716	https://www.jel-robot.com/products/BERNOULLI_1_end.html	Products | BERNOULLI Bernoulli Type End-Effectorontact type�	Products | BERNOULLI Bernoulli Type End-Effectorontact type� Home  >  Products  >  縲� Others Bernoulli Type End-Effector (Contact type) Product Video Usage Environment/Specifications Product Profile Model Name Bernoulli End-Effector (Contact type) Mechanism of Bernoulli End-Effector (Contact type) Click to go to the page of Mechanism of Bernoulli End-Effector. Characteristics Low cost end-effector for thin or warped wafers using the Bernoulli principle Available for any types of JEL atmospheric robots Suitable design solutions with evaluation using sample wafers based on customer's request about the wafer conditions Wafer holding by the friction rubber to avoid displacement during operation Capable of handling different size of wafers with one end-effector (*Depending on the wafer size) Thinner than the non-contact type Bernoulli end-effector Suitable for thin wafers as the Bernoulli end-effector applies pressure to wider area of wafer compared to the vacuum suction type end-effector Standard Specifications Material Aluminum Surface treatment Black alumite Wafer holding By the Bernoulli窶冱 principle using Cyclone pad and friction rubber (H-NBR) Various materials available for the contact area Utility 30 to 80 L/min (Varies depending on the wafer condition) Please contact us for the detailed specifications. Product Lineup Menu Prev Next Bernoulli End-Effector (Contact type)
../term/term002.html	und	1710469240	3863	https://www.jel-robot.com/term/term002.html	Technical Information | Copy Exactly	Technical Information | Copy Exactly Home 縲� Technical Information 縲� Copy Exactly What is Copy Exactly? The strategy of "Copy Exactly" means "complete duplication". If the copy exactly is specified when purchasing a robot, we duplicate the product by providing a processing or a surface treatment with the same manufacturing process and same parts based on the specifications approved when the contact is established. The strategy of copy exactly provides customers with safe products and contributes to maintain the quality of manufacturing process. copy exactly
../news/news20180410.html	und	1710468663	3461	https://www.jel-robot.com/news/news20180410.html	News | Holiday Notice: Japanese Holiday Week, Golden Week Holidays of 2018	News | Holiday Notice: Japanese Holiday Week, Golden Week Holidays of 2018 Home  >  News  >  Holiday Notice Holiday Notice JEL will be closed from 28th to 30th of April and 3rd to 6th of May for Japanese holiday week, "Golden Week Holidays". In case of emergency, please contact us at the following e-mail address: 
../company/tokyo_show.html	und	1710468475	14349	https://www.jel-robot.com/company/tokyo_show.html	Company | J-tech Center	Company | J-tech Center Home  &gt;  Company  &gt;  Tokyo Branch  &gt;  J-tech Center J-tech Center What is J-tech Center? J-tech Center is a showroom where JEL main robots or Bernoulli end-effector are on display. Operation check using customers窶� wafer is available with prior arrangement. Also, we offer robot training using actual robot. How to use J-tech Center? Vacuum check for Bernoulli end-effector Vacuum check for Bernoulli end-effector is available for 150mm, 200mm, and 300mm wafer. Alignment accuracy test Alignment accuracy test with the measuring tool is available using customer's wafer. Robot operation training Robot operation training using actual robot is available at J-tech Center. Contact for application Contact JEL Corporation Head Office Tel +81-84-932-6500 E-MAIL Display robots MTCR for tape frame for 300mm wafers: MTCR4160-300-AM Designed for handling 300 mm wafers in a production line or inspection line of semiconductor. High-speed handling by AC servo motor and superior cost performance compared to MTHR type STCR for 150 or 200 mm chemical compound wafer: STCR4160S-300-PM Designed for handling small wafers in a production line or inspection line of semiconductor. Base or flange mounting type is selectable. Automatic wafer transfer system for wafer container: SSY-10010 High accuracy transport of thin wafer inside the wafer container. Equipped with mechanism of automatic lid opening/closing of the wafer container. (Patent pending) Twin-arm clean robot for handling wafer up to 300mm (Closed-loop control): STCR4160SN-300-CM For handling wafers from 2 inch to 300mm with low-cost, high-speed handling, and no step-out error. Horizontal and multi-joint type clean robot for handling 300 mm wafers: GCR4210-300-PM Designed for handling 300mm wafers in a production line or inspection line of semiconductor. --> --> Twin-arm clean robot with flip unit & Aligner for handling thin, 150mm and 200mm wafers: STCR4160S-300-PM / SAL3481 By using our Bernoulli type end-effector, the robot with twin-arm flip unit robot transfers thin, 150mm and 200mm wafers. Aligner are for thin wafers, which can handle 150mm and 200mm wafers. Flip unit is installed at both arms to handle both 150mm and 200mm wafers simultaneously. Aligner for handling 2, 3 inch, 100 to 150mm wafer: SAL3261HV New type of aligner available for any material of wafer for 2, 3 inch, 100 to 150mm wafer. Edge grip aligner for handling 150mm wafer: SAL2061 High-speed, high-accuracy centering and flat/notch locating of small wafer by edge grip wafer holding. Table-top loader system for 100mm wafer: SSY-10000 Available for various types of wafers; 2, 3 inch, 100mm glass, sapphire, SiC, or GaN or others Bernoulli type end-effector for thin or warped wafer Low-cost Bernoulli type end-effector available for customization. As an ideal end-effector for thin and warped wafers, we provide the Bernoulli type end-effector at its most suitable design according to the customers窶� system layout. Company TOP J-tech Center vacuum check alignment accuracy test robot operation training MTCR4160-300-AM STCR4160S-300-PM SSY-10010 STCR4160SN-300-CM GCR4210-300-PM STCR4160S-300-PM/SAL3481 SAL3261HV SAL2061 SSY-10000 Bernoulli type end-effector
../support/man001/t005.html	und	1710469101	4580	https://www.jel-robot.com/support/man001/t005.html	Online Support |5: Search failure occurs in the top slot of the cassette when wafer search is started.	Online Support |5: Search failure occurs in the top slot of the cassette when wafer search is started. Home  >  Online Support  >  Manuals/Troubleshooting  >  Wafer-Search Operation Procedure and Troubleshooting  >  5: Search failure occurs in the top slot of the cassette when wafer-search is started. Troubleshooting of Wafer Search Operation 5: Search failure occurs in the top slot of the cassette when wafer-search is started. The setting of the stop position of wafer-search completion is not correct. As specified in 窶�7: Setting of the stop position of wafer-search completion (WEND setting)窶� of Wafer-Search Operation Procedure, set it larger than the current setting. Contents Back Next  Technical Information 
../news/news20250408.html	und	1744094846	3796	https://www.jel-robot.com/news/news20250408.html	News | Holiday Notice: Japanese Holiday Week, Golden Week Holidays of 2025	News | Holiday Notice: Japanese Holiday Week, Golden Week Holidays of 2025 Home  &gt;  News  &gt;  Holiday Notice Holiday Notice JEL will be closed for the following for a Japanese holiday week, Golden Week Holidays: April 26th, 27th, 29th; May 3rd to 6th. In case of emergency, please contact us at the following e-mail address: 
../products/SC-YW-227_end.html	und	1710468965	10662	https://www.jel-robot.com/products/SC-YW-227_end.html	Products | SC-YW-227 (Vacuum Type End-Effector)	Products | SC-YW-227 (Vacuum Type End-Effector) Home  >  Products  >  縲� Others SC-YW-227 Vacuum Type End-Effector Usage Environment/Specifications Product Profile Model Name SC-YW-227 Carrying Size 100 to 300mm Carrying Object Mainly silicon wafer Characteristics Y-shaped vacuum suction type end-effector, suitable for handling wafer from 100 to 300mm (Random access is available). Used extensively for atmospheric robot, the end-effector holds the backside of wafer by vacuum suction (negative pressure). Conductive Teflon coating on the surface of end-effector protects against damage from charging. Standard Specifications Carrying Object SEMI standard 100 to 300mm (Mainly silicon wafer) Material High purity alumina ceramic sintered body Surface Treatment Conductive Teflon coating Wafer Holding Method Vacuum suction Total Length 227mm Thickness 2mm Please contact us for the detailed specifications. Outline Drawing (Standard) Product Lineup Menu Prev Next Icon guide ...Atmosphere ...Vacuum ...Waterproof ...Single arm ...Twin arm ...Thin wafer ...CE marking ...JEL's standard spec. ...KCs marking SC-YW-227 SC-YW-227
../company/kochi_solar.html	und	1710468471	4264	https://www.jel-robot.com/company/kochi_solar.html	Company | Operation of a solar power plant in Kochi	Company | Operation of a solar power plant in Kochi Home  >  Company  >  JEL Kochi  >  Operation of a solar power plant in Kochi Operation of a solar power plant in Kochi On March 22, 2013, JEL started operation of an approximately 0.5 megawatt solar power plant in JEL Kochi to promote clean energy. Its 2,086 solar panels convert the solar light into electricity. This plant has solar electric generating capacity of 500 megawatt-hours in a year, which is expected to cover about 140 households' annual power consumption (*). We will further promote the environmentally-friendly efforts to save energy and electricity. *Calculating 3.6 megawatt-hours per household Reference from the Federation of Electric Power Companies of Japan Company TOP solar power plant of JEL Kochi
../news/news20201130.html	und	1710468666	3717	https://www.jel-robot.com/news/news20201130.html	News | New Year's Holiday Information	News | New Year's Holiday Information Home  &gt;  News  &gt;  New Year's Holiday Information New Year's Holiday Information JEL will be closed for New Year's holiday from December 29th, 2020 to January 4th, 2021 (Japan Time). In case of emergency, please contact us at the following e-mail address: 
../support/man002/m005.html	und	1710469129	5228	https://www.jel-robot.com/support/man002/m005.html	Online Support | Standard Data Copy Manual | Controller communication	Online Support | Standard Data Copy Manual | Controller communication Home  >  Online Support  >  Wafer-Search Operation Procedure and Troubleshooting  >  Standard Data Copy Manual 縲� 1. Setting of the controller for communication Standard Data Copy Manual Data Copy Manual 1. Setting of the controller for communication * Once the controller setting is completed, there is no necessity of the setting from the next start-up. * The controller setting dialog box will automatically appear when JELDATA3 is booted for the first time. * For window functions, please refer to here . * For JELDATA3 setup, please refer to here . * For the choice of the robot series, please refer to the 窶廰ist of the robot series窶� and select the appropriate robot series. Example: Set the controller for the GHR Robot (1) From the menu: Select [Setup] - [Controller Setup] (2) Controller Setup dialog box appears. (3) Select 窶廨HR窶� from the list. (4) Click the [Decide] button and start controller setting. Contents Next竊�  Technical Information controller setup controller setup dialog box select the communicating robot confirm the communicating robot
../support/man002/m003.html	und	1710469128	4543	https://www.jel-robot.com/support/man002/m003.html	Online Support | JELDATA3 Operation Manual | 3. Precautions	Online Support | JELDATA3 Operation Manual | 3. Precautions Home  >  Online Support  >  Wafer-Search Operation Procedure and Troubleshooting  >  JELDATA3 Operation Manual 縲� 3. Precautions JELDATA3 Operation Manual 3. Precautions 3.1 Serial port on the personal computer If the PC does not have a serial port (RS232C connector), prepare a USB serial conversion connector or install the software JELDATA3 to the PC equipped with a serial port (RS232C connector). 3.2 Communication through RS485 The software JELDATA3 does not support data sending/receiving function through RS485. Connect RS232C cable directly to the controller. Contents 竊殖ack Next竊�  Technical Information Communication through RS485
../news/news20160726.html	und	1710468661	3467	https://www.jel-robot.com/news/news20160726.html	News | Summer Holiday Information 2016	News | Summer Holiday Information 2016 Home  >  News  >  Summer Holiday Information Summer Holiday Information JEL will be closed for summer holiday from August 11th to August 15th, 2016 (Japan Time). In case of emergency, please contact us at the following e-mail address: 
../products/GTVCR5330.html	und	1710468950	16303	https://www.jel-robot.com/products/GTVCR5330.html	Products | GTVCR5330 | Wafer Transfer Atmospheric Robot	Products | GTVCR5330 | Wafer Transfer Atmospheric Robot Home 縲� Products 縲� 縲� Robot for Semiconductor GTVCR5330 5-Axis Horizontal and Multi-Joint Type Clean Robot Product Video Usage Environment/Specifications Product Profile Model Name GTVCR5330 Environment Clean room atmosphere (Temp. 15°C to 40°C) Process chamber  (Max. Temp. 450°C) Arm Single arm Operating Range 635mm (3rd joint center) Vertical Stroke 60mm Payload Capacity Below 4kg (calculated for the arm 3rd joint) List of Product Model Product Model Vertical Stroke GTVCR5330-060-AM 60mm The image above and the video are of GTVCR5330-060-AM (*The robot in the image and video uses the four end-effectors.) Characteristics Achieved cost reduction while maintaining the performance and functions of conventional robot GTVHR5000 series. Transfers to the parallel stages in the vacuum chamber and supports various layouts, reducing footprint and vacuuming volume. Simplification of the chamber layout leads to the cost reduction. Suitable to the inline layout. Execution of origin search is not required by using the servo motors with absolute encoders. Arm lineup: 280mm, 330mm Magnetic fluid sealing is used for arm joint. Vacuum sealing: Magnetic fluid sealing and bellows are used. For cleanliness: 5µm mesh filter installed for exhaust ventilation in the arm. Twin end-effector reduces the wafer swap time. Motion monitoring is available. RS232C and parallel photo I/O are standard for control. AC servo motors with absolute encoders installed in all axes. High-speed, high-accuracy wafer handlingby S-curved speed control. Wafer holding: end-effector with passive edge or edge grip type end-effector, and friction retaining by O-ring. End-effector material: CFRP, Al, ceramic, or others. Optimal end-effector is selectable according to the carrying object and line layout. Standard Specifications Representative specifications of GTVCR5330-060-AM. It can be changed depending on the carrying object and end-effector type. Specifications of Robot Robot Model GTVCR5330-060-AM Carrying Object Wafer up to 300mm Robot Model Type Horizontal and multi-joint type Control Axis 5-axis Motor Type AC servo motor Operating Range 3rd Joint Center Rotation Angle (Theta-axis) Vertical Stroke (Z-axis) 635mm 360deg 60mm Carrying Speed (Ave.) Arm (R-axis) Rotation Angle (Theta-axis) Vertical Stroke (Z-axis) 640mm/sec 160deg/sec 60mm/sec Carrying Speed (Max.) Arm (R-axis) Rotation Angle (Theta-axis) Vertical Stroke (Z-axis) 950mm/sec 200deg/sec 85mm/sec Resolution 1st Joint Axis (J1-axis) 2nd Joint Axis (J2-axis) 3rd Joint Axis (J3-axis) 3rd Joint Axis (J5-axis) Z-Axis (J4-axis) 0.00081deg 0.00081deg 0.00072deg 0.00072deg 0.98µm Repeatability Within ±0.1mm Handling Level 219mm (Mounting level to upper end-effector level) Cleanliness Magnetic fluid sealing and filter Vacuum resistance 1 x 10 -6 Pa Utility Power: AC200 to 230V 2kVA 50/60Hz Specifications of Controller Controller Model C5000S series Interface RS232C and parallel photo I/O Outline Drawing (Standard) Product Lineup Menu Prev Next Icon guide ...Atmosphere ...Vacuum ...Waterproof ...Single end-effector ...Twin end-effector ...Thin wafer ...CE marking ...JEL's standard spec. ...KCs marking GTVCR5330-060-AM GTVCR5330-060-AM
../news/event2020_03.html	und	1710468650	9563	https://www.jel-robot.com/news/event2020_03.html	News | SEMICON TAIWAN 2020	News | SEMICON TAIWAN 2020 Home  &gt;  News  &gt;  Event News  &gt;  SEMICON TAIWAN 2020 SEMICON TAIWAN 2020 Thank you very much for coming to our exhibition booth at SEMICON TAIWAN 2020. For more information on our products as well as the exhibited products below, please go to the product page or contact us . Date   September 23 to 25, 2020 Venue Taipei Nangang Exhibition Center, Taiwan Booth K2164 (Challentech booth) Challentech booth in SEMICON TAIWAN 2020 Event Listings News Top SEMICON TAIWAN 2020 banner Our booth at SEMICON TAIWAN 2020
../news/event2018_03.html	und	1710468647	8427	https://www.jel-robot.com/news/event2018_03.html	News | SEMICON TAIWAN 2018	News | SEMICON TAIWAN 2018 Home  >  News  >  Event News  >  SEMICON TAIWAN 2018 SEMICON TAIWAN 2018 Thank you very much for coming to our exhibition booth. For more information on our products as well as the exhibited products below, please go to the product page or contact us . Date   September 5-7, 2018 Venue Taipei Nangang Exhibition Hall, Taiwan Booth M858  Products for Exhibition Products for Exhibition Twin arm robot with path planning handling Access to the inline 2 port layout cassettes without a track. Simultaneous movement of both theta-axis and arm (R-axis) allows horizontal movement. Horizontal and multi-joint type single arm robot Access to the inline 2 port layout cassettes without a track. By moving the direction of end-effector straightly to the horizontal cassettes, edge-grip type end-effector or square substrates can be applied. New Aligner SAL3000HV Series (full auto-adjustment version) Full auto-adjustment software "JEL ALIGN TOOL" allows automatic alignment for various kinds of wafers. Event Listings News Top SEMICON TAIWAN 2018 Our booth at SEMICON TAIWAN 2018 Twin arm robot with path planning handling Horizontal and multi-joint type single arm robot New Aligner SAL3000HV Series (full auto-adjustment version)
../company/fuku_map.html	und	1398671131	3715	https://www.jel-robot.com/company/fuku_map.html	Company | Detailed Map of Fukuyama Factory	Company | Detailed Map of Fukuyama Factory Home  >  Company  >  Fukuyama Factory  >  Detailed Map of Fukuyama Factory Detailed Map of Fukuyama Factory Fukuyama Factory 2-8-20, Kusado-cho, Fukuyama-city, Hiroshima, 720-0831 Japan Tel +81-84-932-6500 When you take a taxi, please tell the dvier to go to the Fukuyama Factory in Kusado-cho. Company TOP Contact Us Click here for general inquiries. Contact Information 
../products/BERNOULLI_CHUCK.html	und	1710468944	5714	https://www.jel-robot.com/products/BERNOULLI_CHUCK.html	Technical Information | The Mechanism of the Bernoulli Type End-Effector	Technical Information | The Mechanism of the Bernoulli Type End-Effector Home  >  Technical Information 縲� The Mechanism of the Bernoulli Type End-Effector The Mechanism of the Bernoulli Type End-Effector Air entered from the supply port generates the Cyclone effect. Supply air is discharged to the atmosphere between the suction surface and the wafer. As a result, an air layer is generated between the cyclone pad and the wafer, which enables to lift the wafer without contact. Characteristics Bernoulli pad type or Cyclone pad type is selectable depending on the wafer condition. Bernoulli pad type Low cost end-effector for thin or warped wafers Capable to handle various sizes or types of wafers Wafers can be lifted with low stress to minimize damage Thickness of the end-effector can be reduced Cyclone pad type Cyclone pads (Dia: 25mm; Thickness: 2.5mm) are used Capable to handle various sizes or types of wafers, and available for the Bernoulli type aligner Stronger holding of wafers compared to the Bernoulli type end-effector Model Click the product name or image below to go to the product page. Bernoulli Type End-Effector (Contact type) Bernoulli Type End-Effector (Non-contact type) Bernoulli HandRP-01, BRP-02� 繝サThe image above is of BRP-01 Feel free to contact us for custom design. 
../news/event2011_01.html	und	1710468633	5223	https://www.jel-robot.com/news/event2011_01.html	News | 3rd LED/OLED Lighting Technology Expo	News | 3rd LED/OLED Lighting Technology Expo Home  >  News  >  Event News  >  3rd LED/OLED Lighting Technology Expo 3rd LED/OLED Lighting Technology Expo Thank you for coming Lighting Japan (LED/OLED Lighting Technology Expo) . We exhibited our new products. For more product information, please go to the products page or contact us. Date : JAN.19,2011(Wed) - JAN.21,2011(Fri) Venue : Tokyo Big Sight, Japan Products for Exhibition SORTER SYSTEM (150mm) SORTER SYSTEM with small footprint especially designed for LED wafer handling small footprint. Vacuum robot & aligner for handling susceptor for LED wafer : SVCR3330S-060-PM & SVAL30D1 This robot & aligner is especially designed for handling susceptor in vacuum environment. It has twin end-effector and reduces the tack time. Robot & aligner for 2 to 4 inch wafers for LED : SSCR3115N-150-PM & SSCR2090S-PM & SAL3241GR This robot & aligner is especially designed for handling small wafers and has small footprint. There are armless type and link-arm type. Event Listings News Top SORTER SYSTEM (150mm) Vacuum robot & aligner for handling susceptor for LED wafer : SVCR3330S-060-PM & SVAL30D1 Robot & aligner for 2 to 4 inch wafers for LED : SSCR3115N-150-PM & SSCR2090S-PM & SAL3241GR 
../products/SVCR3160.html	und	1710468974	15713	https://www.jel-robot.com/products/SVCR3160.html	Products | SVCR3160 | Wafer Transfer Atmospheric Robot	Products | SVCR3160 | Wafer Transfer Atmospheric Robot Home 縲� Products 縲� 縲� Robot for Semiconductor SVCR3160 3-Axis Cylindrical Coordinate Clean Robot Product Video Usage Environment/Specifications Product Profile Model Name SVCR3160 Environment Vacuum (Temp. 15°C to 50°C) Driving unit咾lean room atmosphere  (Temp. 15°C to 40°C) Arm Single arm Operating Range 320mm (3rd joint center) Vertical Stroke 20mm / 40mm Payload Capacity 2kg (calculated for the arm 3rd joint) List of Product Model Product Model Vertical Stroke SVCR3160-020-PM 20mm SVCR3160-040-PM 40mm The image above and the video are of SVCR3260-040-PM. Characteristics Designed for handling wafers in the vacuum chamber of production line and inspection line. Double payload and superior cost performance compared to SVHR series. Compatible with SVHR series and it is possible to replace or upgrade into SVCR series. Magnetic fluid sealing is used for arm joint. Vacuum sealing: Magnetic fluid sealing and bellows are used. For cleanliness: 5µm mesh filter installed for exhaust ventilation in the arm. Motion monitoring is available. RS232C and parallel photo I/O are standard for control. 2-phase stepping motor installed in all axes. Servo motor type is available. High-speed, high-accuracy wafer handlingby S-curved speed control. Wafer holding: end-effector with passive edge or edge grip type End-effector. End-effector material: CFRP, Al, ceramic, or others. Optimal end-effector is selectable according to the carrying object and line layout. Standard Specifications Representative specifications of SVCR3160-020-PM. It can be changed depending on the carrying object and end-effector type. Specifications of Robot Robot Model SVCR3160-020-PM Carrying Object Wafer up to 300mm Wafer Holding Method By end-effector with passive edge or edge grip type end-effector Robot Model Type Cylindrical coordinate type Control Axis 3-axis Motor Type Stepping motor Operating Range 3rd joint center Rotation Angle (Theta-axis) Vertical Stroke (Z-axis) 320mm 330deg 20mm Carrying Speed Arm (R-axis) Rotation Angle (Theta-axis) Vertical Stroke (Z-axis) 300mm/sec 120deg/sec 20mm/sec Repeatability Within ±0.1mm Cleanliness Magnetic fluid sealing and filter Vacuum resistance 1.33×10 -6 Pa Mass Approx. 25kg Utility DC24V±10% 8A Specifications of Controller Controller Model C4000 series Interface RS232C and parallel photo I/O Outline Drawing (Standard) Option End-Effector *Click the items below to review the end-effectors other than JEL standard types. Other Option *The teaching box appeared in the table may be unavailable depending on the specifications. Product Lineup Menu Prev Next Icon guide ...Atmosphere ...Vacuum ...Waterproof ...Single arm ...Twin arm ...Thin wafer ...CE marking ...JEL's standard spec. ...KCs marking SVCR3260-040-PM SVCR3160-040-PM
../products/event2021_04b.html	und	1710468946	19807	https://www.jel-robot.com/products/event2021_04b.html	Products | GTFR5280 (For 300 mm wafer) | Wafer Transfer Atmospheric Robot	Products | GTFR5280 (For 300 mm wafer) | Wafer Transfer Atmospheric Robot Home 〉 Products 〉 〉 JEL dedicated website for SEMICON exhibition robots GTFR5280 (For 300 mm wafer) 5-Axis Horizontal and Multi-Joint Type Clean Robot Product Video Usage Environment/Specifications <img src="/products/img/e_marc.jpg" alt="Usage Environment/Specifications" " loading="lazy" style="width:100%;height:auto;" /> Product Profile Model Name GTFR5280 Environment Clean room atmosphere Arm Single arm Operating Range 553 mm (3rd joint center) Vertical Stroke 320 mm Payload Capacity Below 4kg (calculated for the arm 3rd joint) List of Product Model Product Model Vertical Stroke Standard GTFR5280-320-DM 320 mm The image above and the video are of GTFR5280-320-DM. Characteristics 5-Axis horizontal and multi-joint type clean robot for 300 mm wafer. A twin end-effector mounted on its single-arm has the same function as a twin-arm robot. Designed for handling wafers in EFEM. Compared to our conventional GTCR model, the cycle time is improved by reducing the operation prohibited area and the influence of speed limit. 3 FOUP access is available without a track. Twin end-effector reduces the wafer swap time. AC servo motors with absolute encoders installed in all axes. (Batteryless) Wafer holding: end-effector with vacuum suction, passive edge, edge grip. Optimal end-effector is selectable according to the carrying object and line layout. Standard Specifications Example of standard specifications with JEL standard end-effector (vacuum type) Specifications of Robot Robot Model GTFR5280-320-DM Carrying Object Up to 300 mm silicon wafer Wafer Holding Method By vacuum suction Robot Model Type Horizontal and multi-joint type Control Axis 5-axis Motor Type AC servo motor (Batteryless) Operating Range From the robot center to the wafer center Vertical Stroke (Z-axis)   893 mm 320 mm   Carrying Speed (Ave.) Arm (R-axis) Vertical Stroke (Z-axis)   900 mm/sec(when cylindrical operation) 320 mm/sec   Carrying Speed (Max.) Arm (R-axis) Vertical Stroke (Z-axis)   1,500 mm/sec(when cylindrical operation) 540 mm/sec   Repeatability Within ±0.05 mm Cleanliness ISO Class 1 Utility Power: AC200V Single phase ±10% 2 kVA; Vacuum: -75 kPa or more Mass Approx. 80 kg Outline Drawing (Standard) Option End-Effector Model Name Size of Carrying Object End-effector Type (Thickness) Wafer Holding Method SC-IW-200 3 inch, 100mm to 200mm I-shape (2mm) Vacuum suction SC-IW-240 3 inch, 100mm to 300mm I-shape (2mm) Vacuum suction SC-YW-200 100mm to 200mm Y-shape (2mm) Vacuum suction SC-YW-227 100mm to 300mm Y-shape (2mm) Vacuum suction SC-YW-240 100mm to 300mm Y-shape (2mm) Vacuum suction 3D-02229 150mm～300mm Y-shape (2mm) Vacuum suction SC3-YW-240 300mm Y-shape (3mm) Vacuum suction 3D-01661 300mm Y-shape (3mm) Vacuum suction SC3-IW-240 300mm I-shape (3mm) Vacuum suction *The table above shows the specifications of JEL standard end-effectors. The other specifications are available. *Click the items below to review the end-effectors other than JEL standard types. Other Option Product Lineup Menu Prev Next Icon guide ...Atmosphere ...Vacuum ...Waterproof ...Single end-effector ...Twin end-effector ...Thin wafer ...CE marking ...JEL's standard spec. ...KCs marking SEMICON TAIWAN 2021 title click here for GTFR details page click here for SAL-HV details page. click here for KHR details page. click here for STCR details page. click here for SAL details page. click here for MTCR details page. GTFR5280-320-DM Usage Environment/Specifications GTFR5280-320-DM click here for GTFR details page click here for SAL-HV details page. click here for KHR details page. click here for STCR details page. click here for SAL details page. click here for MTCR details page. SEMICON TAIWAN 2021 title
../products/STWCR4000.html	und	1710468973	14061	https://www.jel-robot.com/products/STWCR4000.html	Products | STWCR4160 (Waterproof) | Wafer Transfer Atmospheric Robot	Products | STWCR4160 (Waterproof) | Wafer Transfer Atmospheric Robot Home 縲� Products 縲� 縲� Robot for Semiconductor STWCR4160 (Waterproof) 4-Axis Cylindrical Coordinate Clean Robot Usage Environment/Specifications Product Profile Model Name STWCR4160 Environment Clean room atmosphere Arm Twin arm Operating Range 315 mm (3rd joint center) Vertical Stroke 300 mm Payload Capacity Below 3 kg (calculated for the arm 3rd joint) List of Product Model Product Model Vertical Stroke STWCR4160-300-PM 300 mm The image above is of STWCR4160-300-PM (Waterproof). Characteristics STWCR4000 series, 4-axis cylindrical coordinate clean robot (waterproof), is designed for handling wafers under the condition of acid or alkaline mist (IP64). Flip operation for 300 mm wafers with edge grip functions. Arm lineup: 160 mm, 200 mm Corrosion protection for arm by Teflon coating. V-type seals are used for waterproof of arm joint. Viton seals are used for parts joint. Bellows are used for waterproof of vertical axis. Twin-arm reduces the wafer swap time. Motion monitoring is available. RS232C and parallel photo I/O are standard for control. 2-phase stepping motor installed in all axes. High-speed, high-accuracy wafer handling by S-curved speed control. Wafer holding: end-effector with vacuum suction, passive edge, or edge grip type End-effector. End-effector is selectable according to the carrying object and line layout. Standard Specifications Example of standard specifications with edge grip type end-effector. Specifications of Robot Robot Model STWCR4160-300-PM Carrying Object Wafer up to 300mm Wafer Holding Method By vacuum suction Robot Model Type Cylindrical coordinate type Control Axis 4-axis Motor Type Stepping motor Operating Range From the robot center to the wafer center Rotation Angle (Theta-axis) Vertical Stroke (Z-axis) 315 mm 340 deg 300 mm Carrying Speed (Ave.) Arm (R-axis) Rotation Angle (Theta-axis) Vertical Stroke (Z-axis) 280 mm/sec 90 deg/sec 90 mm/sec Carrying Speed (Max.) Arm (R-axis) Rotation Angle (Theta-axis) Vertical Stroke (Z-axis) 550 mm/sec 120 deg/sec 120 mm/sec Resolution Arm (R-axis) Rotation Angle (Theta-axis) Vertical Stroke (Z-axis) Below 126 µm 0.0045 deg Below 6.25 µm Repeatability Within ±0.2 mm Utility Power: DC24V±10% 11A; Positive Pressure: 0.15 MPa Specifications of Controller Controller Model C4000 series Interface RS232C and parallel photo I/O Product Lineup Menu Prev Next Icon guide ...Atmosphere ...Vacuum ...Waterproof ...Single arm ...Twin arm ...Thin wafer ...CE marking ...JEL's standard spec. ...KCs marking STWCR4160-300-PM
../news/topics2013.html	und	1710468669	9031	https://www.jel-robot.com/news/topics2013.html	News | Topics 2013	News | Topics 2013 Home  &gt;  News  &gt;  2013 News 2013 December 19, 2013 New Products GCR4280-420-AM(For large diameter wafer/edge-grip end-effector) SAL30J1HV STCR4160SN(For wafer up to 300mm wafer) SAL3481HV(For 100 to 200mm wafer) SSY-10000(Table-top loader system for 100mm wafer) STCR4160SN(For thin wafer or wafer-edge hold) August 23, 2013 Products New Products Bernoulli Hand August 23, 2013 Technical Information We have updated the Technical Information page about Mechanism of Bernoulli End-Effector. April 2, 2013 Company We started operation of a solar power plant on March 22, 2013. April 1, 2013 News On April 1st, 2013, JEL entered our 20th year. We would like to express our appreciation of your support. January 24, 2013 Products New Products STCR4160S-300-PM (Handling susceptor/tray) Topic Listings News Top New products Products Mechanism of Bernoulli End-Effector Company News Products
../news/news20130718.html	und	1710468657	4107	https://www.jel-robot.com/news/news20130718.html	News | Summer Holiday Information	News | Summer Holiday Information Home  >  News  >  Summer Holiday Information Summer Holiday Information JEL will be closed for summer holiday from August 14th to August 18th, 2013 (Japan Time). In case of emergency, please contact us at the following e-mail address: News Topics 2014 2013 2012 2011 Event News 2014 2013 2012 2011 2010 2009 2008 
../news/topics2018.html	und	1710468670	13263	https://www.jel-robot.com/news/topics2018.html	News | Topics 2018	News | Topics 2018 Home  &gt;  News  &gt;  2018 News 2018 December 14, 2018 SEMICON JAPAN 2018 Thanks for coming to the exhibition. November 20, 2018 Relocation of the registered head office September 7, 2018 SEMICON TAIWAN 2018 Thanks for coming to the exhibition. June 8, 2018 Taiwan Branch was relocated on June 4, 2018 May 28, 2018 Beware of the products mistaken as JEL products April 12, 2018 We have updated the following 3D CAD drawings :   ツキ  SCR3130CS (Robot for handling wafer up to 300 mm)   ツキ  STCR4100S (Robot for handling wafer up to 300 mm)   ツキ  STCR4130S (Robot for handling wafer up to 300 mm)   ツキ  STCR4160SN (Closed-loop control)   ツキ  SCR3160CSN (Closed-loop control)   ツキ  GCR4210 (Stepping motor type)   ツキ  GTCR5280 (Robot for handling wafer up to 300 mm)   ツキ  MCR3200C (Robot for handling wafer up to 300 mm)   ツキ  MTCR4160 (Tape frame handling robot)   ツキ  MTCR4160L (Batch end-effector for 5 pieces of wafer)   ツキ  SVCR3160 (Vacuum robot for handling wafer up to 300 mm) April 2, 2018 25th Anniversary On April 1st, 2018, JEL celebrated its 25th anniversary. We would like to express our appreciation of your support. March 26, 2018 JEL Corporation established Korea Liaison Office in March 1, 2018. March 16, 2018 SEMICON CHINA 2018 Thanks for coming to the exhibition. March 1, 2018 JEL Corporation established Taiwan Branch in March 1, 2018. February 2, 2018 SEMICON KOREA 2018 Thanks for coming to the exhibition. News List News Top SEMICON JAPAN 2018 SEMICON TAIWAN 2018 Taiwan Branch 3D CAD繝繧ソ 25th Anniversary Korea Liaison Office SEMICON CHINA 2018 Taiwan Branch SEMICON KOREA 2018
../news/maintenance.html	und	1735261451	3038	https://www.jel-robot.com/news/maintenance.html	Privacy Policy	Privacy Policy Home  &gt;  Maintenance information Maintenance information The system is under construction from December 27th, 2024 to January 6th, 2025 (Japan Time). 
../term/term003_2.html	und	1710469241	8422	https://www.jel-robot.com/term/term003_2.html	Technical Information | Stepping Motor and Servo Motor | List of Servo Motor Products	Technical Information | Stepping Motor and Servo Motor | List of Servo Motor Products Home 縲� Technical Information 縲� Stepping Motor and Servo Motor 縲� List of Servo Motor Products List of Servo Motor Products In our product model name, 窶廣M窶� is added in the end for the robot using the servo motor . Model Name Arm/End-Effector Robot Model Type Motor Type Carrying Object GCR4210 (AC servo motor) Single arm 4-Axis Horizontal and Multi-Joint Type AC servo motor Up to 300mm silicon wafer GCR4280 (For 300mm wafer) Single arm 4-Axis Horizontal and Multi-Joint Type AC servo motor SEMI standard up to 300mm silicon wafer GTCR5280 (For 300mm wafer) Single arm 5-Axis Horizontal and Multi-Joint Type AC servo motor Up to 300mm silicon wafer GTFR5280 (For 300 mm wafer) Single arm 5-Axis Horizontal and Multi-Joint Type AC servo motor (Batteryless) Up to 300 mm silicon wafer GTVCR5330 Single arm 5-Axis Horizontal and Multi-Joint Type AC servo motor Wafer up to 300mm JCR4400 (Transfer Robot with Auto alignment for PLP) Single arm 4-Axis Horizontal and Multi-Joint Type AC servo motor Substrate 500 mm x 500 mm JVCR4330 (Horizontal and Multi-Joint Type Vacuum Robot for Micro LED) Single arm 4-Axis Horizontal and Multi-Joint Type AC servo motor 700 mm susceptors (10 kg) MCR3160C Single arm 3-Axis Cylindrical Coordinate AC servo motor Wafer up to 300mm MTCR4160 Twin arm 4-Axis Cylindrical Coordinate AC servo motor Wafer up to 300mm MTCR4200 Twin arm 4-Axis Cylindrical Coordinate AC servo motor Wafer up to 300mm STVCR4160 (Servo motor type) Twin arm 4-Axis Cylindrical Coordinate AC servo motor Wafer up to 300mm STVCR4190 (Servo motor with absolute encoder) Twin arm 4-Axis Cylindrical Coordinate AC servo motor Wafer up to 300mm  Click here for a list of stepping motor products. example of robot name
../news/event2012_01.html	und	1710468635	6016	https://www.jel-robot.com/news/event2012_01.html	News | 4th LED/OLED Lighting Technology Expo	News | 4th LED/OLED Lighting Technology Expo Home  >  News  >  Event News  >  4th LED/OLED Lighting Technology Expo 4th LED/OLED Lighting Technology Expo The 4th LED/OLED Lighting Technology Expo, held in Tokyo Big Sight from Jan.18 to 20, concluded with a great success. Thank you very much for coming to our booth! Date : JAN.18,2012(Wed) - JAN.20,2012(Fri) Venue : Tokyo Big Sight, Japan JEL booth No. : West Hall L1-4 Products for Exhibition Loader/Unloader System for Batch Processing of Susceptors or Trays : SSY-10020 Developed automatic loader/unloader system for batch processing such as susceptors or trays. JEL has proposed the most suitable system according to your concept and layout. End-Effector for Thin or Warped Wafer Developed low-cost type end-effector to meet the request of many customers. JEL has proposed the most suitable shape of end-effector according to your concept and layout. Super Compact Clean Robot & Aligner for Handling 2 inch-Wafer: SSCR3090S-150-PM/SAL2241 The world's top-class smallest & lightweight design. One aligner can handle 2-4-inch wafer alignment. Table-top Loader System : SSY-10000 Resolved the problems and issues caused by manual handling of wafers. Also improved product quality and yield ratio. Compact Clean Robot & Aligner for Handling 2-6-inch Wafer : SCR3100S-200-PM/SAL3261GR One robot and an aligner can handle 2-6-inch wafer, which offers small footprint. Event Listings News Top Loader/Unloader System for Batch Processing of Susceptors or Trays. : SSY-10020 End-Effector for Thin or Warped Wafer Super Compact Clean Robot & Aligner for Handling 2 inch-Wafer: SSCR3090S-150-PM/SAL2241 Table-top Loader System : SSY-10000 Compact Clean Robot & Aligner for Handling 2-6-inch Wafer : SCR3100S-200-PM/SAL3261GR
../products/SORTERSYSTEM_700_s.html	und	1710468969	12380	https://www.jel-robot.com/products/SORTERSYSTEM_700_s.html	Products | SORTER SYSTEM (4-port inline type with 600 wafers/h throughput)	Products | SORTER SYSTEM (4-port inline type with 600 wafers/h throughput) Home 縲� Products 縲� 縲� System SORTER SYSTEM (4-port inline type with 600 wafers/h throughput) Usage Environment/Specifications Product Profile Product Model SORTER SYSTEM Environment Clean room atmosphere Wafer Size 300mm Carrying Object Silicon wafer Contact us for the detailed specifications. Throughput 600 wafers/h The image above and the video are of SORTER SYSTEM (4-port inline type with 600 wafers/h throughput). Characteristics 4 FOUP access is available without a track by installing 2 sets of horizontal and multi-joint type robot and an aligner. Compliance : SEMI Standard (E15.1-0600, E57-0600, E62-0999, E63-0600, E64-0600) Aligner with buffer function is available for high-throughput (600 wafers/h). High-speed & high-accuracy wafer handling is available by area control. Wafer ID reader is available. (Reading both sides of wafer is an option) Standard Specifications Standard specifications for 4-port inline type with 600 wafers/h throughput (two sets of horizontal and multi-joint type robot) Carrier 300mm FOUP (for 25 wafers)   Compliance: SEMI E47.1, E62 Carrying Object 300mm Silicon wafer   (Thickness: 775µm) Throughput 600 wafers/h Cleanliness ISO Class 2 (when equipped with FFU) Dimension W 1233mm x D 2160mm x H 2000mm Mass Approx. 800kg Utility Power: AC200V Single phase ±15% 15A Dry air: 0.7MPa to 0.4MPa Vacuum: -60kPa or more Outline Drawing (Standard) Option Other Option *The teaching box appeared in the table may be unavailable depending on the specifications. Product Lineup Menu Prev Next Icon guide ...Atmosphere ...Vacuum ...Waterproof ...Thin wafer ...CE marking ...JEL's standard spec. ...KCs marking SORTER SYSTEM(600 wafers/h) SORTER SYSTEM (600/h)
../news/event2014_04.html	und	1710468639	7401	https://www.jel-robot.com/news/event2014_04.html	News | SEMICON Japan 2014	News | SEMICON Japan 2014 Home  >  News  >  Event News  >  SEMICON Japan 2014 SEMICON Japan 2014 Thank you very much for coming to our exhibition booth. For more information on our products as well as the exhibited products below, please go to the product page or contact us . Date: Dec. 3, 2014 Date: Wed., December 3 - Fri., December 5, 2014 Venue: Tokyo Big Sight, Japan JEL booth No.: East Exhibition Hall 4 4182 (Near the center of Hall 4) Products for Exhibition Automatic wafer transfer system for wafer container High accuracy handling of thin wafer inside the wafer container. Logger system Suitable for the verification of an error such as wafer breakage. Clean robot with batch end-effector for 5 pieces of wafer High-speed handling of cassette with different pitches for such as vertical furnace. Robots for handling 2 inch wafer Help to minimize transferring parts or vacuum transfer chamber. Robot for handling petri dishes Suitable for handling in sterile room, or clean environment used for medical and biotechnology applications. Event Listings News Top SEMICON Japan 2014 SEMICON Japan 2014 Wafer transfer system for wafer container Logger system Clean robot with batch end-effector for 5 pieces of wafer Smallest clean robot in the industry specialized for handling up to 2 inch wafer Robot for handling petri dishes
../support/often-4.html	und	1710469076	8231	https://www.jel-robot.com/support/often-4.html	Online Support | Frequently Asked Question: How to change speed parameters with commands? (Applicable models: SHR, STHR)	Online Support | Frequently Asked Question: How to change speed parameters with commands? (Applicable models: SHR, STHR) Home  >  Online Support  >  Frequently Asked Question  &gt;  Communication Software Communication Software Q: How to change speed parameters with commands? (Applicable models: SHR and STHR) A: 1. Confirming the communication establishment Turn on the controller. Connect the RS232C connector of the controller to the RS232C port of a PC using a RS232C straight cable. Start the software JELDATA3. Enter the following command in the lower part of the communication tab. Enter: $1 Response: &gt;$100 (OK) * No response (NG: Check the communication port of PC.) 2. Confirming and changing speed parameters Order: Specifying a motor axis Confirming a speed parameter Changing a speed parameter Confirming a speed parameter Table: Motor axis numbers and speed parameter commands Motor axis number 1 Arm 1 2 Theta 3 Arm 2 4 Z-axis Speed parameter command OH High speed parameter OL Low speed parameter OG Acceleration parameter OS S-curve acceleration/deceleration parameter OX Speed magnification parameter Specifying a motor axis Following command $1M, specify one of the axis numbers in the above table in X. Enter: $1M[X] Response: &gt; Confirming a speed parameter Following command $1, specify one of the speed parameter commands in the above table in XX. Enter: $1[XX] Response: &gt;$11[XXXXX] A 5-digit numeric value will be returned in XXXXX, following command $11. Changing a speed parameter Following command $1, specify one of the speed parameter commands in the above table in XX, and specify a change value in 5-digit numbers to be changed in XXXXX. Enter: $1[XX][XXXXX] Response: &gt; After changing a speed parameter, see step 2 “Confirming the speed parameter” to confirm whether the parameter is changed or not. 3. Writing speed parameters Specifying a motor axis Enter: $1DW Response: &gt;* Successful completion. Be sure not to turn the power off until an asterisk character ("*") is displayed.  List of FQA  Contact Us 
../news/event2016.html	und	1710468641	7228	https://www.jel-robot.com/news/event2016.html	News | Event News 2016	News | Event News 2016 Home  >  News  >  Event News  >  2016 Event News 2016 SEMICON JAPAN 2016 Date: December 14-16, 2016 Main exhibition machine type Robot with alignment function of mold (PLP) substrate Automatic wafer transfer system for wafer container New aligner SAL3000HV Series (full auto adjustment version)  Click here for details.   SEMICON TAIWAN 2016 Date: September 7-9, 2016 Main exhibition machine type Tape frame handling robot JEL ALIGN TOOL (Software for alignment adjustment)  Click here for details.   Int'l Smart Display & Touch Panel Exhibition 2016 Date: August 24-26, 2016 Main exhibition machine type Tape frame handling robot  Click here for details.   OPTO Taiwan 2016 Date: June 15-17, 2016  Click here for details.   SEMICON China 2016 Date: March 15-17, 2016 Main exhibition machine type Automatic wafer transfer system for wafer container Horizontal and multi-joint type robot with vertical strokes (DGCR) (Exhibited as reference) Tape frame handling robot Robot for handling 300mm wafer JEL ALIGN TOOL (Software for alignment adjustment)  Click here for details.   AUTOMATION WORLD 2016 (AIMEX) Date: March 9-11, 2016 Main exhibition machine type Twin arm robot with path planning handling Horizontal and multi-joint type single arm robot  Click here for details.   SEMICON Korea 2016 Date: January 27-29, 2016 Main exhibition machine type Horizontal and multi-joint type robot with vertical strokes (DGCR)(Exhibited as reference) Tape frame handling robot Bernoulli type end-effector and Bernoulli hand for thin or warped wafer  Click here for details.   8th Light-Tech Expo Date: January 13-15, 2016 Main exhibition machine type Horizontal and multi-joint type robot with vertical strokes (DGCR)(Exhibited as reference) Automatic wafer transfer system for wafer container Bernoulli type end-effector and Bernoulli hand for thin or warped wafer  Click here for details.   Event Listings News Top 
../news/event2018.html	und	1710468646	6189	https://www.jel-robot.com/news/event2018.html	News | Event News 2018	News | Event News 2018 Home  &gt;  News  &gt;  Event News  &gt;  2018 Event News 2018 SEMICON JAPAN 2018 Date: December 12 to 14, 2018 Main exhibition machine type Automatic wafer transfer system for wafer container Warped wafer aligner with auto-adjustment software  Click here for details.   SEMICON TAIWAN 2018 Date: September 5 to 7, 2018 Main exhibition machine type Twin arm robot with path planning handling Horizontal and multi-joint type single arm robot New Aligner SAL3000HV Series (full auto-adjustment version)  Click here for details.   SEMICON CHINA 2018 Date: March 14 to 16, 2018 Main exhibition machine type Twin arm robot with path planning handling Horizontal and multi-joint type single arm robot New Aligner SAL3000HV Series (full auto-adjustment version)  Click here for details.   SEMICON KOREA 2018 Date: January 31 to February 2, 2018 Main exhibition machine type Horizontal and multi-joint type twin-arm robot: GTCR5280 New Aligner SAL3000HV Series (full auto-adjustment version)  Click here for details.   Event Listings News Top 
../news/news20241122.html	und	1732236958	3717	https://www.jel-robot.com/news/news20241122.html	News | New Year's Holiday Information	News | New Year's Holiday Information Home  &gt;  News  &gt;  New Year's Holiday Information New Year's Holiday Information JEL will be closed for New Year's holiday from December 28th, 2024 to January 5th, 2025 (Japan Time). In case of emergency, please contact us at the following e-mail address: 
../products/promo02.html	und	1710468961	8233	https://www.jel-robot.com/products/promo02.html	Products | 3D CAD Date	Products | 3D CAD Date Home  >  Products  >  Product News  >  3D CAD Drawings 3D CAD Drawings Available Online Your browser does not support the video. See below for browser recommendations. IE Chrome Firefox Safari 9.0 or more 4.0 or more 3.5 or more 4.0 or more We have opened online 3D CAD drawings of our robots for your reference. File Format IGES / STEP / Parasolid / ACIS(SAT) For download, 4 files above are included in a zip file. Precautions for Using CAD Drawings Please use this CAD drawings for the purpose of using or installing our products. This CAD drawings are for using or installing our products only. Do not use for improper purposes such as production of copies. This CAD drawings do not guarantee the specification of our products. For the detailed specification, please contact our sales representative. This CAD drawings are subject to change without notice due to product improvement. Drawings Available 
../products/LTHR4400C.html	und	1710468957	16038	https://www.jel-robot.com/products/LTHR4400C.html	Products | LTHR4400C (FPD glass substrate) | FPD glass substrate transfer robot	Products | LTHR4400C (FPD glass substrate) | FPD glass substrate transfer robot Home 縲� Products 縲� 縲� Robot for FPD LTHR4400C (FPD glass substrate) 4-Axis Cylindrical Coordinate Clean Robot Usage Environment/Specifications Product Profile Model Name LTHR4400C Environment Clean room atmosphere (Temp. 15°C to 40°C) *Vacuum robot:vacuum chamber temp. 15°C to 50°C or less Arm Twin arm Operating Range 1550mm (From robot center to substrate center) Vertical Stroke 400mm / 500mm / 600mm 760mm / 900mm Payload Capacity Below 15kg (calculated for the arm 3rd joint) List of Product Model Product Model Vertical Stroke LTHR4400C-400-AM 400mm LTHR4400C-500-AM 500mm LTHR4400C-600-AM 600mm LTHR4400C-760-AM 760mm LTHR4400C-900-AM 900mm The image above is of LTHR4400C-600-AM (Z-axis of 760mm and longer are telescope type and different from the image). Characteristics Designed for handling FPD substrate in a PFD production line or inspection line. Telescope type is available for 760mm or longer Z-axis, which allows the low-passline. Execution of origin search is not required by using the servo motors with absolute encoders. Arm lineup: 400mm, 500mm Twin-arm reduces the tact time. Base or flange mounting type is selectable. RS232C and parallel photo I/O are standard for control. AC servo motors with absolute encoders installed in all axes. High-speed, high-accuracy glass handling by S-curved speed control. Wafer holding: end-effector with vacuum suction, passive edge, edge grip, or Bernoulli type End-effector End-effector material: CFRP, Al, ceramic, or others. Sensors (for alignment, substrate existence detection, mapping) can be installed in the end-effector. Optimal end-effector is selectable according to the carrying object and line layout. Standard Specifications Representative specifications of LTHR4400C-600-AM. It can be changed depending on the carrying object and end-effector type. Specifications of Robot Robot Model LTHR4400C-600-AM Carrying Object 730mm×920mm×1.1mm FPD glass substrate(representative example) Robot Model Type Cylindrical coordinate type Control Axis 4-axis Motor Type AC servo motor Operating Range From robot center to substrate center Rotation Angle (Theta-axis) Vertical Stroke (Z-axis) 1550mm 330deg 600mm Carrying Speed (Ave.) Arm (R-axis) Rotation Angle (Theta-axis) Vertical Stroke (Z-axis) 1375mm/1.8sec 180deg/1.8sec 600mm/1.7sec Resolution Arm (R-axis) Rotation Angle (Theta-axis) Vertical Stroke (Z-axis) Below 8.20µm 0.0008deg 2.4µm Handling level 271mm (Mounting level to upper end-effector level Repeatability Within ±0.2mm Cleanliness 0.3µm/cf Class 10 (at transfer level when exhausting driving) Utility Power: AC200V 3-phase ±10% 3kVA; Vacuum: -73kPa or more Outline Drawing (Standard) Option End-Effector *Click the items below to review the end-effectors other than JEL standard types. Other Option Product Lineup Menu Prev Next Icon guide ...Atmosphere ...Vacuum ...Waterproof ...Single arm ...Twin arm ...Thin wafer ...CE marking ...JEL's standard spec. ...KCs marking LTHR4400C-600-AM LTHR4400C-600-AM
../products/LVHR3440S.html	und	1710468957	16203	https://www.jel-robot.com/products/LVHR3440S.html	Products | LVHR3440S (FPD glass substrate) | FPD glass substrate transfer robot	Products | LVHR3440S (FPD glass substrate) | FPD glass substrate transfer robot Home 縲� Products 縲� 縲� Robot for FPD LVHR3440S (FPD glass substrate) 3-Axis Cylindrical Coordinate Clean Robot Usage Environment/Specifications Product Profile Model Name LVHR3440S Environment Clean room atmosphere (Temp. 15°C to 40°C) *Vacuum robot:vacuum chamber temp. 15°C to 50°C or less Arm Single arm Operating Range 880mm (3rd joint center) Vertical Stroke 20mm/ 32mm/ 40mm/ 60mm/ 320mm Payload Capacity Below 10kg (calculated for the arm 3rd joint) List of Product Model Product Model Vertical Stroke LVHR3440S-020-SM 20mm LVHR3440S-032-SM 32mm LVHR3440S-040-SM 40mm LVHR3440S-060-SM 60mm LVHR3440S-320-SM 320mm The image above is of LVHR3440S-040-SM. Characteristics Designed for handling FPD substrate in a PFD production line or inspection line. Arm lineup: 330mm, 440mm, 500mm, 550mm Magnetic fluid sealing are used for arm joint. Vacuum sealing: Magnetic fluid sealing and bellows are used. For cleanliness: 5µm mesh filter installed for exhaust ventilation in the arm. Motion monitoring is available. RS232C and parallel photo I/O are standard for control. AC servo motors with absolute encoders installed in all axes. High-speed, high-accuracy glass handling by S-curved speed control. Wafer holding: end-effector with vacuum suction, passive edge, edge grip, or Bernoulli type End-effector End-effector material: CFRP, Al, ceramic, or others. Optimal end-effector is selectable according to the carrying object and line layout. Standard Specifications Representative specifications of LVHR3440S-040-SM. It can be changed depending on the carrying object and end-effector type. Specifications of Robot Robot Model LVHR3440S-040-SM Carrying Object 730mm×920mm×1.1mm FPD glass substrate(representative example) Robot Model Type Cylindrical coordinate type Control Axis 3-axis Motor Type AC servo motor Operating Range 3rd joint center Rotation Angle (Theta-axis) Vertical Stroke (Z-axis) 880mm ±182deg 40mm Carrying Speed (Ave.) Arm (R-axis) Rotation Angle (Theta-axis) Vertical Stroke (Z-axis) 1320mm/2.7sec 180deg/1.8sec 40mm/2.0sec Resolution Arm (R-axis) Rotation Angle (Theta-axis) Vertical Stroke (Z-axis) Below 13.5µm 0.00097deg 0.61µm Handling level 168.5mm (Mounting level to upper end-effector level Repeatability Within ±0.2mm Cleanliness Magnetic fluid sealing and filter Utility Power: AC200V single phase ±10% 2kVA Outline Drawing (Standard) Option End-Effector *Click the items below to review the end-effectors other than JEL standard types. Other Option Product Lineup Menu Prev Next Icon guide ...Atmosphere ...Vacuum ...Waterproof ...Single arm ...Twin arm ...Thin wafer ...CE marking ...JEL's standard spec. ...KCs marking LVHR3440S-040-SM LVHR3440S-040-SM
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../products/SSY-10010.html	und	1710468970	14569	https://www.jel-robot.com/products/SSY-10010.html	Products | SSY-10010 (Automatic wafer transfer system for wafer container)	Products | SSY-10010 (Automatic wafer transfer system for wafer container) Home 〉 Products 〉 〉 System SSY-10010 Automatic wafer transfer system for wafer container Product Video Usage Environment/Specifications Product Profile Product Model SSY-10010 Environment Clean room atmosphere Applicable Cassette Type 200 mm container, 200 mm wafer cassette Wafer Size 200 mm Carrying Object Silicon wafer, spacer (interlayer paper) Contact us for other wafer sizes, the number of wafer containers and cassettes, or aligner installation. Also contact us for wafer containers from any manufacturer. The image and video above is of SSY-10010. Characteristics High accuracy transport of thin wafer inside the wafer container. Automatic wafer transfer between the wafer container and the wafer cassette. Available for thin wafer as equipped with Bernoulli end-effector. Automatic recognition of wafer and the spacer (interlayer paper). Automatic recognition of the height of wafer. The number of cassettes and the wafer sizes can be customized. Equipped with mechanism of automatic lid opening/closing of the wafer container. (Patent pending) Corresponding to the wafer container made by Achilles Corporation. Fan filter units (HEPA) are installed to ensure the cleanliness. Color sensor allows spacers (interlayer papers) with different colors to be detected easily. (Please contact us in advance.) Standard Specifications Contact us for other wafer sizes, the number of wafer containers and cassettes, or aligner installation etc. Carrying Object 200 mm silicon wafer, 200 mm spacer (interlayer paper) Applicable Cassette Type 200 mm wafer container, 200 mm cassette Cleanliness ISO Class 2 External Dimensions 1100 (W) x 980 (D) x 1805 (H) (mm) Utility Power: AC200V±10%  Dry clean air: 0.5 MPa 250 NL/min or more Mass 600 kg Outline Drawing (Standard) Product Lineup Menu Prev Next Icon guide ...Atmosphere ...Vacuum ...Waterproof ...Thin wafer ...CE marking ...JEL's standard spec. ...KCs marking SSY-10010 (Automatic wafer transfer system for wafer container) SSY-10010
../products/SORTERSYSTEM_400_2_s.html	und	1710468968	12442	https://www.jel-robot.com/products/SORTERSYSTEM_400_2_s.html	Products | SORTER SYSTEM (4-port facing type with 400 wafers/h throughput)	Products | SORTER SYSTEM (4-port facing type with 400 wafers/h throughput) Home 縲� Products 縲� 縲� System SORTER SYSTEM (4-port facing type with 400 wafers/h throughput) Usage Environment/Specifications Product Profile Product Model SORTER SYSTEM Environment Clean room atmosphere Wafer Size 300mm Carrying Object Silicon wafer Contact us for the detailed specifications. Throughput 400 wafers/h The image above and the video are of SORTER SYSTEM (4-port facing type with 400 wafers/h throughput). Characteristics Compliance : SEMI Standard (E15.1-0600, E57-0600, E62-0999, E63-0600, E64-0600) Aligner with buffer function is available for high-throughput. Access to the inline layout cassettes is available without a track by installing path-planning software. High-speed & high-accuracy wafer handling is available by area control. Wafer ID reader is available. (Reading both sides of wafer is an option) Standard Specifications Standard specifications with 4-port facing type with 400 wafers/h throughput Carrier 300mm FOUP (for 25 wafers)   Compliance: SEMI E47.1, E62 Carrying Object 300mm Silicon wafer   (Thickness: 775 µm) Throughput 400 wafers/h Cleanliness ISO Class 2 (when equipped with FFU) Dimension W 1756mm x D 1200mm x H 1901mm Mass Approx. 600kg Utility Power: AC200V Single phase ±15% 20A Dry air: 0.7MPa to 0.4MPa Vacuum: -60kPa or more Outline Drawing (Standard) Option Other Option *The teaching box appeared in the table may be unavailable depending on the specifications. Product Lineup Menu Prev Next Icon guide ...Atmosphere ...Vacuum ...Waterproof ...Thin wafer ...CE marking ...JEL's standard spec. ...KCs marking SORTER SYSTEM (400 wafers/h) SORTER SYSTEM (400/h)
../support/man002/s005.html	und	1710469131	4638	https://www.jel-robot.com/support/man002/s005.html	Online Support | JELDATA3 Operation Manual | Data initialization	Online Support | JELDATA3 Operation Manual | Data initialization Home  >  Online Support  >  Wafer-Search Operation Procedure and Troubleshooting  >  JELDATA3 Operation Manual 縲� 8. Setup JELDATA3 Operation Manual 8. Setup 8.2 Data initialization (Figure: 8-3) It is for initializing the application data. It is not necessary to execute this function from the menu bar. It will be automatically executed every time the software is started and at the controller setting. Execute if the initialization is necessary after starting the application. While executing, the progress is shown on the status bar.� Figure: 8-4 ) (Figure: 8-4) Contents 竊殖ack Next竊�  Technical Information data initialization status bar
../support/man001/w002.html	und	1710469104	5815	https://www.jel-robot.com/support/man001/w002.html	Online Support | 2: Setting of the highest slot of the cassette (WHI setting)	Online Support | 2: Setting of the highest slot of the cassette (WHI setting) Home  >  Online Support  >  Manuals/Troubleshooting  >  Wafer-Search Operation Procedure and Troubleshooting  >  2: Setting of the highest slot of the cassette (WHI setting) Wafer-Search Operation Procedure 2: Setting of the highest slot of the cassette (WHI setting) 縲�1縲� Teach the robot the position where a wafer in the highest slot is detected. 縲�2縲� After moving the robot, press the dot button on the teaching box to turn on the light source of a wafer search sensor. *The procedure varies depending on specifications. For details, please refer to the instruction manual. 縲�3縲� With the teaching box, check the Z-axis value of the center of wafer thickness in the highest slot (see Figure 1) and set the value (see Figure 2). 縲�4縲� Set the position data via serial communication. Input the following commands for configuration: (When the robot is $1, the commands are: $1WHI ****)  Input the Z-axis value displayed in the teaching box in "DEC". Obtain the current designated data Data to be set Figure 1 Figure 2 Contents Back Next  Technical Information teaching position display of teaching box
../news/event2017_06.html	und	1710468645	8850	https://www.jel-robot.com/news/event2017_06.html	News | SEMICON JAPAN 2017	News | SEMICON JAPAN 2017 Home  >  News  >  Event News  >  SEMICON JAPAN 2017 SEMICON JAPAN 2017 Thank you very much for coming to our exhibition booth. For more information on our products as well as the exhibited products below, please go to the product page or contact us . Date   Wed., December 13 - Fri., December 15, 2017 Venue Tokyo Big Sight, Japan Booth East Exhibition Hall 4 4835 (Located between Hall 4 and Hall 5.) Access Map & Floor Plan  Products for Exhibition  JEL booth in Semicon Japan 2017 Access Map & Floor Plan Products for Exhibition ■Automatic wafer transfer system for wafer container (SSY) ■Tape frame handling robot (MTCR) ■Robot with substrate alignment function (JCR) ■New aligner with full auto-adjustment tool (SAL3000HV Series) ■Vacuum robot (Reference exhibit) Event Listings News Top SEMICON JAPAN 2017 logo JEL booth at the exhibition SEMICON JAPAN 2017 booth map
../news/news20221129.html	und	1710468667	3717	https://www.jel-robot.com/news/news20221129.html	News | New Year's Holiday Information	News | New Year's Holiday Information Home  &gt;  News  &gt;  New Year's Holiday Information New Year's Holiday Information JEL will be closed for New Year's holiday from December 29th, 2022 to January 4th, 2023 (Japan Time). In case of emergency, please contact us at the following e-mail address: 
../site/sitemap.html	und	1736131063	6764	https://www.jel-robot.com/site/sitemap.html	Site Map	Site Map Site Map Home Products Robot for Semiconductor Aligner Robot for FPD System Bernoulli Hand End-Effector Robot for Petri Dish/Microplate Product Lineup Introduction Video of Handling Product News Product Search Online Support Manuals/Troubleshooting Frequently Asked Question JEL窶冱 Various Software Notification Overhaul and Repair Training Information Company Profile History Results Tokyo Branch Head Office Saba Factory JEL Kochi JEL (Shanghai) Robotics Co., Ltd. Korea Branch JEL (Changzhou) Robotics Technology Co., Ltd. Overseas Contact Saving Energy Download company profile and product catalog Employment Contact Us Support Contact (Overseas) Service Request Form Contact Information Inquiry Form Technical Information Sizes and Standards News Topics Event News Privacy Policy Site Search 
../news/news20180401.html	und	1710468662	3938	https://www.jel-robot.com/news/news20180401.html	News | 25th Anniversary	News | 25th Anniversary Home  &gt;  News  &gt;  25th Anniversary 25th Anniversary Celebrating JEL Corporation’s 25th Anniversary Founded in April 1993, JEL celebrated its 25th anniversary on April 1st, 2018. We would like to express our appreciation of your support. Since the foundation, JEL as a manufacturer of clean robot for semiconductors and FPD glass substrates, has provided products to meet customers' needs. Setting a goal of “Leading Manufacturer of Clean Robot”, JEL will continue to make better products with and for our customers. 25th Anniversary
../support/support07.html	und	1710469080	3685	https://www.jel-robot.com/support/support07.html	Online Support | Notification	Online Support | Notification Home  >  Online Support  >  Notification Notification Change of JEL窶冱 Warranty Period Robot Equipped with Backup Battery Discontinued Products  Technical Information 
../news/event2024_05.html	und	1736909306	9587	https://www.jel-robot.com/news/event2024_05.html	News | SEMICON JAPAN 2024	News | SEMICON JAPAN 2024 Home  &gt;  News  &gt;  Event News  &gt;  SEMICON JAPAN 2024 SEMICON JAPAN 2024 Thank you very much for coming to our exhibition booth. For more information on our products as well as the exhibited products below, please go to the product page or contact us . Date   Wed., December 11 to 13, 2024 Venue Tokyo Big Sight, Japan Booth East Exhibition Hall 6 6136 Access Map & Floor Plan  Products for Exhibition  JEL booth in SEMICON JAPAN 2024 Access Map & Floor Plan Products for Exhibition ■JFR -PLP Transfer Robot- ■STVCR -Vacuum Wafer Transfer Robot- ■SSY -EFEM with φ300 mm- ■SAL-HV -High Accuracy Pre-Aligner- Event Listings News Top SEMICON JAPAN 2024 logo JEL booth at the exhibition SEMICON JAPAN 2024 booth map
../index.html	und	1743469500	13986	https://www.jel-robot.com/index.html	JEL Corporation | Wafer Transfer Robot for Semiconductor Manufacturing	JEL Corporation | Wafer Transfer Robot for Semiconductor Manufacturing Latest News News List Company News Company Profile Contact Us Head Office  TEL: +81-84-932-6500 Contact Information Tokyo Branch  Watch our product lineup ! (English subtitle) SAL20C1 JCR4400 GTFR5280 Multi work aligner 3-Axis Cylindrical Coordinate Clean Robot ISO certification Beware of the products mistaken as JEL products JEL products video JEL products video thumbnail replay Frequently Asked Questions JEL Approach to cleanliness JEL Head Office contact Hine contact AES motomation Inc. contact AES motomation GmbH contact
../term/term003.html	und	1710469240	8141	https://www.jel-robot.com/term/term003.html	Technical Information | Stepping Motor and Servo Motor	Technical Information | Stepping Motor and Servo Motor Home 縲� Technical Information 縲� Stepping Motor and Servo Motor Stepping Motor and Servo Motor Stepping motor and servo motor are used for the drive motor of our robot. Stepping motor is mainly used for robot for semiconductor: SCR3000 series, STCR4000 series, or GCR4000-PM series, while servo motor is mainly used for MCR3000 and 4000 series, GCR4000-AM series, or GTCR5000-AM series. Servo motor is also used for robot for semiconductor depending on the size of carrying object or handling method.In our product model name, 窶弃M窶� is added in the end for the robot using the stepping motor and the servo motor as 窶廣M窶�.  Click here for a list of stepping motor products.  Click here for a list of servo motor products. Stepping motor What is stepping motor? Stepping motor is also referred to as pulse motor. In response to pulse signals that are input to motor driver (the device that drives and controls the motor), the rotation-axis of motor rotates. Mechanism of stepping motor The angle of rotating axis for 1-pulse input of stepping motor is determined. If rotating the stepping motor 90 degrees with rotation of 0.72 degrees for 1 pulse, signals of 125 pulses will be input. The speed of motor rotation is proportional to the speed of pulse signals (pulse frequency). The higher the frequency, the faster the motor rotation speed is and the lower the frequency, the lower the motor rotation speed is. Characteristics of stepping motor 1. Torque is maximum at dwell time. 2. Widely covering rigidity of mechanical parts. 3. Mechanically simple and reasonably priced.  Click here for a list of stepping motor products. Servo motor What is servo motor? For servo motor, the rotation-axis/rotation speed of the motor drive are detected with rotation detection device (encoder) and fed back to the motor driver. The servo motor controls so that the difference between the feedback and control information that have been previously input to motor driver are zero. Servo motor also can give more careful control than stepping motor and maintain high torque during high speed rotation. Characteristics of servo motor 1. Suitable for long distance handling or when high-speed and high-torque are required. 2. More expensive compared to stepping motor as the encoder device is required for motor control.  Click here for a list of servo motor products. example of robot name mechanism of stepping motor mechanism of stepping motor motor frequencies mechanism of servo motor
../support/man001/t001.html	und	1710469100	4379	https://www.jel-robot.com/support/man001/t001.html	Online Support |1: Wafer-search sensor does not respond. 	Online Support |1: Wafer-search sensor does not respond. Home  >  Online Support  >  Manuals/Troubleshooting  >  Wafer-Search Operation Procedure and Troubleshooting  >  1: Wafer-search sensor does not respond. Troubleshooting of Wafer Search Operation 1: Wafer-search sensor does not respond. Contents Next  Technical Information trouble shooting when wafer-search sensor does not respond. Wafer Search Operation Procedure
../support/man001/w010.html	und	1710469106	4758	https://www.jel-robot.com/support/man001/w010.html	Online Support | 10: Execution of wafer-search	Online Support | 10: Execution of wafer-search Home  >  Online Support  >  Manuals/Troubleshooting  >  Wafer-Search Operation Procedure and Troubleshooting  >  10: Execution of wafer search Wafer-Search Operation Procedure 10: Execution of wafer-search Before executing the start position of wafer-search, make sure that the robot is in the start position of wafer-search. Execute wafer-search via serial communication. Input the following commands for configuration: This operation turns on the wafer detection sensor which executes wafer-search. This operation executes the performance of wafer detection only . Contents Back Next  Technical Information 
../products/SSY-10010_s.html	und	1710468970	14721	https://www.jel-robot.com/products/SSY-10010_s.html	Products | SORTER SYSTEM (150mm)	Products | SORTER SYSTEM (150mm) Home 縲� Products 縲� 縲� System SORTER SYSTEM 150mm Product Video Usage Environment/Specifications Product Profile Product Model SORTER SYSTEM Environment Clean room atmosphere Wafer Size 150mm Carrying Object Glass, Sapphire, GaAs wafer Contact us for the detailed specifications. Throughput 140 wafer/h (Process time excluded) The image above and the video are of SORTER SYSTEM for 150mm. Characteristics Access to 4 cassettes is available without a track by the horizontal and multi-joint type robot (GCR4210-500-AM). 500mm Z-stroke can access the vertically-setting cassettes. Flip unit of robot can handle wafers without contacting process side. Mapping sensor is installed to the wrist-block unit. Open/Close detection sensor is installed to the door and locked during operation. Aligner (SAL3361GR) for glass wafer is installed. Communication with users' system can be changed. Customization is available according to user's needs. Standard Specifications Carrying Object 150mm wafer (Glass, Sapphire, GaAs) Throughput 140 wafer/h (Process time in the system is not included) &lt;GCR4210-500-AM&gt; Operating range From the robot center to the wafer center Rotation Angle (Theta-axis) Vertical Stroke (Z-axis) Flip axis 672mm 335deg 500mm 180deg Carrying Speed (Ave.) Arm (R-axis) Rotation Angle (Theta-axis) Vertical Stroke (Z-axis) 550mm/sec 300deg/sec 300mm/sec Carrying Speed (Max.) Arm (R-axis) Rotation Angle (θ-axis) Vertical Stroke (Z-axis) 900mm/sec 400deg/sec 450mm/sec Carrying Speed (w/o flip unit) Arm (R-axis) Rotation Angle (θ-axis) Vertical Stroke (Z-axis) 1800mm/sec 540deg/sec 500mm/sec Repeatability Within ±0.1mm &lt;SAL3361GR&gt; Positioning accuracy Centering: Within ±0.2mm  Flat locating: Within±0.2deg Positioning time Notch search: Within 3 sec (Pick-up/placing time is not included.) Positioning correction range Within 4mm radius &lt;System&gt; Wafer holding method By vacuum suction with end-effector Cleanliness ISO Class 2 (ISO14644) Footprint 640mmテ�835mm (Excluding touch panel) Mass Approx. 350kg Utility Power哂C200V Single phase 15A   Vacuum: -53kPa or more (w/vacuum type end effector) Outline Drawing (Standard) Option Other Option *The teaching box appeared in the table may be unavailable depending on the specifications. Product Lineup Menu Prev Next Icon guide ...Atmosphere ...Vacuum ...Waterproof ...Thin wafer ...CE marking ...JEL's standard spec. ...KCs marking SORTER SYSTEM for 150mm SORTER SYSTEM for 150mm
../news/news20150414.html	und	1710468659	3557	https://www.jel-robot.com/news/news20150414.html	News | 2015 Japanese Holiday Week Information	News | 2015 Japanese Holiday Week Information Home  >  News  >  Japanese Holiday Week Information Japanese Holiday Week Information JEL will be closed for Japanese holiday week, "Golden Week" Holidays; April 25th, 26th, 29th (Japan Time) May 2nd to 6th (Japan Time) In case of emergency, please contact us at the following e-mail address: 
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../products/prd_result3.html	und	1710468960	10065	https://www.jel-robot.com/products/prd_result3.html	Products | Robot for FPD	Products | Robot for FPD HOME  >  Products  >  Robot for FPD Robot for FPD Search for Environment Atmosphere Vacuum Show all Arm Single arm Twin arm Show all Data processing Click the product image or name to go to the product page. Product News 3D CAD Drawings Contact Us Technical Information Products Menu 
../products/handling_7.html	und	1710468953	5717	https://www.jel-robot.com/products/handling_7.html	Products | Introduction Video of Handling (Susceptor/Tray Handling)	Products | Introduction Video of Handling (Susceptor/Tray Handling) Home  >  Products  >  Introduction Video of Handling  >  Susceptor/Tray Handling Introduction Video of Handling Susceptor/Tray Handling STCR4160S (susceptor/tray handling)： Designed for handling susceptor/tray used for LED processing system. Wafer taken out of a cassette is transferred to the susceptor/tray, which can be automatically transferred to the system by combining with SSY-10020 . *Also available for vacuum robot: SVCR3330S (susceptor/tray handling) . Video List Previous Video Next Video YouTube Official Channel
../news/news20170502.html	und	1710468661	4360	https://www.jel-robot.com/news/news20170502.html	News | Relocation of Tokyo Branch	News | Relocation of Tokyo Branch Home  >  News  >  Relocation of Tokyo Branch Relocation of Tokyo Branch Our Tokyo branch will be relocated to the following address on May 22, 2017. A showroom for demonstration is on the first floor and the office is on the second floor. 1. New Address Kanda Bundo Building 2F, 4-18, Kandasakuma-cho, Chiyoda-ku, Tokyo, 101-0025 Japan (A showroom is on the first floor. Take the elevator to the 2nd floor.) (There is no change on telephone & fax number.) 2. Last business day at the current location May 19, 2017 3. First business day at the new location May 22, 2017 map of Tokyo branch
../company/energy-saving.html	und	1710468468	5628	https://www.jel-robot.com/company/energy-saving.html	Company | Saving Energy	Company | Saving Energy Home  &gt;  Company  &gt;  Saving Energy Efforts in Saving Energy JEL has been actively involved in energy saving efforts with consideration for the domestic energy situation. We remove unnecessary fluorescent lights. We turn out all the lights during break time. We set up lighting windows in a roof and turn off a light. We have a light-out-switch that turns off all the lights at once and we do not fail to turn off the lights. We set up all the computer we use in the company at an energy-saving setting. We turn off the computer monitor when we leave our desk. We carry out afforestation around a company building to reduce the heat-island effect. We are wearing polo shirts in the office during summer for "Cool Biz窶�, energy-saving campaign. We use groundwater and sprinkle water around the building during summer. We make a thorough effort not to do overtime work and to use all the paid holidays and vacation time. We started operation of a solar power plant to promote clean energy. ( JEL Kohci:0.5 megawatt solar power plant ; Head Office:51.2 kilowatt solar power plant � March 22, 2013 JEL Corporation Company TOP balcony at JEL Kochi energy-saving efforts of JEL
../news/news20180717.html	und	1710468663	3500	https://www.jel-robot.com/news/news20180717.html	News | Summer Holiday Information 2018	News | Summer Holiday Information 2018 Home  &gt;  News  &gt;  Summer Holiday Information Summer Holiday Information JEL will be closed for summer holiday from August 11th to August 15th, 2018 (Japan Time). In case of emergency, please contact us at the following e-mail address: 
../products/SARS08603.html	und	1710468963	10860	https://www.jel-robot.com/products/SARS08603.html	Products | SARS08603 (Wrist-block unit with mapping sensor)	Products | SARS08603 (Wrist-block unit with mapping sensor) Home  >  Products  >  縲� Others SARS08603 Wrist-block unit with mapping sensor Usage Environment/Specifications Product Profile Model Name SARS08603 Appropriate robot model SCR series Characteristics Designed for checking the wafer state in cassette. Also available for sorter system. Wrist-block unit with mapping sensor (*) for SCR series Standard end-effectors (6 types) are available for this wrist-block (refer to the following table). (*) Mapping sensor is to detect wafer presence and status in each cassette slot. Standard end-effectors available for the wrist-block Click the product image or name below to go to the product page. SC-IW-200 SC-IW-240 SC3-IW-240 SC-YW-227 SC-YW-200 3D-02229 Specifications Contact us for the detailed specifications. Product Lineup Menu Prev Next Icon guide ...Atmosphere ...Vacuum ...Waterproof ...Single arm ...Twin arm ...Thin wafer ...CE marking ...JEL's standard spec. ...KCs marking 
../inquiry/mailformpro/data/request/index.html	und	1480331479	0	https://www.jel-robot.com/inquiry/mailformpro/data/request/index.html		
../company/kochivisit.html	und	1710468471	5585	https://www.jel-robot.com/company/kochivisit.html	Company | Extension Building Tour 	Company | Extension Building Tour Home  &gt;  Company  &gt;  JEL Kochi  &gt;  Extension Building Tour Extension Building Tour Video Introduction Stock Room(1F) Introduction Extension Building Appearance縲�縲�縲�縲�縲� Stock Room(1F) Stock Room(2F) Break Room(2F) Company TOP Extension Building Appearance Stock Room(1F) Stock Room(2F) Break Room(2F)
../support/man001/t002.html	und	1710469100	5780	https://www.jel-robot.com/support/man001/t002.html	Online Support |2: Error “E08” or “Command Error” occurs and wafer-search does not start.	Online Support |2: Error “E08” or “Command Error” occurs and wafer-search does not start. Home  >  Online Support  >  Manuals/Troubleshooting  >  Wafer-Search Operation Procedure and Troubleshooting  >  2: Error “E08” or “Command Error” occurs and wafer-search does not start. Troubleshooting of Wafer Search Operation 2: Error “E08” or “Command Error” occurs and wafer-search does not start. For the sensor using a heat shield plate, make sure that teaching has been set at the position where the sensor is reflected at the heat shield plate correctly. When the sensor is reflected at other than the heat shield plate, wafers cannot be detected correctly. Doesn't the sensor react at other than wafers? Check if the sensor has not detected frames behind cassettes or other things. Contents Back Next  Technical Information troubleshooting when wafer-search does not start. Wafer Search Operation Procedure 10：ワークサーチデータの変 更、設定を行なったがワークサーチのデータが消えて いる。 いる。 9：ワークサーチ開始位置へのティーチン グ操作 Wafer Search Operation Procedure
../support/man001/w009.html	und	1710469106	4912	https://www.jel-robot.com/support/man001/w009.html	Online Support |9: Teaching and setting of the start position of wafer search	Online Support |9: Teaching and setting of the start position of wafer search Home  >  Online Support  >  Manuals/Troubleshooting  >  Wafer-Search Operation Procedure and Troubleshooting  >  9: Teaching and setting of the start position of wafer-search Wafer-Search Operation Procedure 9: Teaching and setting of the start position of wafer-search [1] Teach the robot the start position of wafer-search. [2] Set the point of the start position of wafer-search. The start position of wafer-search should be set to the position lower than 3 mm of the first slot of the cassette (WLO). *The procedure varies depending on cassette or wafer types. Note 1: When the start position of wafer-search is too close to the first slot, it may fall within the range of 窶�6: Setting of the detection gate width of wafer (WWG setting)窶� and it may cause an error in wafer-search of the lowest slot. Contents Back Next  Technical Information start position of wafer search caution of start position
../support/cmd.html	und	1710469073	4691	https://www.jel-robot.com/support/cmd.html	Online Support | Compound Commands Reference Manual	Online Support | Compound Commands Reference Manual Home  >  Online Support  >  Manuals/Troubleshooting  >  Compound Commands Reference Manual Compound Commands Reference Manual This reference manual does not guarantee the results of any operation conducted by a customer. Please pay sufficient attention when performing the operation. This reference manual describes the following robot models-SCR, STCR, SHR, STHR- as representative examples. As commands and formats vary depending on the robot model, please refer to each instruction manual together with this reference. For any questions, please feel free to contact us at the address below. Compound Commands Reference Manual Contact information JEL Corporation 2-8-20, Kusado-cho, Fukuyama-city, Hiroshima, 720-0831 Japan Tel: +81-84-932-6500 FAX: +81-84-932-6501 E-mail: Contact sales representative or Service Engineering Section.  Technical Information 
../news/news20150721.html	und	1710468660	3501	https://www.jel-robot.com/news/news20150721.html	News | Summer Holiday Information 2015	News | Summer Holiday Information 2015 Home  >  News  >  Summer Holiday Information Summer Holiday Information JEL will be closed for summer holiday from August 13th to August 16th, 2015 (Japan Time). In case of emergency, please contact us at the following e-mail address: 
../news/event2019_04.html	und	1710468648	9777	https://www.jel-robot.com/news/event2019_04.html	News | SEMICON TAIWAN 2019	News | SEMICON TAIWAN 2019 Home  &gt;  News  &gt;  Event News  &gt;  SEMICON TAIWAN 2019 SEMICON TAIWAN 2019 Thank you very much for coming to our exhibition booth. For more information on our products as well as the exhibited products below, please go to the product page or contact us . Date   September 18 to 20, 2019 Venue Taipei Nangang Exhibition Center, Taiwan Booth No. I3116  Products for Exhibition JEL booth in SEMICON TAIWAN 2019 Products for Exhibition Automatic wafer transfer system for wafer container "SSY" Automatic wafer transfer between a wafer container and a wafer cassette (package/unpackage). Automatic opening/closing of the lid of a wafer container made by Achilles Corporation. The movable wafer container stage simplifies the lid opening/closing mechanism and reduces the contamination generation. Automatic distinction between a wafer and a spacer (interlayer paper) in a wafer container. New Wafer Transfer Robot "MTCR" (Reference Exhibit) Low vibration with the miniaturization of semiconductor devices. Two variations of the arms with the payload capacity of 3 kg and 5 kg allow more customization. Warped Wafer Aligner with Auto-Adjustment Software "SAL3000HV" (Reference Exhibit) Auto-adjustment software JEL ALIGN TOOL allows optimized alignment for various types of wafers. Suitable for large warped wafers. Event Listings News Top SEMICON TAIWAN 2019 banner Our booth at SEMICON TAIWAN 2019 New Wafer Transfer Robot "MTCR" (Reference Exhibit) New Wafer Transfer Robot "MTCR" (Reference Exhibit) Warped Wafer Aligner with Auto-Adjustment Software "SAL3000HV" (Reference Exhibit)
../news/event2021_03.html	und	1710468651	10053	https://www.jel-robot.com/news/event2021_03.html	News | SEMICON JAPAN 2021 HYBRID	News | SEMICON JAPAN 2021 HYBRID Home  &gt;  News  &gt;  Event News  &gt;  SEMICON JAPAN 2021 HYBRID SEMICON JAPAN 2021 HYBRID Thank you very much for coming to our exhibition booth. For more information on our products as well as the exhibited products below, please go to the product page or contact us . Date   Wed., December 15 - Fri., December 17, 2021 Venue Tokyo Big Sight, Japan Booth East Exhibition Hall 5 5039 (Located between Hall 4 and Hall 5.) Access Map & Floor Plan  Products for Exhibition  JEL booth in SEMICON JAPAN 2021 HYBRID Access Map & Floor Plan Products for Exhibition ■GTFR for 300 mm wafers ■Low head SAL-HV for 300 mm wafers ■KHR for 25 wafers batch transfer (300 mm wafers) ■STCR for 150 or 200 mm chemical compound wafer ■SAL for 150 or 200 mm chemical compound wafer ■MTCR for tape frame for 300 mm wafers Event Listings News Top SEMICON JAPAN 2021 HYBRID logo JEL booth at the exhibition SEMICON JAPAN 2021 HYBRID booth map
../support/man001/t003.html	und	1710469101	4540	https://www.jel-robot.com/support/man001/t003.html	Online Support |3: Search failure occurs in the middle slot of the cassette when wafer-search is started.	Online Support |3: Search failure occurs in the middle slot of the cassette when wafer-search is started. Home  >  Online Support  >  Manuals/Troubleshooting  >  Wafer-Search Operation Procedure and Troubleshooting  >  3: Search failure occurs in the middle slot of the cassette when wafer-search is started. Troubleshooting of Wafer Search Operation 3: Search failure occurs in the middle slot of the cassette when wafer-search is started. Isn窶冲 the speed of wafer-search too fast? As specified in 窶�8: Setting of the speed of wafer-search (WSP setting)窶� of Wafer-Search Operation Procedure, set the speed lower than the current speed. Contents Back Next  Technical Information 
../err404.html	und	1710469266	3302	https://www.jel-robot.com/err404.html	JEL Corporation | 404 Not Found	JEL Corporation | 404 Not Found Home  >  Message 404 Not Found Page Not Found Sorry, the page you are looking for is either not existing or updated and cannot be found. (You wil be redirected to our homepage in 5 seconds.) We have renewed our homepage on June 1st, 2012. If you have saved this page as a favorite or a bookmark, the link may need updating. 
../news/topics2023.html	und	1710468672	12358	https://www.jel-robot.com/news/topics2023.html	News | Topics 2023	News | Topics 2023 Home  &gt;  News  &gt;  2023 News 2023 December 15, 2023 SEMICON JAPAN 2023 Thanks for coming to the exhibition. November 22, 2023 New Year's Holiday Information November 17, 2023 SEMICON EUROPA 2023 Thanks for coming to the exhibition. September 09, 2023 SEMICON TAIWAN 2023 Thanks for coming to the exhibition. September 1, 2023 A new extension building was completed in the JEL Kochi factory site. July 11, 2023 Summer Holiday Information July 01, 2023 SEMICON CHINA 2023 Thanks for coming to the exhibition. May 1, 2023 Download company profile and product catalog April 7, 2023 Holiday Notice JEL will be closed for a Japanese holiday week: May 3rd to 7th. April 1, 2023 30th Anniversary On April 1st, 2023, JEL celebrated its 30th anniversary. February 03, 2023 SEMICON KOREA 2023 Thanks for coming to the exhibition. News List News Top SEMICON JAPAN 2023 SEMICON EUROPA 2023 SEMICON TAIWAN 2023 SEMICON CHINA 2023 Company profile and product catalog 30th Anniversary SEMICON KOREA 2023
../support/man001/t010.html	und	1710469103	4363	https://www.jel-robot.com/support/man001/t010.html	Online Support |10: After changing or setting the wafer search data, wafer-search data is found to disappear.	Online Support |10: After changing or setting the wafer search data, wafer-search data is found to disappear. Home  >  Online Support  >  Manuals/Troubleshooting  >  Wafer-Search Operation Procedure and Troubleshooting  >  10: After changing or setting the wafer-search data, wafer-search data is found to disappear. Troubleshooting of Wafer Search Operation 10: After changing or setting the wafer-search data, wafer-search data is found to disappear. Contents Back Next  Technical Information troubleshooting when wafer-search date disappears
../products/SSY-10000_100mm.html	und	1710468969	13552	https://www.jel-robot.com/products/SSY-10000_100mm.html	Products | SSY-10000 (Table-top loader system for 100mm wafer)	Products | SSY-10000 (Table-top loader system for 100mm wafer) Home 〉 Products 〉 〉 System SSY-10000 (Table-top loader system for 100mm wafer) Wafer Transfer System Product Video Usage Environment/Specifications Product Profile Product Model SSY-10000 Environment Clean room atmosphere Operating Range 225mm (Distance to wafer center) Wafer Size Up to 100mm Carrying Object Glass, sapphire, SiC, or GaN or other wafers Contact us for the detailed specifications. Payload Capacity 0.1kg (Wafer only) The image above and the video are of SSY-10000 (Table-top loader system for 100mm wafer). Characteristics For various types of wafers; 2, 3 inch, 100mm glass, sapphire, SiC, or GaN or others. Customization is available. Compact system integrating wafer inspection stage into wafer handling system. Long stroke of 190mm X-axis and 200mm Y-axis. Wafer stage position can be manually adjusted with a handle. Twin end-effector reduces the wafer swap time. Low-cost & high-performance system combining robot and passive type alignment stage. Standard Specifications Carrying Object Up to 100mm wafer (glass, sapphire, SiC, or GaN or others) Operating Range From the robot center to the wafer center Rotation Angle (Theta-axis) Vertical Stroke (Z-axis) 225mm 360deg 150mm Carrying Speed (Ave.) Arm (R-axis) Rotation Angle (Theta-axis) Vertical Stroke (Z-axis) 225mm/sec 500deg/sec 200mm/sec Carrying Speed (Max.) Arm (R-axis) Rotation Angle (Theta-axis) Vertical Stroke (Z-axis) 300mm/sec 700deg/sec 300mm/sec Wafer Holding Method By vacuum suction Repeatability Within ±0.1mm Cleanliness ISO Class 2 (at wafer transfer level when exhausting driving part) Mass Approx. 15kg (Robot) Utility Power: AC100V±10% 0.2kVA   Vacuum: -53kPa or more Outline Drawing (Standard) Option Other Option Product Lineup Menu Prev Next Icon guide ...Atmosphere ...Vacuum ...Waterproof ...Single arm ...Twin arm ...Thin wafer ...CE marking ...JEL's standard spec. ...KCs marking SSY-10000 SSY-10000
../news/event2010_01.html	und	1710468633	5960	https://www.jel-robot.com/news/event2010_01.html	News | Semicon Japan 2010	News | Semicon Japan 2010 Home  >  News  >  Event News  >  Semicon Japan 2010 Semicon Japan 2010 Thank you for coming Semicon Japan 2010. We exhibited our new products. For more product information, please go to the products page or contact us. Date:DEC.1,2010(Wed) - DEC.3,2010(Fri) Venue: Makuhari Messe, Chiba Japan JEL booth No.4A-501, Hall4 Products for Exhibition SORTER SYSTEM (150mm) SORTER SYSTEM with small footprint especially designed for LED wafer handling small footprint. Vacuum robot & aligner for handling susceptor for LED wafer : SVCR3330S-060-PM & SVAL30D1 This robot & aligner is especially designed for handling susceptor in vacuum environment. It has twin end-effector and reduces the tack time. Robot & aligner for 2 to 4 inch wafers for LED : SSCR3115N-150-PM & SSCR2090S-PM & SAL3241GR This robot & aligner is especially designed for handling small wafers and has small footprint. There are armless type and link-arm type. Robot for 450mm wafers : GTCR5280-420-AM This is 5-axis horizontal and multi-joint type clean robot. It has twin end-effector and 2-FOUP access is available without a track. Robot for handling 100 to 200mm tape frame : MTCR4160S-300-AM Clip type chucking unit is mounted for handling 100 to 200mm tape frame. Driving by AC servo controller of JEL is available. Event Listings News Top SORTER SYSTEM (150mm) Vacuum robot & aligner for handling susceptor for LED wafer : SVCR3330S-060-PM & SVAL30D1 Robot & aligner for 2 to 4 inch wafers for LED : SSCR3115N-150-PM & SSCR2090S-PM & SAL3241GR Robot for 450mm wafers : GTCR5280-420-AM縲� Robot for handling 100 to 200mm tape frame : MTCR4160S-300-AM
../news/event2010.html	und	1710468632	4166	https://www.jel-robot.com/news/event2010.html	News | Event News 2010	News | Event News 2010 Home  >  News  >  Event News  >  2010 Event News 2010 Semicon Japan 2010 Date:DEC.1,2010(Wed) - DEC.3,2010(Fri) Main exhibition machine type SORTER SYSTEM (150mm) Vacuum robot & aligner for handling susceptor for LED wafer : SVCR3330S-060-PMVAL30D1 Robot & aligner for 2 to 4 inch wafers for LED : SSCR3115N-150-PMSCR2090S-PMAL3241GR Robot for 450mm wafers : GTCR5280-420-AM Robot for handling tape frame : MTCR4160S-300-AM Click here for details.   Event Listings News Top 
../news/event2014_02.html	und	1710468638	5659	https://www.jel-robot.com/news/event2014_02.html	News | SEMICON China 2014	News | SEMICON China 2014 Home  >  News  >  Event News  >  SEMICON China 2014 SEMICON China 2014 Thank you for coming to SEMICON China 2014. For more product information, please go to the products page or contact us. Date: March 18-20, 2014 Venue: Shanghai New International Exhibition Centre, China Booth: N2 2225 Date: Mar. 19, 2014 Products for Exhibition Clean robot for handling wafer: MTCR4160C-300-AM 繝サTwin arm clean robot using AC servo motor     High-speed handling of wafer and handling of tray/susceptor are available. Clean robot for handling wafer: SCR3160CS-300-PM 繝サLow cost main product of JEL     Optional flip function is available. Bernoulli type end-effector and Bernoulli hand for thin or warped wafer: Bernoulli Hand: BRP-01 繝サLow-cost Bernoulli type end-effector available for customization     Visitors experienced the Bernoulli type wafer holding at the exhibition. Event Listings News Top SEMICON China 2014 SEMICON China 2014 
../news/topics2022.html	und	1710468671	10684	https://www.jel-robot.com/news/topics2022.html	News | Topics 2022	News | Topics 2022 Home  &gt;  News  &gt;  2022 News 2022 December 16, 2022 SEMICON JAPAN 2022 Thanks for coming to the exhibition. November 29 2022 New Year's Holiday Information September 16, 2022 SEMICON TAIWAN 2022 Thanks for coming to the exhibition. July 13, 2022 Summer Holiday Information April 6, 2022 Holiday Notice JEL will be closed for a Japanese holiday week: April 29th to May 1st; May 3rd to 5th. February 17, 2022 Introduction of product videos exhibited at Semicon Japan 2021 February 11, 2022 SEMICON KOREA 2022 Thanks for coming to the exhibition. February 01, 2022 New Products: GTFR5280 (5-Axis Horizontal and Multi-Joint Type Clean Robot) News List News Top SEMICON JAPAN 2022 SEMICON TAIWAN 2022 exhibition product videos SEMICON KOREA 2022 New products lineup
../products/event2021_04g.html	und	1710468947	21084	https://www.jel-robot.com/products/event2021_04g.html	Products | MTCR4160 | Wafer Transfer Atmospheric Robot	Products | MTCR4160 | Wafer Transfer Atmospheric Robot Home 縲� Products 縲� 縲� JEL dedicated website for SEMICON exhibition robots MTCR4160 4-Axis Cylindrical Coordinate Clean Robot Product Video Usage Environment/Specifications Product Profile Model Name MTCR4160 Environment Clean room atmosphere Arm Twin arm Operating Range 315 mm (3rd joint center) Vertical Stroke 300 mm / 400 mm / 500 mm Payload Capacity 4 kg (calculated for the arm 3rd joint) List of Product Model Product Model Vertical Stroke Standard MTCR4160-300-AM 300 mm   MTCR4160-400-AM 400 mm   MTCR4160-400-AM 500 mm The image above and the video are of MTCR for tape frame. Characteristics Designed for handling 300 mm wafers in a production line or inspection line of semiconductor. High-speed handling by AC servo motor and superior cost performance compared to MTHR type. Certified CE marking. Execution of origin search is not required by using the servo motors with absolute encoders. Arm lineup: 160 mm, 200 mm Twin-arm reduces the wafer swap time. Base or flange mounting type is selectable. Motion monitoring is available. RS232C and parallel photo I/O are standard for control. AC servo motor installed in all axes. High-speed, high-accuracy wafer handlingby S-curved speed control. Wafer holding: end-effector with vacuum suction, passive edge, edge grip, or Bernoulli type End-effector. End-effector material: CFRP, Al, ceramic, or others. Optimal end-effector is selectable according to the carrying object and line layout. Standard Specifications Example of standard specifications with JEL standard end-effector (vacuum type) Specifications of Robot Robot Model MTCR4160-300-AM Carrying Object Wafer up to 300 mm Wafer Holding Method By vacuum suction Robot Model Type Cylindrical coordinate type Control Axis 4-axis Motor Type AC servo motor Operating Range From the robot center to the wafer center Rotation Angle (Theta-axis) Vertical Stroke (Z-axis) 575 mm 340 deg 300 mm Carrying Speed(Ave.) Arm (R-axis) Rotation Angle (Theta-axis) Vertical Stroke (Z-axis) 850 mm/sec 340 deg/sec 330 mm/sec Carrying Speed (Max.) Arm (R-axis) Rotation Angle (Theta-axis) Vertical Stroke (Z-axis) 1800 mm/sec 550 deg/sec 500 mm/sec Resolution Arm (R-axis) Rotation Angle (Theta-axis) Vertical Stroke (Z-axis) Below 9.82 µm 0.0015 deg 1.96 µm Handling level 674.5 mm (Base mounting level to end-effector level) Repeatability Within ±0.1 mm Cleanliness ISO Class 2 (at wafer transfer level when exhausting driving part) Utility Power: AC200V single phase ±10% 3kVA; Vacuum: -53 kPa or more Specifications of Controller Controller Model C5000S series Interface RS232C and parallel photo I/O Outline Drawing (Standard) Option End-Effector Model Name Size of Carrying Object End-effector Type (Thickness) Wafer Holding Method SC-IW-200 3 inch, 100mm to 200mm I-shape (2mm) Vacuum suction SC-IW-240 3 inch, 100mm to 300 mm I-shape (2mm) Vacuum suction SC-YW-200 100mm to 200mm Y-shape (2mm) Vacuum suction SC-YW-227 100mm to 300 mm Y-shape (2mm) Vacuum suction SC-YW-240 100mm to 300 mm Y-shape (2mm) Vacuum suction 3D-02229 150mm�300 mm Y-shape (2mm) Vacuum suction SC3-YW-240 300 mm Y-shape (3mm) Vacuum suction 3D-01661 300 mm Y-shape (3mm) Vacuum suction SC3-IW-240 300 mm I-shape (3mm) Vacuum suction *The table above shows the specifications of JEL standard end-effectors. The other specifications are available. *Click the items below to review the end-effectors other than JEL standard types. Other Option Product Lineup Menu Prev Next Icon guide ...Atmosphere ...Vacuum ...Waterproof ...Single arm ...Twin arm ...Thin wafer ...CE marking ...JEL's standard spec. ...KCs marking SEMICON JAPAN 2021 HYBRID title click here for GTFR details page click here for SAL-HV details page. click here for KHR details page. click here for STCR details page. click here for SAL details page. click here for MTCR details page. MTCR4160-300-AM MTCR4160-300-AM click here for GTFR details page click here for SAL-HV details page. click here for KHR details page. click here for STCR details page. click here for SAL details page. click here for MTCR details page. SEMICON JAPAN 2021 HYBRID title
../news/news20240710.html	und	1720662719	3500	https://www.jel-robot.com/news/news20240710.html	News | Summer Holiday Information 2024	News | Summer Holiday Information 2024 Home  &gt;  News  &gt;  Summer Holiday Information Summer Holiday Information JEL will be closed for summer holiday from August 10th to August 15th, 2024 (Japan Time). In case of emergency, please contact us at the following e-mail address: 
../products/C4000_cont.html	und	1710468944	10197	https://www.jel-robot.com/products/C4000_cont.html	Products | C4000 | Controller	Products | C4000 | Controller Home  >  Products  >  縲� Others C4000 Controller Usage Environment/Specifications Product Profile Model Name C4000 Interface RS232C and parallel photo I/O The image above is of C4000. Characteristics JEL has accumulated know-how on methods of the controller development of our robots for semiconductors or FPD. Customization is available. Contact us for the detailed specifications. Compact and lightweight design Stepping motor: Unipolar/bipolar stepping motor Controller interface: RS232C and parallel photo I/O (8 bit IN and OUT, I/O extension available) are standard. High-speed and smooth operation by S-curved speed control Easy teaching with the teaching box Flexible combined operations by compound commands Standard Specifications Outline Drawing (Standard) Product Lineup Menu Prev Next Icon guide ...Atmosphere ...Vacuum ...Waterproof ...Single arm ...Twin arm ...Thin wafer ...CE marking ...JEL's standard spec. ...KCs marking C4000 C4000
../support/man002/m004.html	und	1710469128	5542	https://www.jel-robot.com/support/man002/m004.html	Online Support | JELDATA3 Operation Manual | 4. Before Communication	Online Support | JELDATA3 Operation Manual | 4. Before Communication Home  >  Online Support  >  Wafer-Search Operation Procedure and Troubleshooting  >  JELDATA3 Operation Manual 縲� 4. Before Communication JELDATA3 Operation Manual 4. Before Communication 4.1 Required devices and connectors 繝サPC that JELDATA3 is installed in. 繝サRS232C cable (If you do not have, please ask JEL.) 4.2 Preparation procedures (1) Cable connection Connect RS232C connector of the controller to the serial port (RS232C connector) of the PC with the RS232C cable. Refer to the Instruction Manual of controller (Robot) for details of the RS232C cable connection. (2) Checking controller power is ON Confirm the controller (Robot) power is ON. (3) Checking Teaching BOX is OFF Turn off the Teaching Box. The display of the Teaching Box shows [*Teaching Box Off*]. Unplug the Teaching Box from the connector for the Robot type SHR2***, SHR3***, SVHR3***, SWHR3***, STHR4***, STVHR4*** or STWHR4***. Refer to the Instruction Manual of controller (Robot) for details. (4) Checking the select switch is set at 窶�0窶� (if the select switch is equipped) If the controller has select switch, set it at 窶�0窶�. (5) Checking the 窶彜erial/Teaching box changeover switch窶� is set at 窶彝窶� (if the 窶彜erial/Teaching box changeover switch窶� is equipped) If the controller has 窶彜erial/Teaching box changeover switch窶�, set it at 窶彝窶� side. Contents 竊殖ack Next竊�  Technical Information 
../news/event2017_01.html	und	1710468644	5609	https://www.jel-robot.com/news/event2017_01.html	News | SEMICON KOREA 2017	News | SEMICON KOREA 2017 Home  >  News  >  Event News  >  SEMICON KOREA 2017 SEMICON KOREA 2017 Thank you very much for coming to our exhibition booth at SEMICON KOREA 2017. For more information on our products as well as the exhibited products below, please go to the product page or contact us . Date   February 8-10, 2017 Venue COEX (Convention and Exhibition Center), Seoul, Korea Booth No. A2470 Products for Exhibition Robot with alignment function of molded (PLP) substrate Alignment and high accuracy handling of square substrate. Automatic wafer transfer system for wafer container High accuracy handling of thin wafer inside the wafer container and cassette. Tape frame handling robot Accessible to all slots in the cassette by random access with clip-type end-effector. Event Listings News Top SEMICON KOREA 2017 banner Our booth at SEMICON KOREA 2017 Robot with alignment function of molded (PLP) substrate Automatic wafer transfer system for wafer container Tape frame handling robot
../company/enkaku.html	und	1741825856	14142	https://www.jel-robot.com/company/enkaku.html	Company | History	Company | History Home  &gt;  Company  &gt;  History History Apr. 1993 Set up a limited liability company with capital of 3 million yen in Yamate-cho, Fukuyama, Hiroshima. Sep. Got approved for a loan from the Hiroshima窶冱 new industry revitalization project. Mar. 1994 The capital was increased to 10 million yen. Relocated head office to Nishi-machi, Fukuyama, Hiroshima. Jun. 1996 Established JEL Corporation. Aug. Established the office at 40-1, Yamate-cho, Fukuyama-shi. May 1997 Relocated head office to Yamate-cho, Fukuyama, Hiroshima. Mar. 1998 Relocated head office to Saba-cho, Fukuyama, Hiroshima. Apr. The capital was increased to 20 million yen. Jan. 2000 Established Tokyo branch in Taitou-ku, Tokyo. May The capital was increased to 60 million yen. Changed the fiscal year end from March to May. Apr. 2001 The capital was increased to 66.82 million yen. Aug. Received ISO9001 certification. Oct. Registration of patent for Substrate Transfer Robot. (U.S.A) Dec. Registration of patent for Substrate Transfer Robot. (Japan) May 2002 Registration of patent for FTVHR Transfer Arm. (Taiwan) Aug. Relocated Tokyo branch to Higashikanda, Chiyoda-ku, Tokyo. Nov. Registration of patent for FTVHR Transfer Arm. (U.S.A) Apr. 2004 Invested in JELK CO., LTD. in Korea and signed the distributorship agreement. Dec. The capital was increased to 74.57 million yen. Feb. 2005 Established JEL窶冱 recreational facility in Mukaishima. Sep. 2006 Purchased land to establish Kochi branch in Techno Park, Kochi. Jan. 2007 Registration of patent for Aligner. (Japan) May Fukuyama Orimono Co., Ltd. becomes a subsidiary company and was renamed to JELF. Jun. Established Kochi branch in Techno Park, Kochi. Aug. Started new construction work on Fukuyama Factory. Dec. Established a showroom, J-tech Center in Tokyo Branch. Received ISO14001 certification. Aug. 2008 Completed New Fukuyama Factory. Oct. Concentrated the head office operation in the Fukuyama Factory. Feb. 2009 Received CE certificates for STCR and MTCR series. Aug. Aligner and other prototype research were approved as financial support projects. Feb. 2010 Registration of patent for the new mechanical end-effector. (JAPAN) Jun. Registration of patent for the wafer clamp mechanism. (JAPAN) Jul. Registration of patent for the substrate transfer (new link twin-arm). (JAPAN) Aug. Registration of patent for the substrate transfer (new chucking system for end-effector). (JAPAN) Feb. 2011 Signed the distributorship agreement with Challentech International Corporation in Taiwan. Jun. Registration of patent for the substrate transfer (parallel link arm). (JAPAN) Apr. 2012 Completed the expansion of Fukuyama Factory. Mar. 2013 Started operation of solar power plant in JEL Kochi. Oct. Started operation of solar power plant in Fukuyama Factory. Nov. Registration of patent for jet type Bernoulli end-effector. (JAPAN) Apr. 2014 Signed the distributorship agreement with Inatech & CORP Inc. in Korea. May 2015 Completed the expansion of Fukuyama Factory. Jun. Nobuo Sakiya became the President and Haruo Sakiya became the Board Chairman. May 2017 Relocated Tokyo branch to Kandasakuma-cho in Chiyoda-ku, Tokyo. Oct. Signed the distributorship agreement with Beijing ReJe Automation Co., Ltd. in China. Feb. 2018 Registration of patent for swirl type Bernoulli end-effector. (JAPAN) Mar. Established Korea Liaison Office. Dec. Relocated head office to Kusado-cho, Fukuyama, Hiroshima. Jun. 2019 Began construction of new Saba Factory. Registration of patent for unlocking mechanism for a substrate container (Taiwan). Apr. 2020 Changed status from Korea Liaison Office to Korea Branch. Jun. Completed New Saba Factory. Jun. 2021 Established a subsidiary in China, JELhanghai嘘obotics Co., Ltd. Mar. 2023 Signed the distributorship agreement with JEL Automation Co., Ltd. in Taiwan. Apr. Celebrated 30th anniversary of founding Aug. Acquired the land for Onomichi factory in Mitsugi-cho, Onomichi City Sep. Completed the expansion of JEL Kochi. Oct. Signed the distributorship agreement with Hine Automation, LLC in U.S.A. Started land preparation work for Onomichi factory Dec. Moved Korea branch to Suwon-si, Gyeonggi-do. Jun. 2024 Established a subsidiary in China, JEL (Changzhou) Robotics Technology Co., Ltd. Sep. Changzhou factory completed in China (Changzhou) Oct. Signed the distributorship agreement with AES motomation GmbH (Germany) & AES motomation Inc. (U.S.A) Mar. 2025 Signed the distributorship agreement with Sintaike Semiconductor Equipment (Shanghai) Co., Ltd. in China. Company TOP History
../support/often-3.html	und	1710469076	5829	https://www.jel-robot.com/support/often-3.html	Online Support | Frequently Asked Question :In the Controller Setup (L) window of JELDATA3, a setting specified in the Control Specifications or Instruction Manual cannot be selected.	Online Support | Frequently Asked Question :In the Controller Setup (L) window of JELDATA3, a setting specified in the Control Specifications or Instruction Manual cannot be selected. Home  >  Online Support  >  Frequently Asked Question  &gt;  Communication Software Communication Software Q: In the Controller Setup (L) window of JELDATA3, a setting specified in the Control Specifications or Instruction Manual cannot be selected. A: Please find the attached CD upon delivery and check whether the file of either 窶廱DDEFSTD.xxxx窶� or 窶廱DDEFCST.xxxx窶� is contained in it. ("xxxx" is a setting name) 1. In case the file 窶廱DDEFSTD.xxxx窶� is contained Copy the file to a folder where the software JELDATA3 is installed. (Standard C: \Program Files\JELDATA3) In the Controller Setup (L) window of JELDATA3, the setting name ("xxxx" of the file name) will be displayed in the pull-down list for the Standard button. 2. In case the file “JDDEFCST.xxxx” is contained Copy the file to a folder where the software JELDATA3 is installed. (Standard C: \Program Files\JELDATA3) In the Controller Setup (L) window of JELDATA3, the setting name ("xxxx" of the file name) will be displayed in the pull-down list for the Custom button. 3. In case neither file is found If you cannot find the attached CD upon delivery, please find the Serial No. labeled or incised mainly on the lower left of the front of the controller and contact us . We will email you the target file. Copy the target file to a folder where the software JELDATA3 is installed. (Standard C: \Program Files\JELDATA3)  Click to see JELDATA3 Operation Manual .  List of FQA  Contact Us 
../support/battery.html	und	1710469072	8277	https://www.jel-robot.com/support/battery.html	Online Support | Robot Equipped with Backup Battery	Online Support | Robot Equipped with Backup Battery Home  >  Online Support  >  Notification  >  Robot with Backup Battery Robot Equipped with Backup Battery Some of our robots and aligners are equipped with the batteries for backup of absolute encoders (the batteries back up the absolute encoder multi-turn data). The following includes how to replace the battery or the recommended replacement period, which are also described in an accompanying instruction manual. When the batteries have run out, the encoder multi-turn data (initialization data) will disappear. When the data is lost, it is necessary to operate the encoder initialization (origin setting). The recommended battery replacement period is 1 year. 1撒he type of robots equipped with battery (1) All the robots with the robot model number that contains "AM窶�     Example) GTCR5280-300-AM, MTHR4183C-330-AM, etc. (2) Some of the robots with the robot model number that contains "PM窶�     a. The robots with the robot model number that begins from "GHR窶�: example) GHR4180-280-PM     b. The robots with the robot model number that begins from "EHR窶�: example) EHR3156-320-PM     c. The robots with the robot model number that begins from "DTVHR窶�: example) DTVHR4275-050-PM     d. The robots with the robot model number that begins from "GTHR窶�: example) GTHR5281-300-PM     e. The robots with the robot model number that begins from "GCR窶�: example) GCR4210-320-PM (3) Some of aligners     SAL20C1, SAL20C2, SAL2681, SAL30C2 (4) Some of vacuum elevators     SVEL1200 2殺rror codes and alarm codes that appear in low battery voltage (1) Error "Low battery voltage窶�: When battery voltage has dropped, the following error /alarm codes appear.      Error codes: 91000000-95000000      Alarm codes: 91h-95h, 77h (2) Error "Loss of multi-turn data窶�: When battery of absolute-value encoder has run down, the following error/alarm codes appear.      Error codes: 96000000-9a000000      Alarm codes: 96h-9Ah, 77h Note: The error/alarm codes may differ according to the robot specification. 3山ecovery method (1) Error "Low battery voltage窶�      Replace the battery while the robot is turned on.      Note: In case the robot is turned off during replacement, it may lose the encoder multi-turn data (initialization data). (2) Error "Loss of multi-turn data窶�      Turn the robot power off and replace the battery, then operate the origin setting.      Note: For the origin setting, please refer to an accompanying instruction manual. 4撒he robot conditions with the risk of "loss of multi-turn data窶�, which means the battery has run down (1) The robot has been stored for a long time without power delivery. (2) It runs beyond the recommended replacement period. To prevent the"Low battery voltage窶拌nd the"Loss of multi-turn data", it is recommended to replace the battery regularly (recommended replacement period: 1 year). If you have any questions about the matter, please contact our Service Engineering Section. (Please confirm the serial number that is inscribed on the robot or controller.)  Technical Information Notice
../products/strength.html	und	1710468973	11349	https://www.jel-robot.com/products/strength.html	Products | Top Three Strengths of JEL	Products | Top Three Strengths of JEL Home  >  Products  >  Product News  >  Top Three Strengths of JEL Customization Customization to Meet Customers窶� Needs JEL robots have been used by more than 2,000 customers and most of the shipped products (more than 16,000 robots) are customized products. With our full lineup of the products, we offer the customers the most suitable robot. High Quality Consistent quality controls for high quality manufacturing To solve the problems and to meet the request of customers, JEL has a consistent manufacturing process. We perform five quality controls to ensure the safety and performance of the products. Five Quality Controls R&D Procurement Manufacturing Quality Assurance Customer Service Manufactures high-quality and low-cost products based on the motto 窶弋o meet customers窶� needs窶� Conducts periodic quality audit of suppliers along with thorough receiving inspection High quality and quick delivery time from thorough manufacturing control Quality and environmental management systems certified with ISO 9001 and ISO 14001 Provides total customer service with prompt and appropriate service and maintenance Customer Service Prompt and professional customer service Prompt after-sales service/support and our website 窶廾nline Support窶� are provided for troubleshooting or inquiries about the products. Customer support service is available from 8 locations both in domestic and overseas. Online Support (JEL's website)  Click here for the page of Online Support Customer Service (Domestic and overseas)  Click here for the page of Customer Service Japan (Hiroshima) Japan (Tokyo) China (Beijing) China (Shanghai) Korea (Soul) Korea (Cheonan) Taiwan Singapore Top Three Strengths of JEL image of outline drawing Details of customization high quality product after-service maintenance Online Support (JEL
../support/support02.html	und	1710469080	3685	https://www.jel-robot.com/support/support02.html	Online Support | Notification	Online Support | Notification Home  >  Online Support  >  Notification Notification Change of JEL窶冱 Warranty Period Robot Equipped with Backup Battery Discontinued Products  Technical Information 
../company/download.html	und	1741842092	5652	https://www.jel-robot.com/company/download.html	Company | Download company profile and product catalog	Company | Download company profile and product catalog Home  >  Company  >  Download company profile and product catalog Download company profile and product catalog Download company profile and product catalog. Adobe Acrobat Reader is required to open PDF files. company profile and product catalog Company profile PDF Company profile PDF_English (March 2025 update)(1.16MB) Company profile PDF_Traditional Chinese (March 2025 update)(2.68MB) Product catalog PDF Product catalog PDF_English (March 2025 update)(2.87MB) Product catalog PDF_Traditional Chinese (March 2025 update)(4.64MB) Company TOP company profile and product catalog
../support/often-2.html	und	1710469076	4219	https://www.jel-robot.com/support/often-2.html	Online Support | Frequently Asked Question: How do I back up the controller data?	Online Support | Frequently Asked Question: How do I back up the controller data? Home  >  Online Support  >  Frequently Asked Question  &gt;  Communication Software Communication Software Q: How do I back up the controller data? A: You can save data to PC with the accompanying software JELDATA3 and the dedicated communication cable.  Click to see JELDATA3 Operation Manual .  List of FQA  Contact Us 
../support/man001/w006.html	und	1710469105	6165	https://www.jel-robot.com/support/man001/w006.html	Online Support | 6: Setting of the detection gate width of wafer (WWG setting)	Online Support | 6: Setting of the detection gate width of wafer (WWG setting) Home  >  Online Support  >  Manuals/Troubleshooting  >  Wafer-Search Operation Procedure and Troubleshooting  >  6: Setting of the detection gate width of wafer (WWG setting) Wafer-Search Operation Procedure 6: Setting of the detection gate width of wafer (WWG setting) *WWG command may not be used depending on specifications. In that case, wafer-search is available without specifying the gate width. For the detection gate width of wafer, set the area to be detected in wafer-search. Set half the value of the detection area per cassette slot to be used. (Make sure to set "half the value per slot".) *Depending on the specification, the whole detection area is to be set in some cases. Please refer to the instruction manual. When the sensor reacts to the area other than the detection area, it is judged as error. Set the detection width via serial communication. Input the following commands for configuration: Input half the value of the area to be detected in "DEC". Obtain the current designated data Data to be set Note 1: When WWG value is too large, WWG above and below the wafer overlap and it makes the detection area overlap. In this case, a cross-slotted wafer cannot be detected. Note 2: Configure the setting so that 窶弩WG x 2 > WWM窶�. When the value of 窶弩WG x 2窶� is set smaller than the value of WWM, a wafer cannot be detected correctly. Contents Back Next  Technical Information teaching point overlapped area caution
../products/STCR4160SN_300mm.html	und	1710468972	25911	https://www.jel-robot.com/products/STCR4160SN_300mm.html	Products | STCR4160SN (Closed-loop control)	Products | STCR4160SN (Closed-loop control) Home 〉 Products 〉 〉 Robot for Semiconductor STCR4160SN (Closed-loop control) 4-Axis Cylindrical Coordinate Clean Robot Product Video Usage Environment/Specifications Product Profile Model Name STCR4160SN Environment Clean room atmosphere Arm Twin arm Operating Range 315mm (3rd joint center) Vertical Stroke 200mm / 300mm / 400mm / 450mm / 500mm Payload Capacity 3kg (calculated for the arm 3rd joint) List of Product Model Product Model Vertical Stroke STCR4160SN-200-CM 200mm STCR4160SN-300-CM 300mm STCR4160SN-400-CM 400mm STCR4160SN-450-CM 450mm STCR4160SN-500-CM 500mm The image above is of STCR4160SN-300-CM and the video shows STCR4160SN-300-PM. Characteristics Path planning handling has joined the lineup of clean robot with the closed-loop control. Access to the chamber stage arranged in parallel without a track improves the flexibility in the layout design and the cost-performance. * Click to go to the page of the path planning handling video. New type of 4-axis cylindrical coordinate type twin-arm clean robot For handling wafers from 2 inch to 300mm with low-cost, high-speed handling, and no step-out error High reliability: Closed-loop control achieves no step-out error under rapid load change or acceleration. Reduced origin search time: By absolute encoder Equipped with the batteryless multi-rotation absolute sensor Robot replacement is available: Compatible with conventional model (installation/performance) High rigidity: Payload capacity of 3kg (calculated for the arm 3rd joint/including wrist-block, end-effector, and wafer) Arm lineup: 100mm, 130mm, 160mm, 200mm Base or flange mounting type is selectable according to the customer’s system layout. Bernoulli end-effector is available (option) Standard Specifications Example of specifications with JEL standard end-effector (vacuum type) Specifications of Robot Robot Model STCR4160SN-300-CM Carrying Object Wafer up to 300mm (Available for various types of wafers) Wafer Holding Method By vacuum suction Robot Model Type Cylindrical coordinate type Control Axis 4-axis Motor Type Stepping motor (Closed-loop) Operating Range From the robot center to the wafer center Rotation Angle (Theta-axis) Vertical Stroke (Z-axis) 575mm 340deg 300mm Carrying Speed (Ave.) Arm (R-axis) Rotation Angle (Theta-axis) Vertical Stroke (Z-axis) 570mm/sec 220deg/sec 200mm/sec Carrying Speed (Max.) Arm (R-axis) Rotation Angle (Theta-axis) Vertical Stroke (Z-axis) 1140mm/sec 270deg/sec 250mm/sec Resolution Arm (R-axis) Rotation Angle (Theta-axis) Vertical Stroke (Z-axis) Below 10.0µm 0.0015deg 2.0µm Repeatability Within ±0.1mm Cleanliness ISO Class 2 (at wafer transfer level when exhausting driving part) Utility Power: DC24V±10% 10A    Vacuum: -53kPa or more Mass Approx. 30kg Specifications of Controller Controller Model C4000B series Interface RS232C and parallel photo I/O Outline Drawing (Standard) Option Wrist-Block Unit Model Name Total Length Mapping Sensor Thickness of Attaching End-Effector SART08674 60mm   2mm SART08604 60mm   2mm SART08675 155mm   2mm SART08661 155mm Available 2mm SART08676 60mm   2mm SART08668 60mm Available 2mm *The table above shows the specifications of JEL standard wrist-block units. The other specifications are available. *Click the items below to review the wrist-block units other than JEL standard types. End-Effector Model Name Size of Carrying Object End-effector Type (Thickness) Wafer Holding Method SC-IW-200 3 inch, 100mm to 200mm I-shape (2mm) Vacuum suction SC-IW-240 3 inch, 100mm to 300mm I-shape (2mm) Vacuum suction SC-YW-200 100mm to 200mm Y-shape (2mm) Vacuum suction SC-YW-227 100mm to 300mm Y-shape (2mm) Vacuum suction SC-YW-240 100mm to 300mm Y-shape (2mm) Vacuum suction 3D-02229 150mm to 300mm Y-shape (2mm) Vacuum suction SC3-YW-240 300mm Y-shape (3mm) Vacuum suction 3D-01661 300mm Y-shape (3mm) Vacuum suction SC3-IW-240 300mm I-shape (3mm) Vacuum suction *The table above shows the specifications of JEL standard end-effectors. The other specifications are available. *Click the items below to review the end-effectors other than JEL standard types. Operating Range End-Effector/Wrist-Block Unit SART08674 SART08604 SART08675 SART08661 SART08676 SART08668 SC-IW-200 525mm 525mm 620mm 620mm 525mm 525mm SC-IW-240 565mm 565mm 660mm 660mm 565mm 565mm SC-YW-200 535mm 535mm 630mm 630mm 535mm 535mm SC-YW-227 535mm 535mm 630mm 630mm 535mm 535mm SC-YW-240 575mm 575mm 670mm 670mm 575mm 575mm 3D-02229 575mm 575mm 670mm 670mm 575mm 575mm SC3-YW-240 575mm 575mm 670mm 670mm 575mm 575mm 3D-01661 575mm 575mm 670mm 670mm 575mm 575mm SC3-IW-240 565mm 565mm 660mm 660mm 565mm 565mm *The operating range in the table that is specified by the combination of the wrist-block unit and end-effector is an example only. The other combinations are available. Other Option Product Lineup Menu Prev Next Icon guide ...Atmosphere ...Vacuum ...Waterproof ...Single arm ...Twin arm ...Thin wafer ...CE marking ...JEL's standard spec. ...KCs marking STCR4160SN (Closed-loop control) STCR4160SN (For wafer up to 300mm wafer)
../support/man001/t009.html	und	1710469103	5713	https://www.jel-robot.com/support/man001/t009.html	Online Support |9: A wafer cannot be detected when wafer-search is started after cassettes have been changed.	Online Support |9: A wafer cannot be detected when wafer-search is started after cassettes have been changed. Home  >  Online Support  >  Manuals/Troubleshooting  >  Wafer-Search Operation Procedure and Troubleshooting  >  9: A wafer cannot be detected when wafer-search is started after cassettes have been changed. Troubleshooting of Wafer Search Operation 9: A wafer cannot be detected when wafer-search is started after cassettes have been changed. Wafer-search operation for multiple cassettes When executing wafer-search for multiple cassettes, in case the data of each cassette is different, change the data setting first before starting the wafer-search of the cassette. Set the point of the start position of wafer-search and teach according to cassette in advance. Contents Back Next  Technical Information troubleshooting when wafer-search is started after cassettes have been changed 4：ワーク検出最小、 5：最大幅の設定 (WWN、WWM設定) 1：カセット最下段目の設定。(WLO設定) 1：カセット最下段目の設定。(WLO設定) 5：ワーク検出最大幅の設定 (WWM設) 12：ワークサーチ検出幅の読出
../products/semicon2021.html	und	1710468967	8136	https://www.jel-robot.com/products/semicon2021.html	Products | Introduction of product videos exhibited at Semicon Japan 2021	Products | Introduction of product videos exhibited at Semicon Japan 2021 Home  >  Products  >  Product News  >  Introduction of product videos exhibited at Semicon Japan 2021 Introduction of product videos exhibited at Semicon Japan 2021 Please take a look at the lineup of our exhibition robots for SEMICON JAPAN 2021. Please feel free to contact us for more information about exhibition robots and our products. New product GTFR for 300 mm wafers Designed for handling wafers in EFEM. Compared to our conventional GTCR model, the cycle time is improved by reducing the operation prohibited area and the influence of speed limit. For GTFR5280 details page. Low head SAL-HV for 300 mm wafers Pre-aligner for centering and aligning orientation flat/notch at high speed and with high accuracy without being affected by wafer materials such as silicon wafers with BG tape (milky white) as well as silicon, transparent or translucent wafers. KHR for 25 wafers batch transfer (300 mm wafers) Capable of transferring 25 wafers at once. The transfer time can be significantly reduced by batch transfer. STCR for 150 or 200 mm chemical compound wafer Designed for handling wafers in EFEM, production line or inspection line of semiconductor, and other systems at high speed. SAL for 150 or 200 mm chemical compound wafer No contact with backside of wafers by edge grip method. Compatible with two wafer sizes. MTCR for tape frame for 300 mm wafers Equipped with AC servo motors for all axes, and capable of handling trays, small glass substrates as well as wafers. For SEMICON JAPAN 2021 page. 
../news/event2019_03.html	und	1710468648	9061	https://www.jel-robot.com/news/event2019_03.html	News | SEMICON WEST 2019	News | SEMICON WEST 2019 Home  &gt;  News  &gt;  Event News  &gt;  SEMICON WEST 2019 SEMICON WEST 2019 Thank you very much for coming to our exhibition booth at SEMICON WEST 2019. For more information on our products as well as the exhibited products below, please go to the product page or contact us . Date   July 9 to 11, 2019 Venue Moscone Center San Francisco, CA Booth No. 6349  Products for Exhibition ASUZAC INC. booth in SEMICON WEST 2019 Products for Exhibition Wafer Transfer Robot "STCR" High reliability: Closed-loop control achieves no step-out error under rapid load change or acceleration. Reduced origin search time: By absolute encoder Reference photo Optical Aligner "SAL" Designed for aligning wafers in a production line or inspection line of semiconductor. High-speed, high-accuracy centering and flat/notch locating. Reference photo Event Listings News Top SEMICON WEST 2019 banner Our booth at SEMICON WEST 2019 Wafer Transfer Robot "STCR" Optical Aligner "SAL"
../company/download4.html	ja	1710468468	7178	https://www.jel-robot.com/company/download4.html	JEL	JEL  Japanese  English  Chinese Webカタログ＆Webサイト ジェーイーエルの会社案内、製品カタログ、ウェブサイトをオンライン上でご覧頂けます。 JEL E-Catalog & Website Click the button to view the company profile, product catalog, and website. JEL电子目录和网站 您可以网站查看JEL的公司简介、产品目录和网站。 JEL J_Company Profile 2024 J_Product Catalog 2024 JEL Website JEL Website E_Company Profile 2024 E_Product Catalog 2024 JEL Website JEL Website C_Company Profile 2024 C_Product Catalog 2024 JEL Website JEL Website
../products/class.html	und	1710468945	9215	https://www.jel-robot.com/products/class.html	Products | JEL's approach to ensure cleanliness	Products | JEL's approach to ensure cleanliness Home  >  Products  >  Product News  >  JEL's approach to ensure cleanliness Due to an increase in high refinement and reliability in the semiconductor industry, enhanced cleanliness has been required in manufacturing semiconductor equipment and devices. JEL's workers in clean rooms wear clean clothes, masks, and gloves to avoid any dust particles on products. We have installed two types of clean rooms in which all the products are manufactured: Class 10,000 and Class 100,000. The head office has three class 10,000 clean rooms (one of them has one class 1 clean booth) and one class 100,000 clean room. Saba factory has two class 10,000 clean rooms. As part of activities to enhance cleanliness, all employees clean up their work space and surrounding area of the company as well as clean rooms every day. Cleanliness of clean rooms is measured by tightly defined standards. The classification of clean room Class 10,000 under US FED standards, for example, indicates the air of 1 cubic feet (= 1 ft 3 ) (30.5 cm on each side) contains a maximum of 10,000 particles of 0.5 µm or larger. The size of 0.5 µm(=0.0005 mm)is the unimaginable smallness, considering that the average size of a human hair is approximately 50 to 70 µm in diameter and the average pollen particle is under 10 µm. JEL's clean rooms are designed to change the air through HEPA filters (99.97％) to maintain the cleanliness. (Air change rate of Clean Room 1 and Clean Room 2: 25 times per hour). Wear clean clothes, masks and gloves Workers at a manufacturing site are obligated to wear clean clothes, masks and gloves, realizing a consistent manufacturing line. By raising the awareness of wearing them, we are engaged in creating a clean working environment. Air shower before entering clean room It is mandatory to pass through the air shower to enter a clean room. The air shower removes hairs or dust particles from worker's clean clothes before entering a clean room. Primary packaging in clean room After conducting product inspections, primary packaging is carried out in a clean room to prevent attachment of dust or stain. The high sealability isolates the products from outside air. Measurement of cleanliness in class 1 clean booth Clean Booth(Area of about 11.6m 2 (Outside Dimension: W2895 x L4020 x H3525)) with ULPA+PTFE filter (99.9999% (particle diameter of 0.1 µm)) for measurement of cleanliness. JEL’s approach to ensure cleanliness From assembly, inspection to primary packaging Wear clean clothes, masks and gloves Air shower before entering a clean room Primary packaging in a clean room クリーンブースでパーティクル測定
../news/event2015_02.html	und	1710468640	5579	https://www.jel-robot.com/news/event2015_02.html	News | SEMICON Korea 2015	News | SEMICON Korea 2015 Home  >  News  >  Event News  >  SEMICON Korea 2015 SEMICON Korea 2015 Thank you very much for coming to our exhibition booth at SEMICON Korea 2015. For more information on our products as well as the exhibited products below, please go to the product page or contact us. Date: February 4-6, 2015 Venue: Convention and Exhibition Centre (COEX), Seoul Booth: No. 2558, 2572 Date: Feb. 04, 2015 Products for Exhibition Clean robot with batch end-effector for 5 pieces of wafer High-speed handling of cassette with different pitches for such as vertical furnace. Logger system Suitable for the verification of an error such as wafer breakage. Event Listings News Top SEMICON Korea 2015 SEMICON Korea 2015 Clean robot with batch end-effector for 5 pieces of wafer Logger system
../products/SAL3481HV.html	und	1710468962	13362	https://www.jel-robot.com/products/SAL3481HV.html	Products | SAL3482HV (Full auto-adjustment version)	Products | SAL3482HV (Full auto-adjustment version) Home 〉 Products 〉 〉 Aligner New Aligner "SAL3000HV Series"  (Full auto-adjustment version) SAL3482HV (Multi work aligner) Wafer Aligner Product Video Usage Environment/Specifications Product Profile Product Model SAL3482HV Environment Clean room atmosphere Wafer Size 100 to 200 mm Carrying Object Transparent, translucent, or silicon wafer The image is of SAL38C3HV . The video is of full auto-adjustment software " JEL ALIGN TOOL ". Characteristics Full auto-adjustment software  JEL ALIGN TOOL  comes with Aligner SAL3000HV series that have been released on December 14, 2016. Downtime can be reduced significantly. *Click to go to the page of New Aligner "SAL3000HV Series" (Full auto-adjustment version) (*). (*) Please note that this tool (software) is not for guaranteeing the positioning accuracy after adjustment. Make sure to check the positioning accuracy by using the customer’s inspection device at customer’s side. New type of aligner available for any material of wafer for 100 to 200 mm wafer High-speed, high-accuracy centering and flat/notch locating are available for silicon wafer with BG tape as well as silicon, transparent, or translucent wafer. Equipped with JEL-developed image sensor, and internal motor driver and controller. Size, shape, material of spindle can be changed according to the wafer type. Bernoulli type is also available. Control: RS232C and parallel photo I/O Available for non-SEMI standard notch or flat Optional Z-axis for pick-up/place operation is available. Standard Specifications Carrying Object SEMI standard 100 to 200 mm wafer (Transparent, translucent, silicon) Positioning Time Centering : 3 sec (Wafer pick-up/placing time excluded) Positioning Accuracy Centering: Within ±0.1 mm Flat locating/Notch locating: Within ±0.1 deg Sensor LED light + wafer edge detection with image sensor unit Wafer Size Change By command control or switch Cleanliness ISO Class 2 (at wafer transfer level when exhausting driving part) Driving Method 2-phase stepping motor (for 3 axes) Internal motor driver, controller Utility Power: DC24V±10% 3A Vacuum: -53 kPa or more Outline Drawing Product Lineup Menu Prev Next Icon guide ...Atmosphere ...Vacuum ...Waterproof ...Single arm ...Twin arm ...Thin wafer ...CE marking ...JEL's standard spec. ...KCs marking SAL38C3HV SAL3482HV
../products/GTCR5280_300mm.html	und	1710468949	17837	https://www.jel-robot.com/products/GTCR5280_300mm.html	Products | GTCR5280 (For 300mm wafer) | Wafer Transfer Atmospheric Robot	Products | GTCR5280 (For 300mm wafer) | Wafer Transfer Atmospheric Robot Home 縲� Products 縲� 縲� Robot for Semiconductor GTCR5280 (For 300mm wafer) 5-Axis Horizontal and Multi-Joint Type Clean Robot Product Video Usage Environment/Specifications Product Profile Model Name GTCR5280 Environment Clean room atmosphere Arm Single arm Operating Range 553mm (3rd joint center) Vertical Stroke 300mm Payload Capacity Below 4kg (calculated for the arm 3rd joint) List of Product Model Product Model Vertical Stroke Standard GTCR5280-300-AM 300mm The image above and the video are of GTCR5280-300-AM. Characteristics A twin end-effector mounted on its single-arm has the same function as a twin-arm robot. Designed for handling 300mm wafers in a production line or inspection line of semiconductor. Execution of origin search is not required by using the servo motors with absolute encoders. 3 FOUP access is available without a track. Twin end-effector reduces the wafer swap time. Base or flange mounting type is selectable. Motion monitoring is available. RS232C and parallel photo I/O are standard for control. AC servo motors with absolute encoders installed in all axes. High-speed, high-accuracy wafer handling by S-curved speed control and optimizing pass control. Wafer holding: end-effector with vacuum suction, passive edge, edge grip, or Bernoulli type End-effector. End-effector material: CFRP, Al, ceramic, or others. Optimal end-effector is selectable according to the carrying object and line layout. Standard Specifications Example of standard specifications with JEL standard end-effector (vacuum type) Specifications of Robot Robot Model GTCR5280-300-AM Carrying Object Up to 300mm silicon wafer Wafer Holding Method By vacuum suction Robot Model Type Horizontal and multi-joint type Control Axis 5-axis Motor Type AC servo motor Operating Range From the robot center to the wafer center Rotation Angle (Theta-axis) Vertical Stroke (Z-axis) 953mm 335deg 300mm Carrying Speed Arm (R-axis) Rotation Angle (Theta-axis) Vertical Stroke (Z-axis) 833mm/sec 250deg/sec 300mm/sec Repeatability Within ±0.1mm Cleanliness ISO Class 2 (at wafer transfer level when exhausting driving part) Utility Power: AC200V Single phase ±10% 2kVA; Vacuum: -53kPa or more Mass Approx. 50kg Specifications of Controller Controller Model C5000S series Interface RS232C and parallel photo I/O Outline Drawing (Standard) Option End-Effector Model Name Size of Carrying Object End-effector Type (Thickness) Wafer Holding Method SC-IW-200 3 inch, 100mm to 200mm I-shape (2mm) Vacuum suction SC-IW-240 3 inch, 100mm to 300mm I-shape (2mm) Vacuum suction SC-YW-200 100mm to 200mm Y-shape (2mm) Vacuum suction SC-YW-227 100mm to 300mm Y-shape (2mm) Vacuum suction SC-YW-240 100mm to 300mm Y-shape (2mm) Vacuum suction 3D-02229 150mm�300mm Y-shape (2mm) Vacuum suction SC3-YW-240 300mm Y-shape (3mm) Vacuum suction 3D-01661 300mm Y-shape (3mm) Vacuum suction SC3-IW-240 300mm I-shape (3mm) Vacuum suction *The table above shows the specifications of JEL standard end-effectors. The other specifications are available. *Click the items below to review the end-effectors other than JEL standard types. Other Option Product Lineup Menu Prev Next Icon guide ...Atmosphere ...Vacuum ...Waterproof ...Single end-effector ...Twin end-effector ...Thin wafer ...CE marking ...JEL's standard spec. ...KCs marking GTCR5280-300-AM GTCR5280-300-AM
../news/topics2017.html	und	1710468670	8430	https://www.jel-robot.com/news/topics2017.html	News | Topics 2017	News | Topics 2017 Home  >  News  >  2017 News 2017 December 25, 2017 New Products: SSY-11010 (Automatic wafer transfer system for wafer container) MTCR4160 (Tape frame handling robot) JCR4400 (Robot with substrate alignment function) New Aligner SAL3000HV Series (full auto-adjustment version) December 15, 2017 Thanks for coming to the exhibition. November 27, 2017 Updated JELDATA3 software version We have updated the communication software JELDATA3. * There is no change to the functions with this version upgrade. September 15, 2017 Thanks for coming to the exhibition. June 16, 2017 OPTO Taiwan 2017 Thanks for coming to the exhibition. May 22, 2017 Tokyo Branch was relocated on May 22. January 13, 2017 Added robots to Fukuyama factory showroom. News List News Top New products lineup SEMICON JAPAN 2017 logo Updated JELDATA3 software version SEMICON Taiwan 2017 OPTO Taiwan 2017 Tokyo Branch Fukuyama factory showroom
../products/handling_11.html	und	1710468951	5957	https://www.jel-robot.com/products/handling_11.html	Products | Introduction Video of Handling (Waterproof Handling)	Products | Introduction Video of Handling (Waterproof Handling) Home  >  Products  >  Introduction Video of Handling  >  Waterproof Handling Introduction Video of Handling Waterproof Handling Waterproof clean robot SWCR3160CS (for 300mm wafer with flip and edge grip function) : Designed for handling 300mm wafer in a LSI production line under the condition of acid or alkaline mist (IP64). Corrosion protection for arm by Teflon coating and V-type seals are used for waterproof of arm joint. *Also available for twin-arm robot: STWCR4160 Video List Previous Video Next Video YouTube Official Channel
../support/man001/w005.html	und	1710469105	5051	https://www.jel-robot.com/support/man001/w005.html	Online Support | 5: Setting of the maximum detection width of wafer (WWM setting)	Online Support | 5: Setting of the maximum detection width of wafer (WWM setting) Home  >  Online Support  >  Manuals/Troubleshooting  >  Wafer-Search Operation Procedure and Troubleshooting  >  5: Setting of the maximum detection width of wafer (WWM setting) Wafer-Search Operation Procedure 5: Setting of the maximum detection width of wafer (WWM setting) Set the maximum detection width of wafer to be used. When the width detected in the wafer search is larger than the maximum detection width , it is judged as thickness error. Set the maximum detection width of wafer via serial communication. Input the following commands for configuration: Input the maximum detection width in "DEC". Obtain the current designated data Data to be set Contents Back Next  Technical Information 
../news/news20170719.html	und	1710468662	3468	https://www.jel-robot.com/news/news20170719.html	News | Summer Holiday Information 2017	News | Summer Holiday Information 2017 Home  >  News  >  Summer Holiday Information Summer Holiday Information JEL will be closed for summer holiday from August 11th to August 15th, 2017 (Japan Time). In case of emergency, please contact us at the following e-mail address: 
../products/SAL2081_a.html	und	1710468961	10634	https://www.jel-robot.com/products/SAL2081_a.html	Products | SAL2081 (Edge-grip type)	Products | SAL2081 (Edge-grip type) Home 〉 Products 〉 〉 Aligner SAL2081 (Edge-grip type) Wafer Aligner Product Video Usage Environment/Specifications Product Profile Product Model SAL2081 Environment Clean room atmosphere Wafer Size 200 mm Carrying Object Silicon wafer The image above is of SAL2081, and the video is of SAL20C1. Characteristics Designed for aligning wafers in a production line or inspection line of semiconductor. Minimized footprint and designed for aligning small wafer. High-speed, high-accuracy centering and flat/notch locating of small wafer. Standard Specifications Carrying Object SEMI standard 200 mm silicon wafer (Notch) Positioning Accuracy Centering: Within ±0.2 mm Notch locating: Within ±0.2 deg Positioning Time Notch search : 15 sec (Wafer pick-up/placing time excluded) Sensor Red LED transmissive sensor Wafer Holding Method By edge grip Cleanliness 0.1 µm/cf Class 1 (at wafer transfer level when exhausting driving part) Driving method Small size stepping motors at each axis (internal motor driver) Product Lineup Menu Prev Next Icon guide ...Atmosphere ...Vacuum ...Waterproof ...Thin wafer ...CE marking ...JEL's standard spec. ...KCs marking SAL2081
../news/event2024.html	und	1733284973	6475	https://www.jel-robot.com/news/event2024.html	News | Event News 2024	News | Event News 2024 Home  &gt;  News  &gt;  Event News  &gt;  2024 Event News 2024 SEMICON JAPAN 2024 Date: December 11 to 13, 2024 Major exhibits JFR -PLP Transfer Robot- STVCR -Vacuum Wafer Transfer Robot- SSY -EFEM with φ300 mm- SAL-HV -High Accuracy Pre-Aligner-  Click here for details.   SEMICON EUROPA 2024 Date: November 12 to 15, 2024  Click here for details.   SEMICON TAIWAN 2024 Date: September 04 to 06, 2024 Major exhibits GTFR for 300 mm wafers (Edge-grip type) SAL-HV for 300 mm wafers (Edge-grip type Aligner) STCR for 300 mm, 200 mm wafers  Click here for details.   SEMICON CHINA 2024 Date: March 20 to 22, 2024 Major exhibits SCR3160 (w/flip unit & slider) + 6 & 8 inch SMIF (REJE products) Vacuum robot: SVCR2260 SORTER SYSTE Horizontal and multi-joint type: GTFR5280 + Low-head type pre-aligner: SAL38C3HV  Click here for details.   SEMICON KOREA 2024 Date: January 31 to February 02, 2024 Major exhibits GTFR for 300 mm wafers SAL-HV for 300 mm wafers STCR for 300 mm wafers (flip unit, vacuum, edge-grip)  Click here for details.   Event Listings News Top 
../support/man002/s002.html	und	1710469130	4927	https://www.jel-robot.com/support/man002/s002.html	Online Support | JELDATA3 Operation Manual | 6. File (Save)	Online Support | JELDATA3 Operation Manual | 6. File (Save) Home  >  Online Support  >  Wafer-Search Operation Procedure and Troubleshooting  >  JELDATA3 Operation Manual 縲� 6. File JELDATA3 Operation Manual 6. File 6.2 Save (Figure 6-3) Designate the data file to save 窶廣 Data窶�, 窶廬 Data窶�, 窶廛 Data窶� or Parameter (if it is supported). In the Select File dialog box, select the data (multiple selection is available) and click the [Decide] button.� Figure: 6-4 � he selection 窶弃arameter窶� will not appear if the parameter function is not available for this robot.� After selecting the data, save the data into the designated file.� Figure: 6-5 � While saving the data, the progress is shown on the status bar. (Figure: 6-4) (Figure: 6-5) Contents 竊殖ack Next竊�  Technical Information save files select files to save location of files status bar
../news/event2015_04.html	und	1710468640	5663	https://www.jel-robot.com/news/event2015_04.html	News | AUTOMATION WORLD (AIMEX) 2015	News | AUTOMATION WORLD (AIMEX) 2015 Home  >  News  >  Event News  >  AUTOMATION WORLD (AIMEX) 2015 AUTOMATION WORLD (AIMEX) 2015 Thank you very much for coming to our exhibition booth at AUTOMATION WORLD (AIMEX) 2015. For more information on our products as well as the exhibited products below, please go to the product page or contact us. Date: March 18-20, 2015 Venue: Convention and Exhibition Centre (COEX), Seoul Booth: A Hall (G108) Date: Mar. 18, 2015 Products for Exhibition Clean robot with batch end-effector for 5 pieces of wafer High-speed handling of cassette with different pitches for such as vertical furnace. Logger system Suitable for the verification of an error such as wafer breakage. Event Listings News Top AUTOMATION WORLD (AIMEX) 2015 AUTOMATION WORLD (AIMEX) 2015 Clean robot with batch end-effector for 5 pieces of wafer Logger system
../products/SSY-11010.html	und	1710468970	12725	https://www.jel-robot.com/products/SSY-11010.html	Products | SSY-11010(Automatic wafer transfer system for wafer container)	Products | SSY-11010(Automatic wafer transfer system for wafer container) Home 〉 Products 〉 〉 System SSY-11010 Automatic wafer transfer system for wafer container Product Video Usage Environment/Specifications Product Profile Product Model SSY-11010 Environment Clean room atmosphere Applicable Cassette Type 200 mm container, 200 mm wafer cassette Wafer Size 200 mm Carrying Object Silicon wafer, spacer (interlayer paper) Contact us for other wafer sizes, the number of wafer containers and cassettes, or aligner installation. Also contact us for wafer containers from any manufacturer. The image and video (*) above is of SSY-11010. (*) Also see the Introduction Video of Handling  for the details of this system. Characteristics High accuracy handling of thin wafer inside the wafer container and cassette. Equipped with mechanism of automatic lid opening/closing of the wafer container (Patent pending). Automatic recognition of wafer and the spacer (interlayer paper) in the wafer container. Automatic wafer transfer between the wafer container and the wafer cassette (package/unpackage). Available for thin wafer as equipped with Bernoulli end-effector. Automatic recognition of the height of wafer. The number of cassettes and the wafer sizes can be customized. Corresponding to the wafer container made by Achilles Corporation. Two fan filter units (HEPA) are installed to ensure the cleanliness. Color sensor allows spacers (interlayer papers) with different colors to be detected easily. Standard Specifications Contact us for other wafer sizes, the number of wafer containers and cassettes, or aligner installation etc. Carrying Object 200 mm silicon wafer, 200 mm spacer (interlayer paper) Applicable Cassette Type 200 mm wafer container, 200 mm cassette Cleanliness ISO Class 2 External Dimensions 1600 (W) x 1305 (D) x 1800 (H) (mm) Utility Power: AC200V±10%  Clean air: 0.5 MPa 150 NL/min or more Mass 700 kg Outline Drawing (Standard) Product Lineup Menu Prev Next Icon guide ...Atmosphere ...Vacuum ...Waterproof ...Thin wafer ...CE marking ...JEL's standard spec. ...KCs marking SSY-11010 Automatic wafer transfer system for wafer container SSY-11010
../news/topics2012.html	und	1710468669	9169	https://www.jel-robot.com/news/topics2012.html	News | Topics 2012	News | Topics 2012 Home  &gt;  News  &gt;  2012 News 2012 December 28, 2012 Products New Products SSY-11000 GTCR5365-420-AM STCR4160S-300-PM (Twin-arm clean robot with flip unit� SAL30J1 SAL3481ernoulli Type� August 30, 2012 Online Support We have posted the 窶廚ompound commands reference manual窶�, an elementary guide to compound commands. July 30, 2012 Server Maintenance Information JEL web and mail servers to undergo maintenance June 1, 2012 Company We have renewed our website. February 23, 2012 Online Support We have posted an announcement regarding our robots or aligners which install backup battery for absolute encoder. January 27, 2012 Products New Products SSY-10000 SSY-10020 SAL3261GR Bernoulli Type End-effector January 27, 2012 Services We have opened the Internet store, JEL STORE that sells our robot service parts.(For domestic only) Topic Listings News Top Products Support Maintenance Company News Support Support Service
../news/news20130401.html	und	1710468657	3979	https://www.jel-robot.com/news/news20130401.html	News | 20th Anniversary	News | 20th Anniversary Home  >  News  >  20th Anniversary 20th Anniversary Celebrating JEL Corporation窶冱 20th Anniversary News Topics 2014 2013 2012 2011 Event News 2014 2013 2012 2011 2010 2009 2008 20th Anniversary
../products/SART08604.html	und	1710468963	10873	https://www.jel-robot.com/products/SART08604.html	Products | SART08604 (Wrist-block unit with mapping sensor)	Products | SART08604 (Wrist-block unit with mapping sensor) Home  >  Products  >  縲� Others SART08604 Wrist-block unit with mapping sensor Usage Environment/Specifications Product Profile Model Name SART08604 Appropriate robot model STCR series Characteristics Designed for checking the wafer state in cassette. Also available for sorter system. Wrist-block unit with mapping sensor (*) for STCR series Standard end-effectors (6 types) are available for this wrist-block (refer to the following table). (*) Mapping sensor is to detect wafer presence and status in each cassette slot. Standard end-effectors available for the wrist-block Click the product image or name below to go to the product page. SC-IW-200 SC-IW-240 SC3-IW-240 SC-YW-227 SC-YW-200 3D-02229 Specifications Contact us for the detailed specifications. Product Lineup Menu Prev Next Icon guide ...Atmosphere ...Vacuum ...Waterproof ...Single arm ...Twin arm ...Thin wafer ...CE marking ...JEL's standard spec. ...KCs marking 
../news/event2024_02.html	und	1739930898	8945	https://www.jel-robot.com/news/event2024_02.html	News | SEMICON CHINA 2024	News | SEMICON CHINA 2024 Home  &gt;  News  &gt;  Event News  &gt;  SEMICON CHINA 2024 SEMICON CHINA 2024 Thank you very much for coming to our exhibition booth at SEMICON CHINA 2024. For more information on our products as well as the exhibited products below, please go to the product page or contact us . Date   March 20 to 22, 2024 Venue Shanghai New International Expo Centre (SNIEC), Shanghai Booth REJE: Hall N5-5483, SINTAIKE: Hall N3-3137 REJE booth & SINTAIKE booth in SEMICON CHINA 2024 Products for Exhibition ■SCR3160 (w/flip unit & slider) + 6 & 8 inch SMIF (REJE products) ■Vacuum robot: SVCR2260 ■SORTER SYSTE ■Horizontal and multi-joint type: GTFR5280 + Low-head type pre-aligner: SAL38C3HV Event Listings News Top SEMICON CHINA 2024 banner Our booth at SEMICON CHINA 2024
../products/handling_8.html	und	1710468953	5711	https://www.jel-robot.com/products/handling_8.html	Products | Introduction Video of Handling (Path Planning Handling)	Products | Introduction Video of Handling (Path Planning Handling) Home  >  Products  >  Introduction Video of Handling  >  Path Planning Handling Introduction Video of Handling Path Planning Handling STCR4160SN (Path planning of closed-loop control) : Path planning handling has joined the lineup of clean robot with the closed-loop control. Access to the chamber stage arranged in parallel without a track improves the flexibility in the layout design and the cost-performance. *Also available for single arm clean robot: SCR3160CSN (Path planning of closed-loop control) Video List Previous Video Next Video YouTube Official Channel
../news/event2008_02.html	und	1710468631	5116	https://www.jel-robot.com/news/event2008_02.html	News | Semicon Japan 2008	News | Semicon Japan 2008 Home  >  News  >  Event News  >  Semicon Japan 2008 Semicon Japan 2008 Thank you for coming Semicon Japan 2008. We exhibited our new products. For more product information, please go to the products page or contact us. Dates: DEC.3(Wed) - 5(Fri),2008 Venue: Makuhari Messe, Chiba Japan JEL Booth No.: 8 Hall, 8C-806 Products for Exhibition SORTER SYSTEM Single-Arm Clean Robot for 2-4inch wafer : New model Twin-Arm Clean Robot : New model Single-Arm, 4-Axis Horizontal and Multi-Joint Type Clean Robot : New model JEL challenge for 450mm / Single-Arm, 4-Axis Horizontal and Multi-Joint Type Clean Robot : New model Event Listings News Top SORTER SYSTEM Single-Arm Clean Robot for 2-4inch wafer : New model Twin-Arm Clean Robot : New model Single-Arm, 4-Axis Horizontal and Multi-Joint Type Clean Robot : New model JEL challenge for 450mm / Single-Arm, 4-Axis Horizontal and Multi-Joint Type Clean Robot : New model
../news/event2017_02.html	und	1710468644	5820	https://www.jel-robot.com/news/event2017_02.html	News | SEMICON CHINA 2017	News | SEMICON CHINA 2017 Home  >  News  >  Event News  >  SEMICON CHINA 2017 SEMICON CHINA 2017 Thank you for coming to SEMICON CHINA 2017. For more product information, please go to the products page or contact us. Date   March 14-16, 2017 Venue Shanghai New International Expo Centre (SNIEC), Shanghai Booth 1605 Products for Exhibition Automatic wafer transfer system for wafer container High accuracy handling of thin wafer inside the wafer container and cassette. GCR-AM with end-effectors with rotation function Rotation function on end-effector units shortens tact time. Tape frame handling robot Accessible to all slots in the cassette by random access with clip-type end-effector. New Aligner SAL3000HV Series (full auto-adjustment version) Self-adjustment aligner that allows alignment for various kinds of wafers. Downtime can be reduced significantly. Event Listings News Top SEMICON CHINA 2017 banner Our booth at SEMICON CHINA 2017 Automatic wafer transfer system for wafer container GCR-AM with end-effectors with rotation function Tape frame handling robot New Aligner SAL3000HV Series (full auto-adjustment version)
../news/event2017_04.html	und	1710468645	4699	https://www.jel-robot.com/news/event2017_04.html	News | OPTO Taiwan 2017	News | OPTO Taiwan 2017 Home  >  News  >  Event News  >  OPTO Taiwan 2017 OPTO Taiwan 2017 Thank you very much for coming to our agent's booth, Challentech International Corporation during the exhibition. For more information on our products, please go to the product page or contact us. Date   June 14-16, 2017 Venue TWTC Nangang Exhibition Hall, Taiwan Booth J912 Event Listings News Top OPTO Taiwan 2017 Our booth at OPTO Taiwan 2017
../support/man002/s001.html	und	1710469129	4814	https://www.jel-robot.com/support/man002/s001.html	Online Support | JELDATA3 Operation Manual | 6. File (Open)	Online Support | JELDATA3 Operation Manual | 6. File (Open) Home  >  Online Support  >  Wafer-Search Operation Procedure and Troubleshooting  >  JELDATA3 Operation Manual 縲� 6. File JELDATA3 Operation Manual 6. File 6.1 Open (Figure: 6-1) Designate a data file to read 窶廣 Data窶�, 窶廬 Data窶�, 窶廛 Data窶� or Parameter (if it is supported).� Figure: 6-1 �( Figure: 6-2 ) While reading the data, the progress is shown on the status bar. ! Caution If the reading file differs from the controller setting, a窶� file read error窶� occurs. Select the appropriate controller (robot selection) and execute 窶徨eading a file窶� again. (Figure: 6-2) Contents 竊殖ack Next竊�  Technical Information Open file location of files
../support/man002/m001.html	und	1710469127	4954	https://www.jel-robot.com/support/man002/m001.html	Online Support | JELDATA3 Operation Manual | 1. Software Outline	Online Support | JELDATA3 Operation Manual | 1. Software Outline Home  >  Online Support  >  Wafer-Search Operation Procedure and Troubleshooting  >  JELDATA3 Operation Manual 縲� 1. Software Outline JELDATA3 Operation Manual 1. Software Outline This software is used for data communication with JEL controller through RS232C. This software supports 窶廣 Data窶� (point data), 窶廬 Data窶� (compound command), 窶廛 Data窶� (speed data) and Parameters. The main functions of this software are described below. Data receive function Receive data from controller and save to the personal computer (PC). Data sending function Send saved data or edited data from PC to the controller. Data comparing function Compare saved data in PC with data in the controller. Data overwrite function Data that is sent from PC can be saved (overwrite) in the controller. Communication function Communication between PC and the controller can be executed by command input. By using the data receive/sending functions, copy data inside a controller to another controller. Contents 竊誰ext  Technical Information 
../news/news20220713.html	und	1710468667	3500	https://www.jel-robot.com/news/news20220713.html	News | Summer Holiday Information 2022	News | Summer Holiday Information 2022 Home  &gt;  News  &gt;  Summer Holiday Information Summer Holiday Information JEL will be closed for summer holiday from August 13th to August 15th, 2022 (Japan Time). In case of emergency, please contact us at the following e-mail address: 
../products/JCR.html	und	1710468954	16669	https://www.jel-robot.com/products/JCR.html	Products | JCR4400 (Transfer Robot with Auto alignment for PLP) | Wafer Transfer Atmospheric Robot	Products | JCR4400 (Transfer Robot with Auto alignment for PLP) | Wafer Transfer Atmospheric Robot Home 縲� Products 縲� 縲� Robot for Semiconductor JCR4400 (Transfer Robot with Auto alignment for PLP) Product Video Usage Environment/Specifications Product Profile Model Name JCR4400 Environment Clean room atmosphere Arm Single arm Operating Range 1290 mm (robot center to substrate center) Vertical Stroke 400 mm Payload Capacity 10 kg (calculated for the arm 3rd joint) List of Product Model Product Model Vertical Stroke JCR4400-400-AM 400 mm The image above and the video are of JCR4400-400-AM (Transfer Robot with Auto alignment for PLP). Characteristics 4-axis horizontal and multi-joint type clean robot with auto alignment for PLP. Suitable for access to the parallel layout Transfer with high accuracy by non-contact alignment Maximum payload capacity of 10 kg Standard Specifications Standard specifications with JCR4400-400-AM (Transfer Robot with Auto alignment for PLP) Specifications of Robot Robot Model JCR4400-400-AM Carrying Object Substrate 500 mm x 500 mm Substrate Holding Method By vacuum suction with end-effector Robot Model Type Horizontal and multi-joint type Control Axis 4-axis Motor Type AC servo motor Operating Range From robot center to wafer center Rotation Angle (Theta-axis) Vertical Stroke (Z-axis) 1290 mm 330 deg 400 mm Carrying Speed Arm (R-axis) Rotation Angle (Theta-axis) Vertical Stroke (Z-axis) 1170 mm/1.6 sec 330 deg/1.5 sec 400 mm/1.4 sec Resolution 1st Joint Axis (J1 axis) 2nd Joint Axis (J2 axis) 3rd Joint Axis (J3 axis) 3.5x10 -3 deg 1.8x10 -3 deg 1.8x10 -3 deg Z-axis (J4 axis)   2.4x10 -3 deg   Repeatability Within ±0.2 mm Cleanliness Robot main body: 0.3 µm/cf Class 10 (when exhausting driving area) Utility Power: AC200V Single phase ±10% 4 kVA Vacuum: -53 kPa or more Mass Robot main body: Approx. 120 kg Specifications of Controller Controller Model C5000S series Interface RS232C and parallel photo I/O Outline Drawing (Standard) Product Lineup Menu Prev Next Icon guide ...Atmosphere ...Vacuum ...Waterproof ...Single arm ...Twin arm ...Thin wafer ...CE marking ...JEL's standard spec. ...KCs marking JCR4400 (Transfer Robot with Auto alignment for PLP) JCR4400-400-AM
../news/event2023.html	und	1710468653	6653	https://www.jel-robot.com/news/event2023.html	News | Event News 2023	News | Event News 2023 Home  &gt;  News  &gt;  Event News  &gt;  2023 Event News 2023 SEMICON JAPAN 2023 Date: December 13 to 15, 2023 Major exhibits SSY -System with マ�200緕� SMIF POD- SAL-HV -High accuracy pre-aligner- STVCR -Vacuum robot with wafer alignment function- STCR -TAIKO邃「 and thin wafer handling robot- 縲�縲�"TAIKO邃「" is a trademark or registered trademark of DISCO Corporation.  Click here for details.   SEMICON EUROPA 2023 Date: November 14 to 17, 2023 Major exhibits 6 & 8 inch Twin-arm robot + pre-aligner(edge-grip) 8 inch Twin-arm robot(with flip unit) + pre-aligner(Bernoulli type)  Click here for details.   SEMICON TAIWAN 2023 Date: September 06 to 08, 2023 Major exhibits GTFR for 300 mm wafers Vacuum robot SVCR Automatic wafer transfer system for wafer container SSY SAL-HV for 300 mm wafers  Click here for details.   SEMICON CHINA 2023 Date: June 29 to July 01, 2023 Major exhibits SCR3160 with flip unit鬼MIF(ReJe products) Vacuum robot SVCR2260 EFEM(STCR4200[path-planning type]鬼AL38C3HV記/P(TDK)  Click here for details.   SEMICON KOREA 2023 Date: February 01 to 03, 2023 Major exhibits GTFR for 300 mm wafers SAL-HV for 300 mm wafers Bernoulli type end-effector for 200 mm, 300 mm wafers  Click here for details.   Event Listings News Top 
../news/event2024_04.html	und	1731655048	8139	https://www.jel-robot.com/news/event2024_04.html	News | SEMICON EUROPA 2024	News | SEMICON EUROPA 2024 Home  &gt;  News  &gt;  Event News  &gt;  SEMICON EUROPA 2024 SEMICON EUROPA 2024 Thank you very much for coming to AES motomation GmbH exhibition booth at SEMICON EUROPA 2024. For more information on our products as well as the exhibited products below, please go to the product page or contact us . Date   November 12 to 15, 2024 Venue Messe München, Germany Booth Hall C1-C1364 SEMICON EUROPA 2024 Event Listings News Top SEMICON EUROPA 2024 banner Our booth at SEMICON EUROPA 2024
../news/news20120731.html	und	1710468656	4450	https://www.jel-robot.com/news/news20120731.html	News | Server Maintenance Information	News | Server Maintenance Information Home  >  News  >  Server Maintenance Information Server Maintenance Information JEL web and mail servers to undergo maintenance: JEL will undergo our web and mail server maintenance during the following period. Please note that there could be a delay in the delivery of e-mails to our domainel-robot.co.jp) or the website could be unavailable. Maintenance schedule Sunday, August 12, 2012 From 11:00 AM to 13:00 PMapan Time� Thank you for your understanding and cooperation in the matter. News Topics 2014 2013 2012 2011 Event News 2014 2013 2012 2011 2010 2009 2008 
../products/index.html	und	1710468954	5632	https://www.jel-robot.com/products/index.html	Products Top | Wafer Handling Robot for Semiconductor Manufacturing	Products Top | Wafer Handling Robot for Semiconductor Manufacturing Home  >  Products Products Robot for Semiconductor Aligner Robot for FPD System Bernoulli Hand End-Effector Robot for Petri Dish/Microplate Product News 3D CAD Drawings Contact Us Technical Information 
../products/SAL2061_a.html	und	1710468961	10632	https://www.jel-robot.com/products/SAL2061_a.html	Products | SAL2061 (Edge-grip type)	Products | SAL2061 (Edge-grip type) Home 〉 Products 〉 〉 Aligner SAL2061 (Edge-grip type) Wafer Aligner Product Video Usage Environment/Specifications Product Profile Product Model SAL2061 Environment Clean room atmosphere Wafer Size 150 mm Carrying Object Silicon wafer The image above and the video are of SAL20C1. Characteristics Designed for aligning wafers in a production line or inspection line of semiconductor. Minimized footprint and designed for aligning small wafer. High-speed, high-accuracy centering and flat/notch locating of small wafer. Standard Specifications Carrying Object JEIDA standard 150 mm silicon wafer Positioning Accuracy Centering: Within ±0.3 mm Orientation flat locating: Within ±0.2 deg Positioning Time Orientation flat search: Within 4 sec (Wafer pick-up/placing time excluded) Sensor Red LED transmissive sensor Wafer Holding Method By edge grip Cleanliness 0.1 µm/cf Class 1 (at wafer transfer level when exhausting driving part) Driving method Small size stepping motors at each axis (internal motor driver) Utility Power: DC24V±10% 2A Product Lineup Menu Prev Next Icon guide ...Atmosphere ...Vacuum ...Waterproof ...Thin wafer ...CE marking ...JEL's standard spec. ...KCs marking SAL20C1
../news/event2021.html	und	1710468651	6054	https://www.jel-robot.com/news/event2021.html	News | Event News 2021	News | Event News 2021 Home  &gt;  News  &gt;  Event News  &gt;  2021 Event News 2021 SEMICON TAIWAN 2021 Date: December 28 to 30, 2021 Major exhibits GTFR for 300 mm wafers Low head SAL-HV for 300 mm wafers KHR for 25 wafers batch transfer (300 mm wafers) STCR for 150 or 200 mm chemical compound wafer SAL for 150 or 200 mm chemical compound wafer MTCR for tape frame for 300 mm wafers  Click here for details.   SEMICON JAPAN 2021 HYBRID Date: December 15 to 17, 2021 Major exhibits GTFR for 300 mm wafers Low head SAL-HV for 300 mm wafers KHR for 25 wafers batch transfer (300 mm wafers) STCR for 150 or 200 mm chemical compound wafer SAL for 150 or 200 mm chemical compound wafer MTCR for tape frame for 300 mm wafers  Click here for details.   SEMICON CHINA 2021 Date: March 17 to 19, 2021  Click here for details.   Event Listings News Top